Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    SOT817 Search Results

    SOT817 Datasheets (2)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT817-1 NXP Semiconductors HVQFN100: plastic thermal enhanced very thin quad flat package Original PDF
    SOT817-1 NXP Semiconductors Footprint for reflow soldering SOT817-1 Original PDF

    SOT817 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A E1 E c A1 detail X C e1 e 26 y1 C v M C A B w M C b 50 L y 51 25 e e2 Eh 1 terminal 1


    Original     		HVQFN100: OT817-1 MO-220 PDF

    MO-220

    Abstract: sot817
    Text: PDF: 2003 Jun 13 Philips Semiconductors Package outline HVQFN100: plastic thermal enhanced very thin quad flat package; no leads; 100 terminals; body 12 x 12 x 0.85 mm SOT817-1 B D D1 A terminal 1 index area A4 A E1 E c A1 detail X C e1 e y1 C v M C A B w M C


    Original     		HVQFN100: OT817-1 MO-220 MO-220 sot817 PDF

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of HVQFN100 package SOT817-1 Hx Gx D P C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		HVQFN100 OT817-1 OT817-1 QFN100 PDF