SOT745 Search Results

SOT745 Datasheets (2)

Part	ECAD Model	Manufacturer	Description	Curated	Datasheet Type	PDF
SOT745-1		NXP Semiconductors	Plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm		Original	PDF
SOT745-1		NXP Semiconductors	Footprint for reflow soldering SOT745-1		Original	PDF

Catalog Datasheet	MFG & Type	PDF	Document Tags
Untitled Abstract: No abstract text available Text: PDF: 2001 Dec 12 Philips Semiconductors Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area E A A2 A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E	Original	PDF	LFBGA72: OT745-1
Untitled Abstract: No abstract text available Text: Package outline LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area A2 A E A1 detail X C e1 b e y y1 C ∅v M C A B ∅w M C L K J H G F E D C B A e e2 ball A1 index area X 1 2 3 4 5 6 7 8 9 10 11	Original	PDF	LFBGA72: OT745-1
Untitled Abstract: No abstract text available Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA72 package SOT745-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	PDF	LFBGA72 OT745-1 OT745-1
sot745 Abstract: No abstract text available Text: Package outline Philips Semiconductors LFBGA72: plastic low profile fine-pitch ball grid array package; 72 balls; body 7 x 7 x 0.9 mm D SOT745-1 A B ball A1 index area A2 A E A1 detail X C e1 y y1 C ∅v M C A B b e ∅w M C L K J H G F E D C B A e e2 ball A1	Original	PDF	LFBGA72: OT745-1 OT745 sot745