SUMITOMO EPOXY G700 Search Results

SUMITOMO EPOXY G700 Datasheets Context Search

Catalog Datasheet	MFG & Type	Document Tags	PDF
PCN0602 Abstract: sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700 Text: PROCESS CHANGE NOTIFICATION PCN0602 MOLD COMPOUND CHANGE FOR CYCLONE II PQFP & TQFP PACKAGES Change Description: Altera is adopting the Sumitomo G700 series mold compound as the standard mold material on its Cyclone™ II low-k dielectric Plastic Quad Flat Pack PQFP and Plastic Thin Quad	Original	PCN0602 E730SJ Sumitomo-G700 EME-E730SJ x10-5/ x102N/mm2 UL-94 PCN0602 sumitomo G700 sumitomo G700 Tg sumitomo epoxy sumitomo g700 type g700 mold compound G700 SUMITOMO Tg G700 sumitomo g700 mold compound sumitomo epoxy G700	PDF
sumitomo G700 Abstract: sumitomo epoxy 1076 0038 tsop ablebond Sumitomo 1076 8361J Compound c7025 Die Attach epoxy stamping sumitomo g700 type g700 mold compound Text: 10/29/2004 PACKAGE RELIABILITY REPORT FOR 32 TSOP 8mm Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com	Original		PDF
PCN0903 Abstract: Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type Text: Revision: 1.0.1 PROCESS CHANGE NOTIFICATION PCN0903 ALTERNATIVE ASSEMBLY SITE FOR THE EPC CONFIGURATION FAMILY Change Description Altera is introducing Amkor, Philippines ATP and Amkor, Korea (ATK) as additional assembly sources for the EPC configuration devices. The EPC devices are currently assembled out of	Original	PCN0903 PCN0903 Hitachi Datecode SUMITOMO G700 Nitto GE100LFCS GE100LFCS Hitachi FH920 Ablestik 2025D ablestik 2288a EPC16UI88AA sumitomo g700 type	PDF
SUMITOMO g700l Abstract: Ablestik 84-1LMIT1 G600 mold compound g700l G600 material composition sumitomo epoxy novolac SUMITOMO g600 bond wire gold 84-1LMIT1 Sumitomo EME6600D Text: SOT26 GaAs 20 Alpha Rd Chelmsford MA 01824 Tel:{978} 250-3343 Fax: {978} 250-3373 Product Information Product Environmental Data Sheet Date/Time Revision: Manufacture site: Product Number Product Name Product Mass Product Note February 25, 2005 Chelmsford MA	Original	EME6600D SUMITOMO g700l Ablestik 84-1LMIT1 G600 mold compound g700l G600 material composition sumitomo epoxy novolac SUMITOMO g600 bond wire gold 84-1LMIT1 Sumitomo EME6600D	PDF
SUMITOMO g700l Abstract: C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L Text: 04/19/2006 PACKAGE RELIABILITY REPORT FOR ATK, 100 LQFP, 14x14x1.4mm Level 3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292	Original	14x14x1 SUMITOMO g700l C18045 8361J J-STD-020 G700* sumitomo JESD22-B105 G700L	PDF
Sumitomo G700K Abstract: sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL Text: 8/29/2006 RELIABILITY REPORT FOR DS1077, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com	Original	DS1077, JESD78, Sumitomo G700K sumitomo 6600h Compound c7025 JESD22-B101 Nitto MP8000 G700K SUMITOMO-G600 epoxy 8290 ablebond ablestik 8290 SUMITOMO g600 UL	PDF
ABLEBOND Abstract: No abstract text available Text: 8/29/2006 RELIABILITY REPORT FOR DS1086L, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com	Original	DS1086L, JESD78, ABLEBOND	PDF
G700K Abstract: Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026 Text: 8/29/2006 RELIABILITY REPORT FOR DS1077L, Rev C2 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com	Original	DS1077L, JESD78, G700K Nitto MP8000 Sumitomo G600 Sumitomo G700K JESD78 sumitomo 6600h Compound c7025 JESD-78 BCB4026	PDF
