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    SOT710 Search Results

    SOT710 Datasheets (2)

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    SOT710-1 NXP Semiconductors Plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm Original PDF
    SOT710-1 NXP Semiconductors Footprint for reflow soldering SOT710-1 Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C U T e R P N M L K e2 J H G F E D C B A shape optional 4x 1 2 3 4 5


    Original     		BGA217: OT710-1 MS-034 PDF

    BGA217

    Abstract: MS 034 SOT710-1 MS-034 sot710
    Text: PDF: 2001 Nov 01 Philips Semiconductors Package outline BGA217: plastic ball grid array package; 217 balls; body 23 x 23 x 1.75 mm SOT710-1 B D A D1 ball A1 index area A2 A E1 E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C U T e R P N M L K e2 J H G F


    Original     		BGA217: OT710-1 MS-034 BGA217 MS 034 SOT710-1 MS-034 sot710 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of BGA217 package SOT710-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		BGA217 OT710-1 OT710-1 PDF