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Vishay Huntington FSOT9509E5R000JE RES CHAS MNT 5 OHM 5% 95W
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DigiKey	FSOT9509E5R000JE	Bulk			10	1 - 10 $69.65 100 $69.65 1000 $69.65 10000 $69.65	Buy Now
Fischer Elektronik GmbH & Co KG SK-02-75-ME-CB-SOT-9 Extruded Heatsink
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DigiKey	SK-02-75-ME-CB-SOT-9	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Fischer Elektronik GmbH & Co KG SK-04-75-SA-CB-SOT-9 Extruded Heatsink
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SK-04-75-SA-CB-SOT-9	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Fischer Elektronik GmbH & Co KG SK-20-75-ME-CB-SOT-9 Extruded Heatsink
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SK-20-75-ME-CB-SOT-9	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now
Fischer Elektronik GmbH & Co KG SK-31-50-AL-CB-SOT-9 Extruded Heatsink
Distributors	Part	Package	Stock	Lead Time	Min Order Qty	Price	Buy
DigiKey	SK-31-50-AL-CB-SOT-9	Bulk				1 - 10 - 100 - 1000 - 10000 -	Buy Now

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SOT9 Datasheets (135)

Part	Manufacturer	Description	Datasheet Type	PDF
SOT900-1	NXP Semiconductors	Plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink	Original	PDF
SOT901-1	NXP Semiconductors	Plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm	Original	PDF
SOT902-1	NXP Semiconductors	Footprint for reflow soldering SOT902-1	Original	PDF
SOT902-1	NXP Semiconductors	Plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm	Original	PDF
SOT902-1_125	NXP Semiconductors	XQFN8(U); Reel pack, reverse; SMD, 7"Q3/T4 Standard product orientationOrderable part number ending ,125 or HOrdering code (12NC) ending 125	Original	PDF
SOT902-2	NXP Semiconductors	Footprint for reflow soldering SOT902-2	Original	PDF
SOT902-2_125	NXP Semiconductors	XQFN8(U); Reel pack, reverse; SMD, 7"Q3/T4 Standard product orientationOrderable part number ending ,125 or HOrdering code (12NC) ending 125	Original	PDF
SOT902-3	NXP Semiconductors	Footprint for reflow soldering SOT902-3	Original	PDF
SOT902-3	NXP Semiconductors	Plastic extremely thin quad flat package; no leads; 8 terminals	Original	PDF
SOT903-1	NXP Semiconductors	Plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm	Original	PDF
SOT903-1	NXP Semiconductors	Footprint for reflow soldering SOT903-1	Original	PDF
SOT903-2	NXP Semiconductors	Plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based	Original	PDF
SOT904-1	NXP Semiconductors	Plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm	Original	PDF
SOT905-1	NXP Semiconductors	Plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3 x 3 x 0.85 mm	Original	PDF

SOT905-1_118	NXP Semiconductors	HVQFN24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118	Original	PDF
SOT906-1	NXP Semiconductors	Plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm	Original	PDF
SOT906-2	NXP Semiconductors	Footprint SOT906-2	Original	PDF
SOT906-5	NXP Semiconductors	Plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm	Original	PDF
SOT908-1	NXP Semiconductors	Footprint for reflow soldering SOT908-1	Original	PDF
SOT908-1	NXP Semiconductors	Plastic thermal enhanced very thin small outline package; no leads; 8 terminals	Original	PDF

