Untitled
Abstract: No abstract text available
Text: Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT391A D A F 3 D1 U1 B q c C 1 H p U2 A 2 E1 E w1 M A M B M w2 M C M b 5 Q 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT A b c mm 5.21 4.45
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OT391A
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date sheet of B.A
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline Flangeless ceramic package; 2 leads SOT391B D A c 1 L 5 10 mm scale E L 2 b OUTLINE VERSION SOT391B UNIT A b c mm 4.09 3.02 5.85 5.58 0.16 0.10 D E 11.54 10.93 10.51 9.90 L Q 2.79 2.29 1.02 0.76 Q REFERENCES
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OT391B
date sheet of B.A
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Untitled
Abstract: No abstract text available
Text: Package outline Flangeless ceramic package; 2 leads SOT391B D A c 1 L 5 10 mm scale E L 2 b OUTLINE VERSION SOT391B www.nxp.com UNIT A b c mm 4.09 3.02 5.85 5.58 0.16 0.10 D E 11.54 10.93 10.51 9.90 L Q 2.79 2.29 1.02 0.76 Q REFERENCES IEC DIMENSIONS millimetre dimensions are derived
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OT391B
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sot391c
Abstract: No abstract text available
Text: PDF: 1999 Dec 08 Philips Semiconductors Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT391C D A F 3 D1 U1 B q c C 1 H p U2 A E1 E w1 M A M B M 2 w2 M C M b 5 Q 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions
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OT391C
sot391c
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sot391a
Abstract: No abstract text available
Text: PDF: 2000 Nov 01 Philips Semiconductors Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT391A D A F 3 D1 U1 B q c C 1 H p U2 A 2 E1 E w1 M A M B M w2 M C M b 5 Q 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions
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OT391A
sot391a
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Untitled
Abstract: No abstract text available
Text: Package outline Flanged ceramic package; 2 mounting holes; 2 leads SOT391C D A F 3 D1 U1 B q c C 1 H p U2 A E1 E w1 M A M B M 2 w2 M C M b 5 Q 10 mm scale DIMENSIONS millimetre dimensions are derived from the original inch dimensions UNIT A b c mm 5.21 4.45
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OT391C
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SOT96
Abstract: No abstract text available
Text: SO 8 SOT96-1 Tape reel SMD; standard product orientation 12NC ending 115 Rev. 1 — 23 November 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal
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OT96-1
msc074
OT96-1
SOT96
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865 RF transistor
Abstract: RF Transistor reference "RF Power Modules" microwave transistor 03 Power Transistor MS-012AA SOT391A EU2A sot147a 1117 sot223
Text: DISCRETE SEMICONDUCTORS DATA SHEET Package outlines RF & Microwave Power Transistors and RF Power Modules 1998 Feb 17 File under Discrete Semiconductors, SC19a Philips Semiconductors RF & Microwave Power Transistors and RF Power Modules Package outlines SO8: plastic small outline package; 8 leads; body width 3.9 mm
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SC19a
OT96-1
OT502A
865 RF transistor
RF Transistor reference
"RF Power Modules"
microwave transistor 03
Power Transistor
MS-012AA
SOT391A
EU2A
sot147a
1117 sot223
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TRANSISTOR SMD MARKING CODE NM
Abstract: philips capacitor part numbering system SOT123 transistor marking 04 smd-transistor DATA BOOK TRANSISTOR SMD MARKING CODE KF TRANSISTOR SMD MARKING CODE wps DIODE marking EG 83A 2N2219 JANTX sot391 small signal transistor marking codes
Text: DISCRETE SEMICONDUCTORS General 2000 Feb 29 Philips Semiconductors General QUALITY By means of failure-mode-and-effect analysis the critical parameters of a process are identified. Procedures are then laid down to ensure the highest level of performance for these parameters. The capability of process steps is