Nitto MP8000 Abstract: Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026 Text: 8/29/2006 RELIABILITY REPORT FOR DS1086, Rev A1 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com	Original	DS1086, JESD78, Nitto MP8000 Sumitomo G700K g700k JESD78 JESD-78 sumitomo 6600h ablebond ablestik BCB4026	PDF
Sumitomo G700K Abstract: SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K Text: 8/29/2006 RELIABILITY REPORT FOR DS1094L, Rev A3 Dallas Semiconductor 4401 South Beltwood Parkway Dallas, TX 75244-3292 Prepared by: Ken Wendel Reliability Engineering Manager Dallas Semiconductor 4401 South Beltwood Pkwy. Dallas, TX 75244-3292 Email : ken.wendel@dalsemi.com	Original	DS1094L, JESD78, Sumitomo G700K SUMITOMO g600 Ablestik 84-1 sumitomo 6600h G700K	PDF
g700l Abstract: G700LX JESD22-A108 G700* sumitomo jedec jesd22-a108 JESD A114 A114 transistor A114 100PF JESD22-A114 Text: RELIABILITY REPORT # 09-142 FOR SP508CF-L Six Layers Mask Change October 26, 2009 EXAR CORPORATION 48720 Kato Road, Fremont, CA 94538 Phone # 510 668-7000/ Fax # (510) 668-7022 Report #: 09-142 GENERAL INFORMATION CHIP DATA PACKAGE DATA FAB: Episil ASSEMBLY:	Original	SP508CF-L BA230466E 14x14x1 327x234 G700LX JESD22-A114 JESD22-A108 100PF g700l G700LX JESD22-A108 G700* sumitomo jedec jesd22-a108 JESD A114 A114 transistor A114 100PF JESD22-A114	PDF
HMC916LP3 Abstract: SUMITOMO EME G700 hmc424lp3e SUMITOMO G700 HMC905LP3 Text: Analog Devices Welcomes Hittite Microwave Corporation NO CONTENT ON THE ATTACHED DOCUMENT HAS CHANGED www.analog.com www.hittite.com Report Title: Qualification Test Report Report Type: See Attached Date: See Attached Package Type: 6L LP2, 16L LP3 Package Style: 16L 3x3mm QFN Package	Original	HMC424LP3E HMC536LP2 HMC546LP2 HMC646LP2 HMC652LP2 HMC653LP2 HMC654LP2 HMC655LP2 HMC656LP2 HMC657LP2 HMC916LP3 SUMITOMO EME G700 hmc424lp3e SUMITOMO G700 HMC905LP3	PDF
STMicroelectronics marking code date Abstract: CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING Text: PRODUCT/PROCESS CHANGE NOTIFICATION PCN MPG-EEP/04/578 M50FW, M50LPW, M50FLW Firmware Hub and Low Pin Count Product Families, TSOP40 Environmental Friendly Package and Assembly Location Change WHAT IS THE CHANGE? The present PCN replaces and upgrades PCN MPG/EE/0086 / CPCN MPG/EEP/04/450.	Original	MPG-EEP/04/578 M50FW, M50LPW, M50FLW TSOP40 MPG/EE/0086 MPG/EEP/04/450. STMicroelectronics marking code date CHN G4 chn 509 marking code stmicroelectronics Date Code Marking STMicroelectronics CHN 450 SUMITOMO G700 ablebond 8290 Part Marking STMicroelectronics ST MICROELECTRONICS DATE CODE MARKING	PDF
CV-8710 Abstract: EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy Text:  Chapter 3 Package Materials CHAPTER 3 PACKAGE MATERIALS Introduction JIG-101 Ed 3.0 Declarable Substance List Reporting of 38 Substances of Very High Concern EU REACH Material Declaration Sheets Packages and Packing Methodologies Handbook 6 Jul 2010	Original	JIG-101 CV-8710 EME-G770HCD Sumitomo EME-G600 material SUMITOMO EME G770 EME-G760 MGC CCL-HL832 EME-G600 CCL-HL832 sumitomo g770 Ablestik ablebond 3230 epoxy	PDF