MO-205

Abstract: LFBGA180
Contextual Info: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V U

Contextual Info: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT697-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste

Contextual Info: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V U e T R P N M L e2 K J H 1/2 e G F E D C

MO-151

Abstract: sot697
Contextual Info: PDF: 2001 May 04 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A V U T R e P