sot516
Abstract: No abstract text available
Text: PDF: 1999 Jun 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm SOT516-1 D ball A1 index area A2 A E A1 detail X A b ∅w M y v A ZD e ZE K J H G e F E D C B A 1 2 3 4
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LFBGA56:
OT516-1
sot516
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SOT516
Abstract: LFBGA56
Text: PDF: 2000 Mar 07 Philips Semiconductors Package outline LFBGA56: plastic low profile fine-pitch ball grid array package; 56 balls; body 6 x 6 x 1.05 mm D SOT516-1 A B ball A1 index area A2 A E A1 detail X C e1 v M B b e y y1 C ∅w M v M A K J e H G F e1 E
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LFBGA56:
OT516-1
SOT516
LFBGA56
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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PZ3064AS10BP
Abstract: PZ3064DS10 PZ3064DS10BC
Text: INTEGRATED CIRCUITS PZ3064A/PZ3064D 64 macrocell CPLD with enhanced clocking Product specification Supersedes data of 1999 May 07 IC27 Data Handbook Philips Semiconductors 1999 Jun 16 Philips Semiconductors Product specification 64 macrocell CPLD with enhanced clocking
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PZ3064A/PZ3064D
PZ3064A/PZ3064D
44-pin
56-ball
100-pin
PZ3064AS10BP
PZ3064DS10
PZ3064DS10BC
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handbook philips ic26 packaging
Abstract: AN01026 BGA304 land pattern BGA 0.75 BGA OUTLINE DRAWING BGA and QFP Package LFBGA80 LR-735 stencil tension land pattern BGA 0,50
Text: APPLICATION INFORMATION AN01026 LF BGA APPLICATION NOTE ATO INNOVATION, PHILIPS SEMICONDUCTORS MARCH 2000 Philips Semiconductors BGA Application Note CONTENTS 1 INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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AN01026
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA304
OT550-1
BGA316
handbook philips ic26 packaging
AN01026
BGA304
land pattern BGA 0.75
BGA OUTLINE DRAWING
BGA and QFP Package
LFBGA80
LR-735
stencil tension
land pattern BGA 0,50
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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Untitled
Abstract: No abstract text available
Text: Philips Sem iconductors Product specification 64 macrocell CPLD with enhanced clocking FEATURES Table 1. PZ3064A/PZ3064D Features • Industry’s first TotalCMOS PLD - both CM OS design and process technologies PZ3064A/PZ3064D Usable gates • Fast Zero Power FZP™ design technique provides ultra-low
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PZ3064A/PZ3064D
PZ3064A/PZ3064D
44-pin
56-ball
100-pin
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