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    SOT83 Price and Stock

    Nexperia 74AVCH2T45GT,115

    Translation - Voltage Levels SOT833-1 TRANSLATION-VOLT LVL
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74AVCH2T45GT,115 Reel 20,000 5,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 $0.123
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    Nexperia 74AVC2T45GT-Q100X

    Translation - Voltage Levels 74AVC2T45GT-Q100/SOT833/XSON8
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74AVC2T45GT-Q100X Reel 5,000 5,000
    • 1 -
    • 10 -
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    • 10000 $0.184
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    Nexperia 74LVC2T45GT,115

    Bus Transceivers SOT833-1 BUS TRANSCEIVERS
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVC2T45GT,115 Reel 5,000
    • 1 -
    • 10 -
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    • 10000 $0.147
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    Nexperia 74LVC1G74GT,115

    Flip Flops SOT833-1 SNGL D-TYPE FLIPFLOP
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVC1G74GT,115 Reel 5,000
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    • 1000 -
    • 10000 $0.069
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    Nexperia 74LVC2G00GT,115

    Logic Gates SOT833-1 DUAL 2-INPUT NAND GT
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    TTI 74LVC2G00GT,115 Reel 5,000
    • 1 -
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    • 1000 -
    • 10000 $0.074
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    SOT83 Datasheets (8)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT830-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; resin based; body 5.4 x 3.9 x 1.2 mm Original PDF
    SOT832-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 0.95 mm Original PDF
    SOT833-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm Original PDF
    SOT833-1_115 NXP Semiconductors Standard product orientation 12NC ending 115 Original PDF
    SOT834-1 NXP Semiconductors Footprint for reflow soldering SOT834-1 Original PDF
    SOT835-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink Original PDF
    SOT836-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm Original PDF
    SOT838-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm Original PDF

    SOT83 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e AK AH AF AD AB Y V T P M K H F D B AJ AG AE e AC heatsink AA W U e2 R N


    Original     		HBGA672: OT835-1 MS-034 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4x 2 L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 1 2 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		OT833-1 MO-252 PDF

    sot831

    Abstract: No abstract text available
    Text: Package outline Philips Semiconductors HLQFN30: plastic thermal enhanced low profile quad flat package; no leads; 30 terminals; body 10.1 x 8 x 1.5 mm SOT831-1 A D y terminal 1 index area E ZD1 16x b (19×) b3 D1 (4×) 10 11 12 ZE1 (15×) 13 14 15 9 16


    Original     		HLQFN30: OT831-1 sot831 PDF

    SOT833

    Abstract: sot833-1 NXP 12NC ending nxp Tape and Reel Information
    Text: SOT833-1 Standard product orientation 12NC ending 115 Rev. 01 — 17 April 2009 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT833 115 180 x 8


    Original     		OT833-1 OT833 OT833-1 SOT833 sot833-1 NXP 12NC ending nxp Tape and Reel Information PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA240: plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 0.95 mm SOT832-1 B D A ball A1 index area A E A2 A1 C e1 e T P M K H F D B detail X y y1 C ∅v M C A B b ∅w M C U R N e L e2 J G E C A ball A1 index area


    Original     		LFBGA240: OT832-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA167: plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm SOT836-1 B D A ball A1 index area A E A2 A1 detail X C e1 e AF AD AB Y 1/2 e y1 C ∅v M C A B b AE e AC AA V T P M K H F D B W U R e2 N L 1/2 e


    Original     		LFBGA167: OT836-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLLGA68R: plastic thermal enhanced low profile land grid array package; 68 lands; resin based; body 10 x 10 x 1.4 mm D SOT838-1 A B land 1 index area E e1 L1 L v w b e 18 M M y1 C C A B C A C y 34 35 17 e e2 Eh 1 land 1 index area 51 68 52


    Original     		HLLGA68R: OT838-1 PDF

    sot834

    Abstract: HSOP16F
    Text: PDF: 2003 Oct 22 Philips Semiconductors Package outline HSOP16F: plastic, heatsink small outline package; 16 leads flat SOT834-1 D A E E2 c y X HE v M A D1 e3 (2x) D2 w M bp2 16 12 A2 E1 pin 1 index Q1 detail X 1 11 w M Z bp1 (5×) e1 (2×) e (6×) e2 (4×)


