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    SOT108 Price and Stock

    Nexperia

    Nexperia 74HC14D,653

    Inverters SOT108-1 INVERTERS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC14D,653 Reel 2,247,500 2,500
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    • 10000 $0.071
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    Nexperia 74HC4066D,653

    Analog Switch ICs ANALOG SWITCH ICS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC4066D,653 Reel 217,500 2,500
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    • 10000 $0.078
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    Nexperia 74HC74D,653

    Flip Flops SOT108-1 DUAL D-TYPE FLIPFLOP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC74D,653 Reel 200,000 2,500
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    Nexperia 74HC08D,653

    Logic Gates SOT108-1 QUAD 2-INPUT AND GT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC08D,653 Reel 35,000 2,500
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    Nexperia 74HC132D,653

    Logic Gates SOT108-1 QUAD 2-INPUT NAND
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74HC132D,653 Reel 32,500 2,500
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    Find more SOT108 price and stock on Findchips.com

    SOT108 Datasheets (21)

    Part
    ECAD Model
    Manufacturer
    Description
    Curated
    Datasheet Type
    PDF
    SOT1080-1 NXP Semiconductors Plastic thermal enhanced ultra thin quad flat package; no leads; 24 terminals; UTLP based; body 3 x 3 x 0.55 mm Original PDF
    SOT108-1 Philips Semiconductors Original PDF
    SOT1081-1 NXP Semiconductors Footprint for reflow soldering SOT1081-1 Original PDF
    SOT1081-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 1.7 x 0.5 mm Original PDF
    SOT1081-1_115 NXP Semiconductors Product orientation 12NC ending 115 Original PDF
    SOT108-1_118 NXP Semiconductors SO14; Reel pack; SMD, 13"Q1/T1 Standard product orientation Orderable part number ending ,1 Original PDF
    SOT1081-2 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals Original PDF
    SOT108-2 NXP Semiconductors Plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm Original PDF
    SOT1082-1 NXP Semiconductors Plastic very thin small outline package; no leads; 6 terminals; UTLP based Original PDF
    SOT1085-1 NXP Semiconductors Footprint for reflow soldering SOT1085-1 Original PDF
    SOT1085-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 273 balls Original PDF
    SOT1086-1 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 14 terminals; body 3 x 4.5 x 0.85 mm Original PDF
    SOT1086-2 NXP Semiconductors Plastic, thermal enhanced very thin small outline package; no leads; 14 terminals Original PDF
    SOT1086-2 NXP Semiconductors Footprint for reflow soldering SOT1086-2 Original PDF
    SOT1086-2_118 NXP Semiconductors HVSON14; reel pack; SMD; 13"; Standard product orientation; Orderable part number ending, 118 or J; Orderable code (12NC) ending 118 Original PDF
    SOT1086-3 NXP Semiconductors Footprint for reflow soldering SOT1086-3 Original PDF
    SOT1087-1 NXP Semiconductors Footprint for reflow soldering SOT1087-1 Original PDF
    SOT1088-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 520 balls; heatsink Original PDF
    SOT1088-1 NXP Semiconductors Footprint for reflow soldering SOT1088-1 Original PDF
    SOT1089 NXP Semiconductors Footprint for reflow soldering SOT1089 Original PDF

    SOT108 Datasheets Context Search

    Catalog Datasheet
    Type
    Document Tags
    PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of XSON10U package SOT1081-1 Hx C Hy Ay By 0.05 D P 0.05 Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		XSON10U OT1081-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: SOT1081-1 Product orientation 12NC ending 115 Rev. 02 — 27 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT1081-1 115 180 x 8


    Original     		OT1081-1 OT1081-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HUQFN24U: plastic thermal enhanced ultra thin quad flat package; no leads; 24 terminals; UTLP based; body 3 x 3 x 0.55 mm A B D SOT1080-1 terminal 1 index area E A A1 detail X e1 v w C A B C M M v w b M M C A B C C D2 y y1 C e L1 A6 D3 A10


    Original     		HUQFN24U: OT1080-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 SO 1 SOT108-1 SO14; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 4 — 8 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


    Original     		OT108-1 001aak603 OT108-1 PDF

    855E

    Abstract: MS-012-AB
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		OT108-1 OT108-1 076E06S MS-012AB 855E MS-012-AB PDF

    076E06

    Abstract: No abstract text available
    Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		OT108-1 076E06 MS-012 076E06 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of XSON8 package 0.15 8x SOT1089 0.25 (8×) 0.5 (8×) 0.7 1.4 0.6 (8×) Dimensions in mm solder paste = solder land 0.35 (3×) 1.4 solder resist occupied area www.nxp.com 2009 NXP B.V.


