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    SOT9 Price and Stock

    Fischer Elektronik GmbH & Co KG FK-206-SA-L-SOT-9

    Fans, Blower, Thermal Management
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FK-206-SA-L-SOT-9 Bulk 100
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    • 100 $1.1
    • 1000 $1.1
    • 10000 $1.1
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    Fischer Elektronik GmbH & Co KG FK-207-SA-L-SOT-9

    Fans, Blower, Thermal Management
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FK-207-SA-L-SOT-9 Bulk 100
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    • 100 $1.034
    • 1000 $1.034
    • 10000 $1.034
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    Fischer Elektronik GmbH & Co KG FK-205-SA-L-SOT-9

    Fans, Blower, Thermal Management
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FK-205-SA-L-SOT-9 Bulk 100
    • 1 -
    • 10 -
    • 100 $1.144
    • 1000 $1.144
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    Fischer Elektronik GmbH & Co KG FK-208-SA-L-SOT-9

    Fans, Blower, Thermal Management
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FK-208-SA-L-SOT-9 Bulk 100
    • 1 -
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    • 100 $0.968
    • 1000 $0.968
    • 10000 $0.968
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    Fischer Elektronik GmbH & Co KG FK-202-SA-CB-SOT-9

    Fans, Blower, Thermal Management
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    DigiKey FK-202-SA-CB-SOT-9 Bulk 100
    • 1 -
    • 10 -
    • 100 $1.001
    • 1000 $1.001
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    Find more SOT9 price and stock on Findchips.com

    SOT9 Datasheets (135)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT900-1 NXP Semiconductors Plastic thermal enhanced ball grid array package; 456 balls; body 27 x 27 x 1.75 mm; heatsink Original PDF
    SOT901-1 NXP Semiconductors Plastic ball grid array package; 400 balls; body 27 x 27 x 1.75 mm Original PDF
    SOT902-1 NXP Semiconductors Footprint for reflow soldering SOT902-1 Original PDF
    SOT902-1 NXP Semiconductors Plastic extremely thin quad flat package; no leads; 8 terminals; UTLP based; body 1.6 x 1.6 x 0.5 mm Original PDF
    SOT902-1_125 NXP Semiconductors XQFN8(U); Reel pack, reverse; SMD, 7"Q3/T4 Standard product orientationOrderable part number ending ,125 or HOrdering code (12NC) ending 125 Original PDF
    SOT902-2 NXP Semiconductors Footprint for reflow soldering SOT902-2 Original PDF
    SOT902-2_125 NXP Semiconductors XQFN8(U); Reel pack, reverse; SMD, 7"Q3/T4 Standard product orientationOrderable part number ending ,125 or HOrdering code (12NC) ending 125 Original PDF
    SOT902-3 NXP Semiconductors Footprint for reflow soldering SOT902-3 Original PDF
    SOT902-3 NXP Semiconductors Plastic extremely thin quad flat package; no leads; 8 terminals Original PDF
    SOT903-1 NXP Semiconductors Plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based; body 9 x 9 x 1.6 mm Original PDF
    SOT903-1 NXP Semiconductors Footprint for reflow soldering SOT903-1 Original PDF
    SOT903-2 NXP Semiconductors Plastic thermal enhanced low profile quad flat package; no leads; 64 terminals; resin based Original PDF
    SOT904-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm Original PDF
    SOT905-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 24 terminals; body 3 x 3 x 0.85 mm Original PDF
    SOT905-1_118 NXP Semiconductors HVQFN24; Reel pack; SMD, 13"Q1/T1 Standard product orientationOrderable part number ending ,118 or JOrdering code (12NC) ending 118 Original PDF
    SOT906-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm Original PDF
    SOT906-2 NXP Semiconductors Footprint SOT906-2 Original PDF
    SOT906-5 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 88 terminals; body 10 x 10 x 0.85 mm Original PDF
    SOT908-1 NXP Semiconductors Footprint for reflow soldering SOT908-1 Original PDF
    SOT908-1 NXP Semiconductors Plastic thermal enhanced very thin small outline package; no leads; 8 terminals Original PDF
    ...

