SOT697 Search Results

SOT697 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Type	PDF
SOT697-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm		Original	PDF
SOT697-1		NXP Semiconductors	Footprint for reflow soldering SOT697-1		Original	PDF

Catalog Datasheet	MFG & Type	PDF	Document Tags
MO-205 Abstract: LFBGA180 Text: PDF: 2002 Feb 13 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b 1/2 e e ∅w M C V U	Original	PDF	LFBGA180: OT697-1 MO-205 MO-205 LFBGA180
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA180 package SOT697-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	LFBGA180 OT697-1 OT697-1
Untitled Abstract: No abstract text available Text: Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 A B D ball A1 index area E A A2 A1 detail X C e1 b 1/2 e e y y1 C ∅v M C A B ∅w M C V U e T R P N M L e2 K J H 1/2 e G F E D C	Original	PDF	LFBGA180: OT697-1 MO-205
MO-151 Abstract: sot697 Text: PDF: 2001 May 04 Philips Semiconductors Package outline LFBGA180: plastic low profile fine-pitch ball grid array package; 180 balls; body 15 x 15 x 1.05 mm SOT697-1 B D A ball A1 index area E A A2 A1 detail X C e1 v M B b e ∅w M y y1 C v M A V U T R e P	Original	PDF	LFBGA180: OT697-1 MO-151 MO-151 sot697