Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of hermetically sealed glass surface-mounted package; 2 connectors SOD80C 4.55 4.30 2.30 2.25 1.70 1.60 0.90 2x solder land solder land plus solder paste solder paste deposit solder resist
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OD80C
sod080c
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of LFBGA170 package SOT1315-1 Hx P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X Dimensions in mm
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LFBGA170
OT1315-1
sot1315-1
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X
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LFBGA267
OT1332-1
sot1332-1
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sod962
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962 0.85 0.4 0.4 R0.025 8x 0.22 (2×) 0.12 (2×) 0.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist
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OD962
sod962
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1192-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 www.nxp.com r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area
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OT1192-1
sot1192-1
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HXQFN60 package SOT1134-2 4.25 0.5 0.3 0.3 3.9 2.55 0.35 5.2 5.8 6.25 1.1 0.45 1.1 1.9 solder land solder paste deposit 125 mm stencil solder land plus solder paste occupied area solder resist
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HXQFN60
OT1134-2
sot1134-2
Publicat35
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of TFBGA208 package SOT950-1 Hx P P Hy 0.475 see detail X solder land CL solder paste deposit SR CU solder land plus solder paste SP occupied area solder resist detail X Dimensions in mm
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TFBGA208
OT950-1
sot950-1
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sod323 reflow
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD323 3.05 2.1 0.5 2x 1.65 0.95 0.6 (2×) 2.2 0.5 (2×) 0.6 (2×) solder land solder land plus solder paste solder paste deposit solder resist
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OD323
sod323
sod323 reflow
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SOT-457
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of TSOP6 package SOT457 3.45 1.95 0.45 0.55 6x (6×) 0.95 3.3 2.825 0.95 0.7 (6×) 0.8 (6×) 2.4 solder land solder land plus solder paste solder paste deposit solder resist occupied area
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OT457
sot457
liceSOT457
SOT-457
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small package; 2 terminals SOD962-2 0.85 0.4 0.4 R0.025 8x 0.22 (2×) 0.12 (2×) 0.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist
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OD962-2
sod962-2
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SOD123W
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD123W 4.4 2.9 2.8 1.1 1.2 2x (2×) 2.1 1.6 1.1 (2×) 1.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist
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OD123W
sod123w
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SOD128
Abstract: SOD-128
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD128 6.2 4.4 4.2 1.9 2.1 2x (2×) 3.4 2.5 1.2 (2×) 1.4 (2×) solder land solder land plus solder paste solder paste deposit solder resist
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OD128
sod128
SOD-128
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SOD123F footprint
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD123F 4.4 2.9 2.8 1.1 1.2 2x (2×) 2.1 1.6 1.1 (2×) 1.2 (2×) solder land solder land plus solder paste solder paste deposit solder resist
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OD123F
sod123f
SOD123F footprint
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT323 2.65 1.85 1.325 2 2.35 3 0.6 3x 1.3 1 0.5 (3×) 0.55 (3×) solder land solder land plus solder paste solder paste deposit solder resist
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OT323
sot323
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SOD523 footprint
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD523 2.15 1.4 0.5 0.6 2x (2×) 1.2 0.4 (2×) 0.5 (2×) solder land solder land plus solder paste solder paste deposit solder resist occupied area
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OD523
sod523
SOD523 footprint
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of HXSON4 package SOT1194-1 1.2 1.15 0.65 0.25 0.48 45° 1.55 0.5 1.2 1.3 0.025 0.48 r= 0.05 solder land solder land plus solder paste solder paste deposit solder resist occupied area Dimensions in mm
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OT1194-1
sot1194-1
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted, 2 leads package SOD323F 3.05 2.2 2.1 0.5 2x 1.65 0.95 0.6 (2×) 0.5 (2×) 0.6 (2×) solder land solder land plus solder paste solder paste deposit solder resist
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OD323F
sod323f
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of DFN1608D-2 package SOD1608 1.15 0.75 1.05 0.65 0.95 0.55 0.9 0.8 0.7 0.7 0.8 0.9 1 2 0.1 1.8 0.2 1.9 2.0 solder land solder land plus solder paste solder paste deposit solder resist Dimensions in mm
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DFN1608D-2
OD1608
sod1608
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1049-3 Hx Gx pa + oa 2.000 P 0.500 D 9x 0.0125 0.0125 Hy Gy pa + oa By Ay Bx D1 Ax solder land solder paste deposit solder land plus solder paste occupied area solder resist
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XQFN10
OT1049-3
sot1049-3
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of leadless ultra small plastic package; 3 solder lands SOT883 1.3 0.7 R0.05 12x 0.9 0.6 0.7 0.25 (2×) 0.3 (2×) 0.3 0.4 (2×) 0.4 solder land solder land plus solder paste solder paste deposit
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OT883
sot883
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of plastic surface-mounted package; 3 leads SOT23 3.3 2.9 1.9 3 0.6 3x 0.7 (3×) solder land solder paste deposit 0.5 (3×) solder land plus solder paste 0.6 (3×) solder resist 1 occupied area
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sot023
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Untitled
Abstract: No abstract text available
Text: Reflow soldering footprint Footprint information for reflow soldering of SOD923 package SOD923 1.4 0.9 0.9 0.4 2x 0.3 (2×) 0.3 (2×) 0.5 (2×) 0.2 (2×) 0.4 (2×) solder land solder land plus solder paste solder paste deposit solder resist occupied area
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OD923
OD923
sod923
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Untitled
Abstract: No abstract text available
Text: HIGH DENSITY PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints * Insures a reliable solder joint by prc ing an exact amount of solder 9 Eliminates the need for solder paste
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18x18
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Robinson Nugent
Abstract: Robinson Nugent pga 18x18 Nugent
Text: HIGH DENSITY_ PGA Sockets with Solder Preforms PGA Series * Provides an excellent cost effective method for applying solder to inaccessible joints 9 Insures a reliable solder joint by provid ing an exact amount of solder * Eliminates the need for solder paste and
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13x13
18x18
Robinson Nugent
Robinson Nugent pga
Nugent
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