    SOT9 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SOT539A

    Abstract: SOT975B SOT540A SOT538A sot538b sot988 SOT608B
    Text: Air-cavity plastic packages SOT987B SOT895A Bias/temperature sensing SOT981A SOT988B SOT896B Bias/temperature sensing SOT986B Push-pull configuration SOT982A MMIC configuration SOT980A SOT1015BG Bias/temperature sensing Increase the flexibility of application-specific design by using LDMOS RF power


    Original     		PDF OT987B OT895A OT981A OT988B OT896B OT986B OT982A OT980A OT1015BG OT538A SOT539A SOT975B SOT540A SOT538A sot538b sot988 SOT608B

    Untitled

    Abstract: No abstract text available
    Text: SOT905-1 HVQFN24; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


    Original     		PDF OT905-1 HVQFN24; 001aak603 OT905-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLSON10R: plastic thermal enhanced low profile small outline package; no leads; 10 terminals; resin based; body 4 x 4 x 1.1 mm SOT931-1 X A B D E A A1 terminal 1 index area detail X e1 terminal 1 index area L1 v w b e 1 5 M M C C A B C y1 C


    Original     		PDF HLSON10R: OT931-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline DFN1714-8: plastic, thermal enhanced extremely thin small outline package; no leads; 8 terminals; body 1.35 x 1.7 x 0.5 mm SOT972-2 X A B D A E A1 c terminal 1 index area detail X terminal 1 index area e e1 1 6 C C A B C v w b y1 C y L k Eh


    Original     		PDF DFN1714-8: OT972-2 sot972-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline BGA564: plastic ball grid array package; 564 balls; body 40 x 40 x 1.75 mm SOT947-1 B D D1 A ball A1 index area E1 E A A1 A2 detail X e1 e ∅v ∅w b 1/2 e M M C C A B C y y1 C AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E


    Original     		PDF BGA564: OT947-1 MS-034

    Untitled

    Abstract: No abstract text available
    Text: Package outline TQFP64: plastic thin quad flat package; 64 leads; body 7 x 7 x 1 mm SOT928-1 c y X A 48 33 32 49 ZE e E w pin 1 index HE A A2 A3 A1 M θ bp Lp L 17 64 1 detail X 16 ZD e bp w v M A v M B M B D HD 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)


    Original     		PDF TQFP64: OT928-1 MS-026

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls; body 4 x 4 x 0.8 mm A B D SOT969-1 ball A1 index area E A A2 A1 detail X e1 1/2 e ∅v ∅w b e C C A B C M M y y1 C H G F e E e2 D C 1/2 e B A ball A1 index area 1 2 3 4 5 6 7 8


    Original     		PDF TFBGA64: OT969-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA64 package SOT962-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF TFBGA64 OT962-1 OT962-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA208: plastic low profile fine-pitch ball grid array package; 208 balls; body 12 x 12 x 1 mm B D SOT966-1 A ball A1 index area E A2 A A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A ball A1 index area


    Original     		PDF LFBGA208: OT966-1

    Untitled

    Abstract: No abstract text available
    Text: PC board footprint NXP Semiconductors Footprint information for reflow soldering of TFBGA56 package SOT911-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste


    Original     		PDF TFBGA56 OT911-1 OT911-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA208: plastic thin fine-pitch ball grid array package; 208 balls; body 15 x 15 x 0.7 mm B D SOT950-1 A ball A1 index area E A A2 A1 detail X e1 ∅v ∅w b e M M C C A B C y y1 C U T R P N M L K J H G F E D C B A e e2 ball A1 index area


    Original     		PDF TFBGA208: OT950-1

    Untitled

    Abstract: No abstract text available
    Text: SOT991-1 VFBGA56; Reel pack; SMD, 13" Q1/T1 Standard product orientation Orderable part number ending ,118 or J Ordering code 12NC ending 118 Rev. 1 — 19 April 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape QA Seal


    Original     		PDF OT991-1 VFBGA56; 001aak603 OT991-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline XSON8: plastic extremely thin small outline package; no leads; 8 terminals; body 3 x 2 x 0.5 mm B D SOT996-2 A E A A1 detail X terminal 1 index area e1 1 4 8 5 C C A B C v w b e L1 y y1 C L2 L X 1 2 mm scale Dimensions mm are the original dimensions


    Original     		PDF OT996-2 sot996-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLQFN78R: plastic thermal enhanced low profile quad flat package; no leads; 78 terminals; resin based; body 12 x 12 x 1.15 mm B D SOT967-1 A terminal 1 index area E A detail X e1 eR L1 L D2 A14 v w b e A26 B10 D3 A13 M M C C A B C y1 C y A27


    Original     		PDF HLQFN78R: OT967-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HLQFN56R: plastic thermal enhanced low profile quad flat package; no leads; 56 terminals; resin based; body 8 x 8 x 1.35 mm B D SOT935-2 A terminal 1 index area E A detail X e1 e L1 L C b 1/2 e 15 28 14 C A B C v w y1 C y 29 e e2 Eh 1 terminal 1


    Original     		PDF HLQFN56R: OT935-2 sot935-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA256: plastic thin fine-pitch ball grid array package; 256 balls A B D SOT999-1 ball A1 index area E A A2 A1 detail X e1 e ∅v ∅w b W V U T R P N M L K J H G F E D C B A ball A1 index area M M C C A B C y y1 C e e2 1 2 3 4 5 6 7 8 9


