SOT644 Search Results

SOT644 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT644-1		NXP Semiconductors	Footprint for reflow soldering SOT644-1		Original	PDF
SOT644-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm		Original	PDF

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B b y ∅w M C N M L K e J H e2 G F E D C B A ball A1 index area	Original	PDF	LFBGA144: OT644-1 MO-205
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA144 package SOT644-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	LFBGA144 OT644-1 OT644-1
LFBGA144 Abstract: MO-205 sot644 Text: PDF: 2000 Oct 17 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.90 mm SOT644-1 B D A ball A1 index area A E A2 A1 detail X C e1 v M B b e y y1 C ∅w M v M A N M L e K J	Original	PDF	LFBGA144: OT644-1 GA144: MO-205 LFBGA144 MO-205 sot644
LFBGA144 Abstract: MO-205 Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e ∅v M C A B b y1 C y ∅w M C N M L K e	Original	PDF	LFBGA144: OT644-1 OT64grid MO-205 LFBGA144 MO-205