    Original     		HSOP16F: OT834-1 sot834 HSOP16F PDF

    MO-252

    Abstract: SOT833 6E-15 SOT-833 sot833-1
    Text: Package outline Philips Semiconductors XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 1 x 1.95 x 0.5 mm 1 2 SOT833-1 b 4 3 4x 2 L L1 e 8 7 6 e1 5 e1 e1 8× A (2) A1 D E terminal 1 index area 1 2 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		OT833-1 MO-252 T833-1 MO-252 SOT833 6E-15 SOT-833 sot833-1 PDF

    sot832

    Abstract: LFBGA240
    Text: PDF: 2003 Oct 22 Philips Semiconductors Package outline LFBGA240: plastic low profile fine-pitch ball grid array package; 240 balls; body 11 x 11 x 0.95 mm SOT832-1 B D A ball A1 index area A E A2 A1 C e1 e ∅v M b T P M K H F D B detail X ∅w M y y1 C C A B


    Original     		LFBGA240: OT832-1 sot832 LFBGA240 PDF

    sot839

    Abstract: No abstract text available
    Text: PDF: 2004 Jan 15 Philips Semiconductors Package outline WQCCN32: plastic window quad chip carrier; no leads; 32 terminals; body 8 x 8 x 1.55 mm D D1 SOT839-1 B A A E1 E A1 detail X C e1 v w b e 5 M y y1 C C A B C M 12 L 13 4 e 1 e2 32 29 20 28 21 X 2.5 5 mm


    Original     		WQCCN32: OT839-1 sot839 PDF

    sot836

    Abstract: No abstract text available
    Text: PDF: 2003 Oct 20 Philips Semiconductors Package outline LFBGA167: plastic low profile fine-pitch ball grid array package; 167 balls; body 14 x 14 x 1.05 mm SOT836-1 B D A ball A1 index area A E A2 A1 detail X C e1 e AF AD AB Y 1/2 e ∅v M b ∅w M AE y1 C


    Original     		LFBGA167: OT836-1 sot836 PDF

    sot830

    Abstract: No abstract text available
    Text: PDF: 2004 Jan 07 Philips Semiconductors Package outline HTSSON16T: plastic thermal enhanced thin shrink small outline package/transparent; no leads; 16 terminals; body 5.4 x 3.9 x 1.2 mm SOT830-1 X A B D A c E1 E detail X terminal 1 index area L1 v M C A B


    Original     		HTSSON16T: OT830-1 sot830 PDF

    sot838

    Abstract: No abstract text available
    Text: PDF: 2004 Feb 19 Philips Semiconductors Package outline HLLGA68: plastic thermal enhanced low profile land grid array package; 68 lands; body 10 x 10 x 1.4 mm D SOT838-1 A B land 1 index area E e1 v w b e L1 18 M M y1 C C A B C A y 34 L C 35 17 e e2 Eh 1 land 1


    Original     		HLLGA68: OT838-1 JEHLLGA68: sot838 PDF

    Untitled

    Abstract: No abstract text available
    Text: SOT833-1 Standard product orientation 12NC ending 115 Rev. 03 — 28 July 2011 Packing information 1. Packing method Fig. 1 Package version 12NC ending Reel dimensions d x w mm SPQ/PQ (pcs) Reels per box Outer box dimensions l x w x h (mm) SOT833 115 180 x 8


    Original     		OT833-1 OT833 OT833-1 PDF

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSON16TR: plastic thermal enhanced thin shrink small outline package; no leads; 16 terminals; transparent; resin based; body 5.4 x 3.9 x 1.2 mm SOT830-1 X A B D A c E1 E detail X terminal 1 index area L1 b1 v M C A B w M C b v M C A B w M C


    Original     		HTSSON16TR: OT830-1 PDF

    MS-034

    Abstract: sot835
    Text: PDF: 2003 Nov 21 Philips Semiconductors Package outline HBGA672: plastic thermal enhanced ball grid array package; 672 balls; body 40 x 40 x 1.2 mm; heatsink B D SOT835-1 A ball A1 index area A A2 A1 E A4 detail X C e1 f1 e ∅v M C A B b y1 C y ∅w M C AL


