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    SOT1263 Search Results

    SOT1263 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1263 NXP Semiconductors Reflow soldering footprint SOT1263 Original PDF
    SOT1263 NXP Semiconductors Microlead ultra small surface-mounted plastic package; 3 leads Original PDF

    SOT1263 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of SOT1263 package SOT1263 1.4 0.9 0.9 0.5 0.4 0.3 2x (2×) (2×) 0.375 0.15 (2×) 0.2 0.25 (2×) 0.3 0.35 (2×) 0.4 0.45 solder land solder land plus solder paste solder paste deposit


    Original     		OT1263 OT1263 sot1263 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline Microlead ultra small surface-mounted plastic package; 3 leads SOT1263 I A c L HE D B A 1 3 e b 2 E bp 0.08 A B 0.08 A B 0.5 Dimensions Unit 1 mm scale A 1 b bp c D E e HE L I max 0.40 0.28 0.20 0.17 0.85 0.65 0.40 1.05 0.15 0.20 nom 0.37 0.22 0.15 0.12 0.80 0.60


    Original     		OT1263 sot1263 PDF