Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT521 Search Results

    SOT521 Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Type PDF
    SOT521-1 NXP Semiconductors Plastic DIL-bent-SIL power package; 27 leads (lead length 7.7 mm) Original PDF

    SOT521 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z 5 v M e2 m w M bp e c 10 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF DBS27P: OT521-1

    SOT521-1

    Abstract: DBS27P
    Text: PDF: 2002 Apr 24 Philips Semiconductors Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z e 5 v M e2 m w M bp c 10 mm


    Original     		PDF DBS27P: OT521-1 SOT521-1 DBS27P

    DBS27P

    Abstract: sot521
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS27P: plastic DIL-bent-SIL power package; 27 leads lead length 7.7 mm SOT521-1 non-concave Dh x D Eh view B: mounting base side A2 d A5 A4 β B j E1 E A L3 L 1 Q 27 e1 Z e 5 v M e2 m w M bp c 10 mm


    Original     		PDF DBS27P: OT521-1 DBS27P sot521

    TDA8587

    Abstract: tda8587j definition of power amplifier output types Circuit diagram of Car battery jump starter 4 x 35 W Quad Bridge Car Radio Amplifier STC 15.55 MHZ DBS27 TDA8587J/N2+equivalent
    Text: TDA8587J 4 x 25 W BTL power amplifier and multiple voltage regulator with power switch Rev. 01 — 23 December 2004 Preliminary data sheet 1. General description The TDA8587J is a combination of a quad Bridge-Tied Load BTL power amplifier, a multiple voltage regulator and a power switch. Several protections and diagnostic options


    Original     		PDF TDA8587J TDA8587J TDA8587 definition of power amplifier output types Circuit diagram of Car battery jump starter 4 x 35 W Quad Bridge Car Radio Amplifier STC 15.55 MHZ DBS27 TDA8587J/N2+equivalent

    saf7730hv

    Abstract: saf7730 saa7709h saa7709 Philips SAF7730HV philips SAA7709 SAF773x SAF7730H Philips SAF7730 saf7730 audio
    Text: Philips Semiconductors Philips Semiconductors is a worldwide company with over 100 sales offices in more than 50 countries. For a complete up-to-date list of our sales offices please e-mail sales.addresses@www.semiconductors.philips.com A complete list will be sent to you automatically.


    Original     		PDF

    SOT411

    Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
    Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which


    Original     		PDF

    TRANSISTOR BTL POWER AMPLIFIER

    Abstract: IEC-60268 4 channel car audio amplifier circuit diagram TDA8591 2000 W BTL POWER AMPLIFIER CIRCUIT DIAGRAM TDA8591J 6 channel car audio amplifier circuit diagram
    Text: INTEGRATED CIRCUITS DATA SHEET TDA8591J 4 x 44 W into 4 Ω or 4 × 75 W into 2 Ω quad BTL car radio power amplifier Preliminary specification File under Integrated Circuits, IC01 2002 Jan 14 Philips Semiconductors Preliminary specification 4 × 44 W into 4 Ω or 4 × 75 W into 2 Ω


    Original     		PDF TDA8591J SCA74 753503/01/pp36 TRANSISTOR BTL POWER AMPLIFIER IEC-60268 4 channel car audio amplifier circuit diagram TDA8591 2000 W BTL POWER AMPLIFIER CIRCUIT DIAGRAM TDA8591J 6 channel car audio amplifier circuit diagram

    JEDEC TRAY DIMENSIONS

    Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
    Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors


    Original     		PDF manuf86 TQFP80 OT357 TQFP64 OT543 TFBGA64 JEDEC TRAY DIMENSIONS HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package