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    SOT618 Search Results

    SOT618 Datasheets (10)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT618-1 NXP Semiconductors Footprint for reflow soldering SOT618-1 Original PDF
    SOT618-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT618-2 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT618-2 NXP Semiconductors Footprint for reflow soldering SOT618-2 Original PDF
    SOT618-3 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT618-4 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT618-5 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT618-6 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm Original PDF
    SOT618-6_518 NXP Semiconductors HVQFN40; Reel dry pack, SMD, 13"Q1/T1 standard orientationOrderable part number ending, 518 or YOrdering code (12NC) ending 518 Original PDF
    SOT618-7 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 40 terminals Original PDF

    SOT618 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN40 package SOT618-2 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


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    HVQFN40 OT618-2 PDF

    Untitled

    Abstract: No abstract text available
    Text: 4 1  +9 SOT618-6 HVQFN40; Reel dry pack, SMD, 13" Q1/T1 standard product orientation Orderable part number ending, 518 or Y Ordering code 12NC) ending 518 Rev. 1 — 6 September 2013 Packing information 1. Packing method %DUFRGHODEHO 'U\DJHQW %DJ (6'SULQW


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    OT618-6 HVQFN40; OT618-6 PDF

    HVQFN-40

    Abstract: HVQFN40 MO-220 sot618
    Text: Package outline Philips Semiconductors HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-3 A terminal 1 index area A A1 E c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C b 11 L 21 10 e


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    HVQFN40: OT618-3 MO-220 HVQFN-40 HVQFN40 MO-220 sot618 PDF

    HVQFN40

    Abstract: HVQFN-40 SOT618-1 sot618 HY 2004 solder paste
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN40 package SOT618-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


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    HVQFN40 OT618-1 OT618-1 HVQFN-40 SOT618-1 sot618 HY 2004 solder paste PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-6 terminal 1 index area E A A1 c detail X e1 1/2 e e 11 L 20 C C A B C v w b y1 C y 21 10 e e2 Eh 1/2 e 1 terminal 1 index area


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    HVQFN40: OT618-6 MO-220 sot618-6 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm SOT618 -2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e y1 C v M C A B w M C b 1/2 e 11 y 20 L 21 10 e e2 Eh 1/2 e 1


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    HVQFN40: OT618 OT618-2 MO-220 PDF

    HVQFN40

    Abstract: SOT618-1
    Text: PDF: 2000 Sep 29 Philips Semiconductors Package outline HVQFN40: plastic, heatsink very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A4 A E detail X e1 b e C v M B 11 y y1 C w M 20 v M A L 21 10


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    HVQFN40: OT618-1 MO-220 HVQFN40 SOT618-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-5 terminal 1 index area E A A1 c detail X e1 e 1/2 e ∅v ∅w b 11 20 M M C C A B C y1 C y L 10 21 e e2 Eh 1/2 e 1 terminal 1


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    HVQFN40: OT618-5 MO-220 PDF

    HVQFN40

    Abstract: MO-220 philips l 6.1 SOT618-1
    Text: PDF: 2002 Oct 23 Philips Semiconductors Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C


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    HVQFN40: OT618-1 MO-220 HVQFN40 MO-220 philips l 6.1 SOT618-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-7 terminal 1 index area E A A1 c detail X e1 1/2 e e 11 20 L C C A B C v w b y1 C y 21 10 e e2 Eh 1/2 e 1 30 terminal 1


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    HVQFN40: OT618-7 MO-220 sot618-7 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-3 A terminal 1 index area A E A1 c detail X C e1 1/2 e e 11 b y y1 C v M C A B w M C 20 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1


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    HVQFN40: OT618-3 MO-220 PDF

    cb20

    Abstract: No abstract text available
    Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm A B D SOT618-1 terminal 1 index area A E A1 c detail X C e1 1/2 e e 20 y y1 C v M C A B w M C b 11 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1


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    HVQFN40: OT618-1 OT618-1 MO-220 cb20 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm B D SOT618-4 A terminal 1 index area A E A1 c detail X C e1 1/2 e e 11 b y y1 C v M C A B w M C 20 L 21 10 e e2 Eh 1/2 e 1 30 terminal 1


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    HVQFN40: OT618-4 protru75 MO-220 PDF

    HVQFN40

    Abstract: MO-220 sot618
    Text: PDF: 2003 Apr 22 Philips Semiconductors Package outline HVQFN40: plastic thermal enhanced very thin quad flat package; no leads; 40 terminals; body 6 x 6 x 0.85 mm SOT618 -2 B D D1 A terminal 1 index area A A4 E1 E c A1 detail X C e1 e 1/2 y1 C v M C A B w M C


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    HVQFN40: OT618 OT618-2 MO-220 HVQFN40 MO-220 sot618 PDF

    PN533

    Abstract: NXP PN533 USB Interface IC NXP ISO 14443-4 nfc antenna design NXP JESC22-C101-C PN5331B3HN Near field communication TDA8029
    Text: PN533 Near Field Communication NFC controller Rev. 3.3 — 16 July 2012 158233 Product short data sheet PUBLIC 1. General description The PN533 is a highly integrated transceiver module for contactless communication at 13.56 MHz based on the 80C51 microcontroller core. A dedicated ROM code is


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    PN533 PN533 80C51 4443A 14443B NXP PN533 USB Interface IC NXP ISO 14443-4 nfc antenna design NXP JESC22-C101-C PN5331B3HN Near field communication TDA8029 PDF

    FAF 45 DIODE SMD

    Abstract: FAF 45 DIODE FR07* diode RDS decoder FAF 37 DIODE old fm radio diagram FAF 37 DIODE smd TEA5764HN electrical table tea5764
    Text: TEA5764HN FM radio + RDS Rev. 02 — 9 August 2005 Product data sheet 1. General description The TEA5764HN is a single chip electronically tuned FM stereo radio with Radio Data System RDS and Radio Broadcast Data System (RBDS) demodulator and RDS/RBDS decoder for portable application with fully integrated IF selectivity and demodulation.