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SOT9 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
SOT539A Abstract: SOT975B SOT540A SOT538A sot538b sot988 SOT608B Text: Air-cavity plastic packages SOT987B SOT895A Bias/temperature sensing SOT981A SOT988B SOT896B Bias/temperature sensing SOT986B Push-pull conﬁguration SOT982A MMIC conﬁguration SOT980A SOT1015BG Bias/temperature sensing Increase the ﬂexibility of application-speciﬁc design by using LDMOS RF power	Original	OT987B OT895A OT981A OT988B OT896B OT986B OT982A OT980A OT1015BG OT538A SOT539A SOT975B SOT540A SOT538A sot538b sot988 SOT608B	PDF
Untitled Abstract: No abstract text available Text: SOT905-1 HVQFN24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal	Original	OT905-1 HVQFN24; 001aak603 OT905-1	PDF
Untitled Abstract: No abstract text available Text: Package outline HLSON10R: plastic thermal enhanced low profile small outline package; no leads; 10 terminals; resin based; body 4 x 4 x 1.1 mm SOT931-1 X A B D E A A1 terminal 1 index area detail X e1 terminal 1 index area L1 v w b e 1 5 M M C C A B C y1 C	Original	HLSON10R: OT931-1	PDF
Untitled Abstract: No abstract text available Text: Package outline DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 X A B D A E A1 c terminal 1 index area detail X terminal 1 index area e e1 1 6 C C A B C v w b y1 C y L k Eh	Original	DFN1714-8: OT972-2 sot972-2	PDF
Untitled Abstract: No abstract text available Text: Package outline BGA564: plastic ball grid array package; 564 balls; body 40 x 40 x 1.75 mm SOT947-1 B D D1 A ball A1 index area E1 E A A1 A2 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E	Original	BGA564: OT947-1 MS-034	PDF
Untitled Abstract: No abstract text available Text: Package outline TQFP64: plastic thin quad flat package; 64 leads; body 7 x 7 x 1 mm SOT928-1 c y X A 48 33 32 49 ZE e E w pin 1 index HE A A2 A3 A1 M θ bp Lp L 17 64 1 detail X 16 ZD e bp w v M A v M B M B D HD 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)	Original	TQFP64: OT928-1 MS-026	PDF
Untitled Abstract: No abstract text available Text: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e ∅v ∅w b e C C A B C M M y y1 C H G F e E e2 D C 1/2 e B A ball A1 index area 1 2 3 4 5 6 7 8	Original	TFBGA64: OT969-1	PDF
Untitled Abstract: No abstract text available Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	TFBGA64 OT962-1 OT962-1	PDF
Untitled Abstract: No abstract text available Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area	Original	LFBGA208: OT966-1	PDF
Untitled Abstract: No abstract text available Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA56 package SOT911-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste	Original	TFBGA56 OT911-1 OT911-1	PDF
Untitled Abstract: No abstract text available Text: Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm B D SOT950-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A e e2 ball A1 index area	Original	TFBGA208: OT950-1	PDF
Untitled Abstract: No abstract text available Text: SOT991-1 VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal	Original	OT991-1 VFBGA56; 001aak603 OT991-1	PDF
Untitled Abstract: No abstract text available Text: Package outline XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 1 2 mm scale Dimensions mm are the original dimensions	Original	OT996-2 sot996-2	PDF
Untitled Abstract: No abstract text available Text: Package outline HLQFN78R: plastic thermal enhanced low profile quad flat package; no leads; 78 terminals; resin based; body 12 x 12 x 1.15 mm B D SOT967-1 A terminal 1 index area E A detail X e1 eR L1 L D2 A14 v w b e A26 B10 D3 A13 M M C C A B C y1 C y A27	Original	HLQFN78R: OT967-1	PDF