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MC3403
2N2219
1N4148
MBC775
TRANSISTOR SMD MARKING CODE NM
philips capacitor part numbering system
SOT123 transistor marking 04
smd-transistor DATA BOOK
TRANSISTOR SMD MARKING CODE KF
TRANSISTOR SMD MARKING CODE wps
DIODE marking EG 83A
2N2219 JANTX
sot391
small signal transistor marking codes
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Untitled
Abstract: No abstract text available
Text: PA K SOT1023 LF LFPAK; Power-SO8; Tape reel; standard product orientation 12NC ending 115 Rev. 1 — 26 September 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel
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OT1023
001aak291
OT1023
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Untitled
Abstract: No abstract text available
Text: SO 20 SOT163-1 Tape reel SMD; standard product orientation 12NC ending 115 Rev. 1 — 25 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal
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OT163-1
msc074
OT163-1
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SOT333
Abstract: SOT423 sot468 thermal compound wps II TO metal package aluminum kovar SOT439 Transistor Packages sot262 SOT443 rf transistor smd pages
Text: Philips Semiconductors RF transmitting transistor and power amplifier fundamentals 4 RF and microwave transistor packages RF AND MICROWAVE TRANSISTOR PACKAGES handbook, halfpage The packages of electronic devices are, in general, designed to: metal cap – Protect the electronics from mechanical damage
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RF Power Transistors
Abstract: sot172a MM 4054 mba512 sot123 FO-83A philips rf transistors sot172 sot268
Text: DISCRETE SEMICONDUCTORS DATA SHEET Package outlines RF Power Transistors for UHF 1996 Feb 20 File under Discrete Semiconductors, SC08b Philips Semiconductors RF Power Transistors for UHF Package outlines 8.0 0.1 Al 2 O3 0.125 seating plane 3 BeO 5.30 max 4.0
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SC08b
MBC887
FO-45.
OT96-1
076E03S
MS-012AA
RF Power Transistors
sot172a
MM 4054
mba512
sot123
FO-83A
philips rf transistors
sot172
sot268
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sot333
Abstract: sot390
Text: Philips Semiconductors General QUALITY Product conformance Total Quality Management The assurance of product conformance is an integral part of our quality assurance QA practice. This is achieved by: Philips Semiconductors is a Quality Company, renowned
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QS9000
sot333
sot390
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B 315 D
Abstract: SOT89 pq SOT494 SOD89 SOT233 SOT89 Package pq TRANSISTOR SMD CODE PACKAGE SOT89 TRANSISTOR SMD CODE PACKAGE SOT89 4 250 B 340 smd Transistor msc377
Text: CHAPTER 6 PACKING METHODS page Introduction 6-2 Glossary of terms 6-2 Packing methods in exploded view 6-3 Packing quantities, box dimensions and carrier shapes 6 - 13 Philips Semiconductors Discrete Semiconductor Packages Packing Methods Chapter 6 INTRODUCTION
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OT195
OT223
MSC078
B 315 D
SOT89 pq
SOT494
SOD89
SOT233
SOT89 Package pq
TRANSISTOR SMD CODE PACKAGE SOT89
TRANSISTOR SMD CODE PACKAGE SOT89 4
250 B 340 smd Transistor
msc377
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TRANSISTOR SMD CODE PACKAGE SOT89 52 10A
Abstract: smd transistor g1-L philips ic06 cmos databook Soldering guidelines and SMD footprint design MSB430 Philips Components, Soft Ferrites Data Handbook M display dc05 humidity sensor philips H1 soft ferrites philips handbook Philips Components, Soft Ferrites Data Handbook
Text: SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
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smd-transistor DATA BOOK
Abstract: smd TRANSISTOR code marking sot423 TRANSISTOR SMD MARKING CODE NM emulsion paint thermal compound wps II TRANSISTOR SMD MARKING CODE KF TRANSISTOR SMD MARKING CODE QA transistor SMD MARKING CODE HF PHILIPS WIDEBAND HYBRID IC MODULES FO-83A
