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    PCN0602

    Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700
    Text: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad


    Original     		PDF PCN0602 E730SJ Sumitomo-G700 EME-E730SJ x10-5/ x102N/mm2 UL-94 PCN0602 sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700

    sumitomo G700

    Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound
    Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF

    PCN0903

    Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type
    Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of


    Original     		PDF PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type

    SUMITOMO g700l

    Abstract: Ablestik 84-1LMIT1 G600 mold compound g700l G600 material composition sumitomo epoxy novolac SUMITOMO g600 bond wire gold 84-1LMIT1 Sumitomo EME6600D
    Text: SOT26 GaAs 20 Alpha Rd Chelmsford MA 01824 Tel:{978} 250-3343 Fax: {978} 250-3373 Product Information Product Environmental Data Sheet Date/Time Revision: Manufacture site: Product Number Product Name Product Mass Product Note February 25, 2005 Chelmsford MA


    Original     		PDF EME6600D SUMITOMO g700l Ablestik 84-1LMIT1 G600 mold compound g700l G600 material composition sumitomo epoxy novolac SUMITOMO g600 bond wire gold 84-1LMIT1 Sumitomo EME6600D

    SUMITOMO g700l

    Abstract: C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L
    Text: 04/19/2006 PACKAGE RELIABILITY REPORT FOR ATK, 100 LQFP, 14x14x1.4mm Level 3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292


    Original     		PDF 14x14x1 SUMITOMO g700l C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L

    Sumitomo G700K

    Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL

    ABLEBOND

    Abstract: No abstract text available
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1086L, JESD78, ABLEBOND

    G700K

    Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026

    Nitto MP8000

    Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026

    Sumitomo G700K

    Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K
    Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com


    Original     		PDF DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K

    g700l

    Abstract: G700LX JESD22-A108 G700* sumitomo jedec jesd22-a108 JESD A114 A114 transistor A114 100PF JESD22-A114
    Text: RELIABILITY REPORT # 09-142 FOR SP508CF-L Six Layers Mask Change October 26, 2009 EXAR CORPORATION 48720 Kato Road, Fremont, CA 94538 Phone # 510 668-7000/ Fax # (510) 668-7022 Report #: 09-142 GENERAL INFORMATION CHIP DATA PACKAGE DATA FAB: Episil ASSEMBLY:


    Original     		PDF SP508CF-L BA230466E 14x14x1 327x234 G700LX JESD22-A114 JESD22-A108 100PF g700l G700LX JESD22-A108 G700* sumitomo jedec jesd22-a108 JESD A114 A114 transistor A114 100PF JESD22-A114

    HMC916LP3

    Abstract: SUMITOMO EME G700 hmc424lp3e SUMITOMO G700 HMC905LP3
    Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached Package Type: 6L LP2, 16L LP3 Package Style: 16L 3x3mm QFN Package


    Original     		PDF HMC424LP3E HMC536LP2 HMC546LP2 HMC646LP2 HMC652LP2 HMC653LP2 HMC654LP2 HMC655LP2 HMC656LP2 HMC657LP2 HMC916LP3 SUMITOMO EME G700 hmc424lp3e SUMITOMO G700 HMC905LP3

    STMicroelectronics marking code date

    Abstract: CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING
    Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/578 M50FW, M50LPW, M50FLW Firmware Hub and Low Pin Count Product Families, TSOP40 Environmental Friendly Package and Assembly Location Change WHAT IS THE CHANGE? The present PCN replaces and upgrades PCN MPG/EE/0086 / CPCN MPG/EEP/04/450.


    Original     		PDF MPG-EEP/04/578 M50FW, M50LPW, M50FLW TSOP40 MPG/EE/0086 MPG/EEP/04/450. STMicroelectronics marking code date CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING

    CV-8710

    Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy
    Text:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010


    Original     		PDF JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy