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    SOT865 Search Results

    SOT865 Datasheets (5)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT865-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT865-2 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT865-2 NXP Semiconductors Footprint information for reflow soldering of HVQFN32 package Original PDF
    SOT865-3 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm Original PDF
    SOT865-3 NXP Semiconductors Footprint for reflow soldering SOT865-3 Original PDF

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    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm B D SOT865-3 A terminal 1 index area E A c A1 detail X C e1 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1 index area 32


    Original     		PDF HVQFN32: OT865-3 MO-220 sot865-3

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y y1 C C A B C L 17 8 e e2 Eh 1/2 e 1 24 terminal 1


    Original     		PDF HVQFN32: OT865-1 MO-220

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm SOT865-2 B D D1 A terminal 1 index area E1 E A A2 c A1 detail X e1 C 1/2 e 9 y1 C C A B C v w b e L y 16 17 8 e2 Eh e 1 24 terminal 1


    Original     		PDF HVQFN32: OT865-2 sot865-2

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-3 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		PDF HVQFN32 OT865-3 sot865-3

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of HVQFN32 package SOT865-2 Hx Gx D P 0.025 0.025 C 0.105 SPx nSPx Hy SPy tot SPy Gy SLy nSPy By Ay SPx tot SLx Bx Ax Generic footprint pattern Refer to the package outline drawing for actual layout


    Original     		PDF HVQFN32 OT865-2 sot865-2

    HVQFN32

    Abstract: MO-220 Thin Quad flat package 44 mo-220 sot865
    Text: Package outline Philips Semiconductors HVQFN32: plastic thermal enhanced very thin quad flat package; no leads; 32 terminals; body 7 x 7 x 0.85 mm D B SOT865-1 A terminal 1 index area E A A1 c detail X C e1 e b 1/2 e 9 v w 16 M M y1 C C A B C y L 17 8 e e2


    Original     		PDF HVQFN32: OT865-1 MO-220 HVQFN32 MO-220 Thin Quad flat package 44 mo-220 sot865