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    TE32D

    Abstract: EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745
    Text: 6. PACKING INFORMATION To deliver flat IC packages, three package method are available: the same stick packages as the ordinary DIP type, taping, and embossed taping. 6-1 Stick Specifications for Flat Packages • Shape and dimensions Example: FLP type Fig. 6-1


    OCR Scan     		14-/16-pin TA7745F TA774SF TE32D EIA and EIAJ tape standards TE3212 EIA and EIAJ standards RC-1009B TA7745 PDF

    TE32D

    Abstract: TOSHIBA el SSOP20-P-225A SSOP20-P-225A EL TD62003 TE-32 TE16081
    Text: [6 ] PACKING IN FO RM ATION S 1. Tape Specification for Bipolar-Type Flat Package ICs [6 ] PACKING INFORMATIONS 1. Tape Specification for Bipolar-Type Flat Package ICs 1 A p p lic a tio n ran g e This sp e cificatio n covers ta p e p ack a g in g fo r T o shiba b ip o lar-typ e flat-pack ICs. Item s such


    OCR Scan     		PDF

    RC-1009B

    Abstract: EIA431A IC A 244 TE1204 IC504 1009b TE12041208 TE3212
    Text: [4] バイポーラ形フラットパッケージ IC のエンボステーピング仕様 [ 4 ] バイポーラ形フラットパッケージ IC エンボステーピング 仕様 1. 適用範囲 バイポーラ形 IC フラットパッケージ品のエンボステーピング包装仕様および関連事項については原則


    Original     		RC-1009B) EIA431A) TE12041208 TE160416081612 TE241224162420 TE321232163220322432283232 RC-1009B EIA431A IC A 244 TE1204 IC504 1009b TE12041208 TE3212 PDF