    Original     		OT1089 sot1089 under15 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT108-2 A X c y HE v M A Z 8 14 A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		OT108-2 MS-012 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVSON14: plastic thermal enhanced very thin small outline package; no leads 14 terminals; body 3 x 4.5 x 0.85 mm SOT1086-1 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e v w b 1 7 M M C C A B C y y1 C L Eh 14 8 Dh


    Original     		HVSON14: OT1086-1 MO-229 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON14 package SOT1086-2 Gx D P C nSPx Hy Gy SPx SPy tot SPy nSPy 1.05 SLy By Ay SPx tot X 3.65 SLx solder land 0.6 solder paste deposit 0.3 solder land plus solder paste detail X occupied area


    Original     		HVSON14 OT1086-2 sot1086-2 PDF

    HEF4052B-Q100

    Abstract: 74AHC1G09-Q100 NPIC6C596-Q100 NPIC6C595-Q100
    Text: Automotive Innovative package options Suffix BQ PW D PW BQ PW GW GM SOT763-1 SOT403-1 SOT108-1 SOT402-1 SOT764-1 SOT360-1 SOT363 SOT886 16-pin 16-pin 14-pin 14-pin 20-pin 20-pin 6-pin 6-pin Width mm 2.50 6.40 6.00 6.40 2.50 6.40 2.10 1.00 Length (mm) 3.50


    Original     		OT763-1 OT403-1 OT108-1 OT402-1 OT764-1 OT360-1 OT363 OT886 16-pin HEF4052B-Q100 74AHC1G09-Q100 NPIC6C596-Q100 NPIC6C595-Q100 PDF

    SO14 data sheet

    Abstract: No abstract text available
    Text: PDF: 2001 May 30 Philips Semiconductors Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm D E SOT108-2 A X c y HE v M A Z 8 14 A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		OT108-2 MS-012 SO14 data sheet PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA273: plastic low profile fine-pitch ball grid array package; 273 balls A B D SOT1085-1 ball A1 index area E A A2 A1 detail X e1 C ∅v ∅w b e W V U T R P N M L K J H G F E D C B A ball A1 index area M M C A B C y y1 C e e2 1 2 3 4 5


    Original     		LFBGA273: OT1085-1 MO-195 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline VSON6U: plastic very thin small outline package; no leads; 6 terminals; UTLP based; body 2.3 x 3.5 x 0.90 mm SOT1082-1 A B D E A A1 terminal 1 index area detail X e1 1/2 e e L1 v w b 1 2 3 C C A B C y y1 C L e2 6 5 metal area must not be soldered


    Original     		OT1082-1 sot1082-1 PDF

    SOT108-1

    Abstract: NXP 12NC ending
    Text: SOT108-1 Standard product orientation 12NC ending 118 Rev. 01 — 30 June 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT108-1 118 330 x 16.40


    Original     		OT108-1 OT108-1 30-june- SOT108-1 NXP 12NC ending PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of VFBGA100 package SOT1087-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		VFBGA100 OT1087-1 OT1087-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: +9 62 1  SOT1086-2 HVSON14; Reel pack; SMD, 13"; standard product orientation Orderable part number ending, 118 or J Ordering code 12NC ending 118 Rev. 2 — 21 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


    Original     		OT1086-2 HVSON14; 001aak603 OT1086-2 PDF

    CDIP14

    Abstract: cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14
    Text: INTEGRATED CIRCUITS DATA SHEET Package outlines Package information January 1995 File under Integrated Circuits, IC04 Philips Semiconductors Package information Package outlines INDEX PACKAGE VERSIONS DESCRIPTION PAGE SO SOT108-1 plastic small outline package; 14 leads; body width 3.9 mm


    Original     		OT108-1 OT109-1 OT162-1 OT163-1 OT137-1 OT136-1 OT337-1 CDIP24; OT94-1) MBB910 CDIP14 cdip28 SSOP20 300 mil MS-012AB MS-012AC SO20 sot73-1 sot94 150AH CDIP-14 PDF

    SO14 SOT108-1

    Abstract: MS-012 Package MS012
    Text: PDF: 2000 Jan 04 Philips Semiconductors Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm SOT108-1 D E A X c y HE v M A Z 8 14 Q A2 A A 3 A1 pin 1 index θ Lp 1 L 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (inch dimensions are derived from the original mm dimensions)


    Original     		OT108-1 076E06 MS-012 SO14 SOT108-1 MS-012 Package MS012 PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVSON14 package SOT1086-3 Gx D 0.105 P C SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Generic footprint pattern Refer to the package outline drawing for actual layout solder land


    Original     		HVSON14 OT1086-3 sot1086-3 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of HBGA520 package SOT1088-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		HBGA520 OT1088-1 OT1088-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA520: plastic thermal enhanced ball grid array package; 520 balls; heatsink SOT1088-1 B D A D1 ball A1 index area A j A2 E1 E A1 detail X C e1 e AF AD AB Y V AE AC AA e W heatsink U T R P e2 N M L K 1/2 e J H G F E D C B A 1 shape 2 optional 4x


    Original     		HBGA520: OT1088-1 MS-034 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline XSON10U: plastic extremely thin small outline package; no leads; 10 terminals; UTLP based; body 1 x 1.7 x 0.5 mm A B D SOT1081-1 E A A1 terminal 1 index area detail X e1 C e L1 v w b 1 5 C A B C M M y1 C y L2 e2 L 10 6 0.5 1 mm scale DIMENSIONS mm are the original dimensions


    Original     		XSON10U: OT1081-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Philips Semiconductors Product specification Hex inverter TYPE 74ALS04B TYPICAL PROPAGATION DELAY TYPICAL SUPPLY CURRENT TOTAL 3.5ns 2.0mA 74ALS04B PIN CONFIGURATION DRAWING NUMBER 14-pin plastic DIP 74ALS04BN SOT27-1 14-pin plastic SO 74ALS04BD SOT108-1


    OCR Scan     		74ALS04B 74ALS04BN 74ALS04BD 74ALS04BDB SF00011 14-pin OT27-1 PDF