LFBGA180

Abstract: 11-90 MO-151 sot622
Contextual Info: PDF: 2000 Jun 26 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A P N M e L K

MO-205

Abstract: LFBGA180
Contextual Info: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e y y1 C ∅v M C A B b ∅w M C P N

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT622-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 12 x 12 x 1.05 mm SOT622-1 B D A ball A1 index area E A A2 A1 detail X C e1 1/2 e e b y y1 C ∅v M C A B ∅w M C P N e M L K J H e2 G 1/2 e F E D C B A ball A1