DBS7P
Abstract: No abstract text available
Text: PDF: 2003 Mar 17 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q w M bp
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OT524-1
DBS7P
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Untitled
Abstract: No abstract text available
Text: PDF: 2000 Jul 04 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q w M bp
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OT524-1
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sot524
Abstract: No abstract text available
Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad , , non-concave x SOT524-1 q1 Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 e Q
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OT524-1
OT524-1
sot524
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Untitled
Abstract: No abstract text available
Text: Package outline DBS7P: plastic DIL-bent-SIL power package; 7 leads lead length 12/11 mm ; exposed die pad SOT524-1 q1 non-concave x Eh Dh D D1 view B: mounting base side P A2 k q2 B E q L2 L3 L1 L 1 7 Z e1 Q w M bp e 5 scale DIMENSIONS (mm are the original dimensions)
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OT524-1
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TDA4865AJ equivalent
Abstract: TDA4865AJ TDA4865 TDA4865J circuit TDA4865AJ tda4865aj vertical IC 0/TDA4865AJ equivalent 002Z1 1N4448 BC548
Text: TDA4865J; TDA4865AJ Vertical deflection booster Rev. 02 — 3 November 2006 Product data sheet 1. General description The TDA4865J and TDA4865AJ are deflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. The TDA4865J needs a separate flyback supply voltage, so the supply voltages are
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TDA4865J;
TDA4865AJ
TDA4865J
TDA4865AJ
TDA4865AJ equivalent
TDA4865
circuit TDA4865AJ
tda4865aj vertical IC
0/TDA4865AJ equivalent
002Z1
1N4448
BC548
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TDA4864AJ
Abstract: TDA4864aj diagram TDA4864J tda4864 circuit TDA4864AJ tda4864aj diagrams 1N4448 BC548 BC556 BYV27
Text: TDA4864J; TDA4864AJ Vertical deflection booster Rev. 01 — 12 August 2004 Product data sheet 1. General description The TDA4864J and TDA4864AJ are deflection boosters for use in vertical deflection systems for frame frequencies up to 200 Hz. The TDA4864J needs a separate flyback supply voltage, so the supply voltages are
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TDA4864J;
TDA4864AJ
TDA4864J
TDA4864AJ
TDA4864aj diagram
tda4864
circuit TDA4864AJ
tda4864aj diagrams
1N4448
BC548
BC556
BYV27
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TDA4864AJ
Abstract: tda4864 TDA4864aj diagram TDA4864AJ equivalent VP233 circuit TDA4864AJ BC548 and its h parameter values BC548 operation 1N4448 BC548
Text: INTEGRATED CIRCUITS DATA SHEET TDA4864J; TDA4864AJ Vertical deflection booster Product specification 2003 Oct 31 Philips Semiconductors Product specification Vertical deflection booster TDA4864J; TDA4864AJ FEATURES GENERAL DESCRIPTION • Power amplifier with differential inputs
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TDA4864J;
TDA4864AJ
TDA4864J
TDA4864AJ
tda4864
TDA4864aj diagram
TDA4864AJ equivalent
VP233
circuit TDA4864AJ
BC548 and its h parameter values
BC548 operation
1N4448
BC548
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TDA4863AJ
Abstract: TDA4863 tda4863AJ equivalent TDA4863aj diagram tda4863aj vertical IC TDA4863J, TDA4863AJ TDA4863J equivalent TDA4863J pic 817 TDA4863A
Text: INTEGRATED CIRCUITS DATA SHEET TDA4863J; TDA4863AJ Vertical deflection booster Product specification File under Integrated Circuits, IC02 2000 Aug 17 Philips Semiconductors Product specification Vertical deflection booster TDA4863J; TDA4863AJ FEATURES GENERAL DESCRIPTION
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TDA4863J;
TDA4863AJ
TDA4863J
TDA4863AJ
753504/01/pp20
TDA4863
tda4863AJ equivalent
TDA4863aj diagram
tda4863aj vertical IC
TDA4863J, TDA4863AJ
TDA4863J equivalent
pic 817
TDA4863A
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SOT411
Abstract: SnAg25Sb10 zirconium acetate AgCu28 Transistors smd mark code CuZn15 QFP100 Quad Flat Pack dimensions 271 Ceramic Disc Capacitors SOT538 smd led 5050
Text: Environmental Information ENVIRONMENTAL SAFETY Offering maximum benefit – minimum impact New technologies result in shared benefits for you our customers, balancing maximum technological benefits with minimum environmental impact. This starts with clever chip designs, which
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JEDEC TRAY DIMENSIONS
Abstract: HSSOP20 ic packages TRAY TSSOP20 14 X 35 SO16 package trays BGA304 HLQFP100 MSD504 LQFP64 reel size PLCC84 package
Text: CHAPTER 7 PACKING METHODS page Introduction 7-2 Glossary of terms 7-2 Drypack for moisture sensitive SMDs 7-3 Survey of IC packing methods 7-5 Packing methods in exploded view 7-6 Packing quantities, box dimensions and carrier shapes 7 - 13 Philips Semiconductors
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manuf86
TQFP80
OT357
TQFP64
OT543
TFBGA64
JEDEC TRAY DIMENSIONS
HSSOP20
ic packages
TRAY TSSOP20 14 X 35
SO16 package trays
BGA304
HLQFP100
MSD504
LQFP64 reel size
PLCC84 package
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