Text: DISCRETE SEMICONDUCTORS General Supersedes data of 1998 Jul 30 2000 Mar 02 Philips Semiconductors General QUALITY By means of failure-mode-and-effect analysis the critical parameters of a process are identified. Procedures are then laid down to ensure the highest level of performance
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MC3403
2N2219
1N4148
MBC775
smd-transistor DATA BOOK
smd TRANSISTOR code marking sot423
TRANSISTOR SMD MARKING CODE NM
emulsion paint
thermal compound wps II
TRANSISTOR SMD MARKING CODE KF
TRANSISTOR SMD MARKING CODE QA
transistor SMD MARKING CODE HF
PHILIPS WIDEBAND HYBRID IC MODULES
FO-83A
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za sot353
Abstract: M3D423 sot440 SOT195 M3D452 SOD70 package semiconductor packages semiconductors CROSS-REFERENCE Chapter 8 Philips SOD-61A
Text: SC18_1999_.book : SC18_PACKAGE_OVERVIEW_1999_1.copy 1 Wed May 12 11:40:55 1999 CHAPTER 1 PACKAGE OVERVIEW SC18_1999_.book : SC18_PACKAGE_OVERVIEW_1999_1.copy Philips Semiconductors 2 Wed May 12 11:40:55 1999 Discrete Semiconductor Packages Package overview
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M3D176
SC-88
SC-88A
SC-89
OT128B
OT346
OT143R
OT428
OT186
OT323
za sot353
M3D423
sot440
SOT195
M3D452
SOD70 package
semiconductor packages
semiconductors CROSS-REFERENCE
Chapter 8 Philips
SOD-61A
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TDA8559
Abstract: TDA8559T sot39 assemble stereo amplifier AN01026
Text: TDA8559T Low-voltage stereo headphone amplifier Rev. 03 — 15 May 2006 Product data sheets 1. General description The TDA8559T is a stereo amplifier that operates over a wide supply voltage range from 1.9 V to 30 V and consumes a very low quiescent current. This makes it suitable for
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TDA8559T
TDA8559T
TDA8559
sot39
assemble stereo amplifier
AN01026
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w2 mark 5 pin mosfet smd
Abstract: Philips SC07 Small-signal Transistors transistor bf 175
Text: For an update of this information, please go to the package website. SC18_1999_.book : SC18_PREFACE_1999 i Wed May 12 11:40:55 1999 Philips Semiconductors Discrete Semiconductor Packages Preface TABLE OF CONTENTS Introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . iii
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Untitled
Abstract: No abstract text available
Text: Development General NXP Semiconductors BL-Cellular Systems, MST RF Power Basestations DEV&QAS Title: Bolt down mounting recommendations for Ldmos Power Amplifier Author: Josselin FAY / Raimond DUMOULIN Doc. Nr. Date: 2007/03/27 Bolt down mounting recommendations for
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OT121A
OT262A
OT391A
OT467A
OT502A
OT540A
OT608A
OT895A
OT539A
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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BLV958
Abstract: BLV958FL 101 Ceramic Disc Capacitors
Text: DISCRETE SEMICONDUCTORS DATA SHEET BLV958; BLV958FL UHF power transistors Product specification Supersedes data of 1997 Oct 15 2000 Jan 12 Philips Semiconductors Product specification UHF power transistors BLV958; BLV958FL FEATURES DESCRIPTION • Internal input and output matching for easy matching,
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BLV958;
BLV958FL
OT391A
OT391B
125002/04/pp12
BLV958
BLV958FL
101 Ceramic Disc Capacitors
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4120PL
Abstract: TEKELEC 302 BLV958FL sot391 BLV958 A11Z SQL5 Tekelec BLV95 68479 wire
Text: Philips Semiconductors Product specification UHF power transistors BLV958; BLV958FL FEATURES DESCRIPTION • Internal input and output matching for easy matching, high gain and efficiency NPN silicon planar epitaxial transistors primarily intended for common emitter class-AB operation. The transistors
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BLV958;
BLV958FL
OT391A
OT391B
-SOT391A
-SOT391
4120PL
TEKELEC 302
BLV958FL
sot391
BLV958
A11Z
SQL5
Tekelec
BLV95
68479 wire
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