SOT636 Search Results
SOT636 Datasheets (2)
Part | ECAD Model | Manufacturer | Description | Curated | Datasheet Type | |
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SOT636-1 |
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Footprint for reflow soldering SOT636-1 | Original | |||
SOT636-1 |
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Plastic heatsink ball grid array package; 388 balls; body 35 x 35 x 1.75 mm; heatsink | Original |
SOT636 Datasheets Context Search
Catalog Datasheet | MFG & Type | Document Tags | |
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Untitled
Abstract: No abstract text available
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Original |
HBGA388 OT636-1 OT636-1 | |
MS-034
Abstract: SOT636-1
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Original |
HBGA388: OT636-1 MS-034 MS-034 SOT636-1 | |
MS-034
Abstract: sot636 SOT636-1
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Original |
HBGA388: OT636-1 MS-034 MS-034 sot636 SOT636-1 | |
Untitled
Abstract: No abstract text available
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Original |
HBGA388: OT636-1 MS-034 | |
SOT-636-package
Abstract: silicon bipolar transistor rf power amplifier BGA428 amplifier siemens sot-363 sot636 AN063
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Original |
BGA428 45-Technology OT363-Package OT-363. AN063 SOT-636-package silicon bipolar transistor rf power amplifier BGA428 amplifier siemens sot-363 sot636 AN063 | |
SOT-636-package
Abstract: sot636
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Original |
BGA428 45-Technology OT363-Package OT-363. AN063 SOT-636-package sot636 |