    Original     		HBGA672: OT835-1 MS-034 MS-034 sot835 PDF

    nz104

    Abstract: No abstract text available
    Text: 74LVC2G66 Bilateral switch Rev. 7 — 22 June 2012 Product data sheet 1. General description The 74LVC2G66 is a low-power, low-voltage, high-speed Si-gate CMOS device. The 74LVC2G66 provides two single pole, single-throw analog switch functions. Each switch has two input/output terminals nY and nZ and an active HIGH enable input (nE).


    Original     		74LVC2G66 74LVC2G66 nz104 PDF

    MARKING V7 6-PIN

    Abstract: No abstract text available
    Text: 74LVC3G14 Triple inverting Schmitt trigger with 5 V tolerant input Rev. 11 — 6 July 2012 Product data sheet 1. General description The 74LVC3G14 provides three inverting buffers with Schmitt trigger input. It is capable of transforming slowly changing input signals into sharply defined, jitter-free output signals.


    Original     		74LVC3G14 74LVC3G14 MARKING V7 6-PIN PDF

    Marking code V7

    Abstract: No abstract text available
    Text: 74LVC2G00 Dual 2-input NAND gate Rev. 11 — 22 June 2012 Product data sheet 1. General description The 74LVC2G00 provides a 2-input NAND gate function. Inputs can be driven from either 3.3 V or 5 V devices. This feature allows the use of these devices as translators in a mixed 3.3 V and 5 V environment.


    Original     		74LVC2G00 74LVC2G00 Marking code V7 PDF

    JESD22-A114E

    Abstract: NX3L1G53GD NX3L1G53GM NX3L1G53GT
    Text: NX3L1G53 Low-ohmic single-pole double-throw analog switch Rev. 03 — 17 April 2009 Product data sheet 1. General description The NX3L1G53 provides one low-ohmic single-pole double-throw analog switch, suitable for use as an analog or digital multiplexer/demultiplexer. It has a digital select input S ,


    Original     		NX3L1G53 NX3L1G53 JESD22-A114E NX3L1G53GD NX3L1G53GM NX3L1G53GT PDF

    74LVC1G53

    Abstract: 74LVC1G53DC 74LVC1G53DP 74LVC1G53GD 74LVC1G53GT JESD22-A114E MO-187 V53 TSSOP8
    Text: 74LVC1G53 2-channel analog multiplexer/demultiplexer Rev. 05 — 11 June 2008 Product data sheet 1. General description The 74LVC1G53 is a low-power, low-voltage, high-speed, Si-gate CMOS device. The 74LVC1G53 provides one analog multiplexer/demultiplexer with a digital select


    Original     		74LVC1G53 74LVC1G53 74LVC1G53DC 74LVC1G53DP 74LVC1G53GD 74LVC1G53GT JESD22-A114E MO-187 V53 TSSOP8 PDF

    74AUP2G125

    Abstract: 74AUP2G125DC 74AUP2G125GT JESD22-A114E JESD78
    Text: 74AUP2G125 Low-power dual buffer/line driver; 3-state Rev. 05 — 2 February 2009 Product data sheet 1. General description The 74AUP2G125 provides the dual non-inverting buffer/line driver with 3-state output. The 3-state output is controlled by the output enable input nOE . A HIGH level at pin nOE


    Original     		74AUP2G125 74AUP2G125 74AUP2G125DC 74AUP2G125GT JESD22-A114E JESD78 PDF

    74AUP1G126

    Abstract: 74AUP1G32 JESD22-A114E 74AUP1T1326
    Text: 74AUP1T1326 Low-power dual supply buffer/line driver; 3-state Rev. 01 — 20 January 2009 Product data sheet 1. General description The 74AUP1T1326 is a high-performance, low-power, low-voltage, single-bit, dual supply buffer/line driver with output enable circuitry.


    Original     		74AUP1T1326 74AUP1T1326 74AUP1G32 74AUP1G126. 74AUP1G126 JESD22-A114E PDF