Untitled
Abstract: No abstract text available
Text: x M A T E R I A L , H O L S I N G , HIGH T E M P . P L A S T I C , CONTACT: COPPER ALLOY LOCK L E V E E : SUS30I T I N E L A T I N G . UL 9^V - 0 ^ F I N I S H ; C O N T A C T A F l P A : 0 . 0 0 0 25 MI N G O _ D P L T ON 0 . 0 0 1 MI N A L L O V E R N I C K E L
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SUS30I
330nm,
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3144P
Abstract: No abstract text available
Text: p ihcmtowud RELEASED PER OtSD-DIIS-' REVISED PER 0G50- 00-II - 99 POST t POST <t A A 3. A A A\ A a A HATER I A L , H O U SI N G, HIGH T EMP E RA TU R E P L A S T I C CONTACT; COPPER ALLOY LOCK L E V E R : SUS30I T I N LE AD P L A T I N G . E IN IS H ; CONTACT AREA: 0.00025
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00-II
SUS30I
UL94V-0.
3144P
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Untitled
Abstract: No abstract text available
Text: pikmromo RELEAIS 3-I PER NPR 47-13 REVISED PCR 0G50-<I<IJi-9-B REVISED PER ÜG50-0031 -99 A A 3. MATERIAL. HOUSING, HIGH TEMPERATURE P L A S T 1C. U L 9 4 V - 0 , CONTACT: COPPER ALLOY LATCH: SUS30I STAINLESS STEEL PLATING. FINISH; CONTACT AREA : 0.00025
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G50-0031
SUS30I
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Untitled
Abstract: No abstract text available
Text: Thu w ivi he is imphi m i O ttMUjHl I» REIEAES 3-•I PER DPR ST-13 REVISED PER OG50-003 J-M REVISED PER I A A 3. • 6 9 . 9 ± 0 . 7• •67.9 SLOT MATER I A L . HOUS ING, HIGH TEMPERATURE P L A S T I C , U L 9 4 V -0 , CONTACT: COPPER ALLOY LATCH: SUS30I
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ST-13
OG50-003
SUS30I
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SUS30I
Abstract: No abstract text available
Text: 2 TH I S ß l D R A W I NG COPYRIGHT IS UNPUBLI SHED. 19 RELEASED BY A MP I NCORPORATE D . ALL FOR PUBLICATION RIGHTS . I9 LOC RESERVED. R E V ISIONS Dl S T AG 53 LTR DE S C R I P T I O N RELEAES PER OG5 0 - 0 I 4 7 - 9 9 RELEASED 6 DWN DATE P E R OS I D - 0 0 1 I - 9 9
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SUS30I
0n77Q
27JUN96
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ZL44
Abstract: SS39
Text: T H IS D R A W IN G ß l COPYRIGHT IS U NP UB LI SHED. 19 RELEASED BY AMP IN C O R P O R A T E D . ALL FOR PUBLICATION RIGHTS . I9 Dl ST LOC REV I S I O N S DY RESERVED. LTR DE SC R I P T I O N REVISED P E R OS I D - 0 I 3 9 - 0 0 E C OC T R A N S F E R DWN
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OSID-0140-00
FPOO-03
IJAN01
27JUN96
ZL44
SS39
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Untitled
Abstract: No abstract text available
Text: TH I S DRAW I NG I S U N P U B L I S H E D . ß l COPYRIGHT 19 R E L E A S E D FOR P U B L I C A T I O N BY AMP ALL IN C O R P O R A T E D . RIGHTS . I9 LOC RESERVED. R EV I S I O N S Dl ST DY LTR DE SC R I P T I O N DWN DATE REVISED ECR-05-006240 APVD LSF
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ECR-05-006240
JIJL05
SUS30I
09MAY94
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Untitled
Abstract: No abstract text available
Text: T H IS D R A W IN G ß l COPYRIGHT IS U NP UB LI SHED. 19 RELEASED BY AMP IN C O R P O R A T E D . ALL FOR PUBLICATION RIGHTS . I9 Dl ST LOC REV I S I O N S DY RESERVED. LTR DE SC R I P T I O N REVISED DWN DAT E ECR-05-006242 3. TOLERANCES PACKAGED GOLD LSF
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ECR-05-006242
SUS30I
27JUN96
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EIA-IS-704
Abstract: EIA-IS704 amp 4805 050CT SDRAM Drawing
Text: T H IS D R A W IN G ß l COPYRIGHT IS U NP UB LI SHED. 19 RELEASED BY AMP ALL IN C O R P O R A T E D . FOR PUBLICATION RIGHTS . I9 LOC RESERVED. Dl ST REV I S I O N S DY LTR DE SC R I P T I O N REVISED DWN DAT E ECR-05-0I243I APVD 050CT05 LSF 63 t of p o s t
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09MAY94
ECR-05-012431
050CT05
UL94V-0
SUS30I
8NOV99
22JUL99
EIA-IS-704
EIA-IS704
amp 4805
050CT
SDRAM Drawing
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