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    SOT735-1

    Abstract: sot735 4773
    Text: PDF: 2002 Nov 13 Philips Semiconductors Package outline HCPGA391: thermal enhanced ceramic pin grid array package; 391 pins; body 47.25 x 47.25 x 3.2 mm SOT735-1 D Dh VDD VSS VDD VSS VSS CORE VDD CORE VDD CORE VSS CORE VSS VDD pin 1 index mark location A2


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    PDF HCPGA391: OT735-1 SOT735-1 sot735 4773