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    TEA5764HN TEA5764HN FAF 45 DIODE SMD FAF 45 DIODE FR07* diode RDS decoder FAF 37 DIODE old fm radio diagram FAF 37 DIODE smd electrical table tea5764 PDF

    Untitled

    Abstract: No abstract text available
    Text: PN512 Full NFC Forum Compliant Solution Rev. 4.4 — 30 July 2013 111344 Product data sheet COMPANY PUBLIC 1. Introduction This document describes the functionality and electrical specifications of the transceiver IC PN512. The PN512 is a highly integrated transceiver IC for contactless communication at


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    PN512 PN512. PN512 PN5120A0HN1/C2 HVQFN32) PN5120A0HN/C2 HVQFN40) PN5120A0ET/C2 TFBGA64) PDF

    pn532 Protocol is

    Abstract: 13.56 power amplifier nxp PN5321a3hn nfc front end NFC antenna design PN532 SFR registers nfc antenna matching nfc passive innovatron protocol PN532
    Text: PN532/C1 Near Field Communication NFC controller Rev. 3.0 — 10 November 2011 120130 Product short data sheet COMPANY PUBLIC 1. General description The PN532 is a highly integrated transceiver module for contactless communication at 13.56 MHz based on the 80C51 microcontroller core. It supports 6 different operating


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    PN532/C1 PN532 80C51 4443A/MIFARE 14443B pn532 Protocol is 13.56 power amplifier nxp PN5321a3hn nfc front end NFC antenna design PN532 SFR registers nfc antenna matching nfc passive innovatron protocol PDF

    nxp pr533

    Abstract: TAS-3225A PR5331C3HN nfc antenna design nfc antenna design NXP
    Text: PR5331C3HN Contactless Interface Controller Rev. 3.0 — 3 August 2011 206430 Product short data sheet PUBLIC 1. General description The PR5331C3HN is a highly integrated transceiver module for contactless reader/writer communication at 13.56 MHz. A dedicated ROM code is implemented to handle different RF protocols by an integrated


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    PR5331C3HN PR5331C3HN PR5331C3HN, ISO/IEC14443 nxp pr533 TAS-3225A nfc antenna design nfc antenna design NXP PDF

    MHC304

    Abstract: HVQFN40 TEA5767HN
    Text: INTEGRATED CIRCUITS DATA SHEET TEA5767HN Low-power FM stereo radio for handheld applications Product specification Supersedes data of 2003 Nov 12 2004 Sep 20 Philips Semiconductors Product specification Low-power FM stereo radio for handheld applications TEA5767HN


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    TEA5767HN SCA76 R30/03/pp38 MHC304 HVQFN40 TEA5767HN PDF

    ADC1210S

    Abstract: No abstract text available
    Text: ADC1210S series Single 12-bit ADC; 65 Msps, 80 Msps, 105 Msps or 125 Msps; CMOS or LVDS DDR digital outputs Rev. 2 — 23 December 2010 Product data sheet 1. General description The ADC1210S is a single-channel 12-bit Analog-to-Digital Converter ADC optimized for


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    ADC1210S 12-bit PDF

    Manchester CODING DECODING

    Abstract: block diagram CD Writer
    Text: PN532/C1 Near Field Communication NFC controller Rev. 3.0 — 10 November 2011 120130 Product short data sheet COMPANY PUBLIC 1. General description The PN532 is a highly integrated transceiver module for contactless communication at 13.56 MHz based on the 80C51 microcontroller core. It supports 6 different operating


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    PN532/C1 PN532 80C51 4443A/MIFARE 14443B Manchester CODING DECODING block diagram CD Writer PDF

    NXP PN533

    Abstract: PN533 PN533 NFC controller NFC I2C nxp nfc patent pool innovatron protocol nfc antenna design NXP FELICA ecma 340 nfc ISO 14443-4 code
    Text: PN533 Near Field Communication NFC controller Rev. 3.2 — 2 February 2012 158232 Product short data sheet PUBLIC 1. General description The PN533 is a highly integrated transceiver module for contactless communication at 13.56 MHz based on the 80C51 microcontroller core. A dedicated ROM code is


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    PN533 PN533 80C51 4443A 14443B NXP PN533 PN533 NFC controller NFC I2C nxp nfc patent pool innovatron protocol nfc antenna design NXP FELICA ecma 340 nfc ISO 14443-4 code PDF

    Untitled

    Abstract: No abstract text available
    Text: ADC1410S series Single 14-bit ADC; 65 Msps, 80 Msps, 105 Msps or 125 Msps; CMOS or LVDS DDR digital outputs Rev. 05 — 2 July 2012 Product data sheet 1. General description The ADC1410S is a single-channel 14-bit Analog-to-Digital Converter ADC optimized for


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    ADC1410S 14-bit PDF