    Original     		PDF TFBGA256: OT999-1 MO-195

    Untitled

    Abstract: No abstract text available
    Text: Package outline HUQFN88U: plastic thermal enhanced ultra thin quad flat package; no leads; 88 terminals; UTLP based; body 6 x 6 x 0.55 mm B D SOT942-1 A terminal 1 index area E A A1 detail X e2 v w M eR L e1 C A B C M A11 v w b 1/2 e A12 B11 D2 L1 C e A22


    Original     		PDF HUQFN88U: OT942-1

    250 B 340 smd Transistor

    Abstract: No abstract text available
    Text: PBSS4021SP 20 V, 6.3 A PNP/PNP low VCEsat BISS transistor Rev. 2 — 11 October 2010 Product data sheet 1. Product profile 1.1 General description PNP/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT96-1 (SO8) medium power Surface-Mounted Device (SMD) plastic package.


    Original     		PDF PBSS4021SP OT96-1 PBSS4021SN PBSS4021SPN 250 B 340 smd Transistor

    TRANSISTOR SMD MARKING CODE 210

    Abstract: 250 B 340 smd Transistor 4032SPN marking code 33 SMD ic transistor smd code marking 420 TRANSISTOR SMD MARKING CODE 42 TRANSISTOR SMD MARKING CODES MARKING SMD PNP TRANSISTOR FR
    Text: PBSS4032SPN 30 V NPN/PNP low VCEsat BISS transistor Rev. 2 — 14 October 2010 Product data sheet 1. Product profile 1.1 General description NPN/PNP low VCEsat Breakthrough In Small Signal (BISS) transistor in a SOT96-1 (SO8) medium power Surface-Mounted Device (SMD) plastic package.


    Original     		PDF PBSS4032SPN OT96-1 PBSS4032SN PBSS4032SP TRANSISTOR SMD MARKING CODE 210 250 B 340 smd Transistor 4032SPN marking code 33 SMD ic transistor smd code marking 420 TRANSISTOR SMD MARKING CODE 42 TRANSISTOR SMD MARKING CODES MARKING SMD PNP TRANSISTOR FR

    SOT96

    Abstract: No abstract text available
    Text: SO 8 SOT96-1 Tape reel SMD; standard product orientation 12NC ending 115 Rev. 1 — 23 November 2012 Packing information 1. Packing method Printed plano box Barcode label Reel Tape Barcode label Circular sprocket holes opposite the label side of reel QA Seal


    Original     		PDF OT96-1 msc074 OT96-1 SOT96

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVSON8: plastic, thermal enhanced very thin small outline package; no leads; 8 terminals; body 3 x 3 x 0.85 mm SOT908-2 X A B D E A A1 c terminal 1 index area detail X e1 terminal 1 index area e C b 1 C A B C v w 4 y y1 C L k Eh 8 5 Dh 1 Dimensions


    Original     		PDF OT908-2 MO-229 sot908-2

    Untitled

    Abstract: No abstract text available
    Text: Package outline TFBGA84: plastic thin fine-pitch ball grid array package; 84 balls; body 7 x 7 x 0.8 mm B D SOT904-1 A ball A1 index area A E A2 A1 detail X e1 ∅v ∅w b e C M M C A B C y y1 C N M L e K J H e2 G F E D C B A ball A1 index area 1 2 3 4 5 6


    Original     		PDF TFBGA84: OT904-1 MO-195

    BUW13

    Abstract: BUW13A buw13a philips semiconductor BA102 BUW13A-S Philips BUW13A
    Text: Product specification Philips Semiconductors BUW13; BUW13A Silicon diffused power transistors High-voltage, high-speed, glass-passivated npn power transistors in a SOT93 envelope, intended fo r use in converters, inverters, sw itching regulators, m oto r co n tro l systems etc.


    OCR Scan     		PDF BUW13; BUW13A BUW13 711D6Eb 0D777T7 711G82b BUW13A buw13a philips semiconductor BA102 BUW13A-S Philips BUW13A

    buw13a philips semiconductor

    Abstract: buw13a BUW13 S0T93 BUW1 buw13a philips
    Text: Product specification Philips Semiconductors Silicon diffused power transistors BUW13; BUW13A High-voltage, high-speed, glass-passivated npn power transistors in a SOT93 envelope, intended for use in converters, inverters, switching regulators, motor control systems etc.


    OCR Scan     		PDF BUW13; BUW13A BUW13 S0T93. 0D777T7 77R7043 711002b buw13a philips semiconductor buw13a S0T93 BUW1 buw13a philips