Untitled Abstract: No abstract text available Text: Package outline HLQFN56R: plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.35 mm B D SOT935-2 A terminal 1 index area E A detail X e1 e L1 L C b 1/2 e 15 28 14 C A B C v w y1 C y 29 e e2 Eh 1 terminal 1	Original	HLQFN56R: OT935-2 sot935-2	PDF
Untitled Abstract: No abstract text available Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9	Original	TFBGA256: OT999-1 MO-195	PDF
Untitled Abstract: No abstract text available Text: Package outline HUQFN88U: plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; UTLP based; body 6 x 6 x 0.55 mm B D SOT942-1 A terminal 1 index area E A A1 detail X e2 v w M eR L e1 C A B C M A11 v w b 1/2 e A12 B11 D2 L1 C e A22	Original	HUQFN88U: OT942-1	PDF
250 B 340 smd Transistor Abstract: No abstract text available Text: PBSS4021SP 20 V, 6.3 A PNP/PNP low VCEsat BISS transistor Rev. 2 — 11 October 2010 Product data sheet 1. Product profile 1.1 General description PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT96-1 (SO8) medium power Surface-Mounted Device (SMD) plastic package.	Original	PBSS4021SP OT96-1 PBSS4021SN PBSS4021SPN 250 B 340 smd Transistor	PDF
TRANSISTOR SMD MARKING CODE 210 Abstract: 250 B 340 smd Transistor 4032SPN marking code 33 SMD ic transistor smd code marking 420 TRANSISTOR SMD MARKING CODE 42 TRANSISTOR SMD MARKING CODES MARKING SMD PNP TRANSISTOR FR Text: PBSS4032SPN 30 V NPN/PNP low VCEsat BISS transistor Rev. 2 — 14 October 2010 Product data sheet 1. Product profile 1.1 General description NPN/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT96-1 (SO8) medium power Surface-Mounted Device (SMD) plastic package.	Original	PBSS4032SPN OT96-1 PBSS4032SN PBSS4032SP TRANSISTOR SMD MARKING CODE 210 250 B 340 smd Transistor 4032SPN marking code 33 SMD ic transistor smd code marking 420 TRANSISTOR SMD MARKING CODE 42 TRANSISTOR SMD MARKING CODES MARKING SMD PNP TRANSISTOR FR	PDF
SOT96 Abstract: No abstract text available Text: SO 8 SOT96-1 Tape reel SMD; standard product orientation 12NC ending 115 Rev. 1 — 23 November 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal	Original	OT96-1 msc074 OT96-1 SOT96	PDF
Untitled Abstract: No abstract text available Text: Package outline HVSON8: plastic, thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT908-2 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e C b 1 C A B C v w 4 y y1 C L k Eh 8 5 Dh 1 Dimensions	Original	OT908-2 MO-229 sot908-2	PDF
Untitled Abstract: No abstract text available Text: Package outline TFBGA84: plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm B D SOT904-1 A ball A1 index area A E A2 A1 detail X e1 ∅v ∅w b e C M M C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6	Original	TFBGA84: OT904-1 MO-195	PDF
BUW13 Abstract: BUW13A buw13a philips semiconductor BA102 BUW13A-S Philips BUW13A Text: Product specification Philips Semiconductors BUW13; BUW13A Silicon diffused power transistors High-voltage, high-speed, glass-passivated npn power transistors in a SOT93 envelope, intended fo r use in converters, inverters, sw itching regulators, m oto r co n tro l systems etc.	OCR Scan	BUW13; BUW13A BUW13 711D6Eb 0D777T7 711G82b BUW13A buw13a philips semiconductor BA102 BUW13A-S Philips BUW13A	PDF
buw13a philips semiconductor Abstract: buw13a BUW13 S0T93 BUW1 buw13a philips Text: Product specification Philips Semiconductors Silicon diffused power transistors BUW13; BUW13A High-voltage, high-speed, glass-passivated npn power transistors in a SOT93 envelope, intended for use in converters, inverters, switching regulators, motor control systems etc.	OCR Scan	BUW13; BUW13A BUW13 S0T93. 0D777T7 77R7043 711002b buw13a philips semiconductor buw13a S0T93 BUW1 buw13a philips	PDF

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SOT9 Search Results

SOT9 Price and Stock

Vishay Huntington FSOT9509E5R000JE

Fischer Elektronik GmbH & Co KG SK-02-75-ME-CB-SOT-9

Fischer Elektronik GmbH & Co KG SK-04-75-SA-CB-SOT-9

Fischer Elektronik GmbH & Co KG SK-20-75-ME-CB-SOT-9

Fischer Elektronik GmbH & Co KG SK-31-50-AL-CB-SOT-9

SOT9 Datasheets (135)

SOT9 Datasheets Context Search

SOT539A

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250 B 340 smd Transistor

TRANSISTOR SMD MARKING CODE 210

SOT96

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BUW13

buw13a philips semiconductor