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    THERMAGON INTERFACE MATERIAL Search Results

    THERMAGON INTERFACE MATERIAL Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    TB67S539FTG Toshiba Electronic Devices & Storage Corporation Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=2/Clock Interface Visit Toshiba Electronic Devices & Storage Corporation
    TB67S141AFTG Toshiba Electronic Devices & Storage Corporation Stepping Motor Driver/Unipolar Type/Vout(V)=84/Iout(A)=3/Phase Interface Visit Toshiba Electronic Devices & Storage Corporation
    TB67S149AFTG Toshiba Electronic Devices & Storage Corporation Stepping Motor Driver/Unipolar Type/Vout(V)=84/Iout(A)=3/Clock Interface Visit Toshiba Electronic Devices & Storage Corporation
    TB67S549FTG Toshiba Electronic Devices & Storage Corporation Stepping Motor Driver/Bipolar Type/Vout(V)=40/Iout(A)=1.5/Clock Interface Visit Toshiba Electronic Devices & Storage Corporation
    DCL541A01 Toshiba Electronic Devices & Storage Corporation Digital Isolator / VDD=2.25~5.5V / 150Mbps / 4 channel(F:R=3:1) / Default Output Logic: Low / Input disable Visit Toshiba Electronic Devices & Storage Corporation

    THERMAGON INTERFACE MATERIAL Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Thermagon

    Abstract: WARTH E1808 Orcus ASTM D412 D149 D150 D2240 D257 D412
    Text: T-flex 600 Series T-flex™ 600 is an exceptionally soft, highly compressible gap filling interface pad with a thermal conductivity of 3 W/mK. These outstanding properties are the result of a proprietary boron nitride filler in the composition. The high conductivity, in


    Original     		PDF A13512-00 Thermagon WARTH E1808 Orcus ASTM D412 D149 D150 D2240 D257 D412

    atx P4 POWER SUPPLY

    Abstract: Phoenix trustedcore BIOS manual Thermagon Power supply ATX 350W p4 vga to s-video PINOUt Thermagon t-flex Phoenix BIOS 2.6 Phoenix Technologies 945gm 200 pin SODIMM ddr2 connector 4gb s-video TO VGA MONITOR PINOUt
    Text: PROCELERANT COM EXPRESS MODULE QUICK START GUIDE CE945GM www.radisys.com 007-02511-0000 • December 2006 Release history Release -0000 Date December 2006 Description First release. Copyright 2006 by RadiSys Technology Ireland Ltd. All rights reserved.


    Original     		PDF CE945GM CE945GM. CE945GM 945GM STAC9200 10/100/1000M atx P4 POWER SUPPLY Phoenix trustedcore BIOS manual Thermagon Power supply ATX 350W p4 vga to s-video PINOUt Thermagon t-flex Phoenix BIOS 2.6 Phoenix Technologies 945gm 200 pin SODIMM ddr2 connector 4gb s-video TO VGA MONITOR PINOUt

    RO4350B

    Abstract: RO4350 Thermagon Rogers RO4350B 62NCLR-A Solder Paste, Indium 5.1, Type 3 RO4350 properties pcb fabrication process of multilayer pcb pcb layout computer motherboard
    Text: AMMP-6408 Thermal Application Examples Application Note 5351 Introduction Typical Application The AMMP-6408 is a 1 watt power amplifier operating over the 6 to 18 GHz frequency range and is housed in a 5 x 5 mm surface mount package. The AMMP-6408 is the packaged version of Avago’s AMMC-6408 PHEMT MMIC.


    Original     		PDF AMMP-6408 AMMP-6408 AMMC-6408 mus350 10mil T2905C RO4350B RO4350 Thermagon Rogers RO4350B 62NCLR-A Solder Paste, Indium 5.1, Type 3 RO4350 properties pcb fabrication process of multilayer pcb pcb layout computer motherboard

    fcbga package weight

    Abstract: Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749
    Text: Thermal Design Guideline for Intel Processors in the BGA2 and Micro FC-BGA Packages for Embedded Applications April 2002 Order Number: 273716-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF EID-LPT-ALX-003 EID-LPT-ALX-004 EID-LPP3-ALX-001 fcbga package weight Thermagon PBGA-B495 shinetsu fcBGA PACKAGE thermal resistance Thermagon t pad Intel Mobile Celeron Processor BGA T-PCM27-94 shin-etsu G-749

    intel packaging handbook 240800

    Abstract: OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36
    Text: Pentium II Processor – Low Power Thermal Design Guide Application Note September 1999 Order Number: 273254-002 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF NP970482 NP971803 NP971804 intel packaging handbook 240800 OB-101 shicoh Thermagon PBGA-B615 BGA heatsink compressive force PCM910 5TC-TTK-36-36 CompactPCI specification 5tc-tt-k-36-36

    Sumitomo G750

    Abstract: G750 thermal conductivity Thermagon motor speed control mc-60 shicoh Thermagon t pad XTS454 T-PLI 200 thermagon Texas Instruments epoxy Sumitomo PBGA-B495
    Text: Intel Pentium® III Processor – Low Power Thermal Design Guide Application Note May 2000 Order Number: 273285-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF

    AMD-K5

    Abstract: anemometer AMD-K5 Processor Thermal grease MIL-I-49456A Chomerics* T405 296-pin K5 AMD power led heat sink Thermagon thermal grease
    Text: TM AMD-K5 PROCESSOR Thermal Considerations Application Note Publication # 20092 Issue Date: September 1996 Rev: B Amendment/0 This document contains information on a product under development at Advanced Micro Devices AMD . The information is intended to help you evaluate this product. AMD reserves the right to change or discontinue work on this proposed product without notice.


    Original     		PDF 20092B/0--Sep1996 AMD-K5 anemometer AMD-K5 Processor Thermal grease MIL-I-49456A Chomerics* T405 296-pin K5 AMD power led heat sink Thermagon thermal grease

    443BX Northbridge

    Abstract: denso "air velocity meter" Cement denso meter stamford voltage regulator Wakefield Thermal Solutions 443BX AP-825 OB-101
    Text: Pentium II Processor Mobile Module: Embedded Module Connector-2 Thermal Design Guide Application Note December 1998 Order Number: 273216-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


    Original     		PDF

    heat sensor with fan cooling working

    Abstract: FUJIKURA fan Sanyo Denki dc fan Thermagon Thermacore sumitomo water sensor FUJIKURA heat pipe heat sensor with fan cooling heat sensor with fan cooling working and elements working stamford voltage regulator
    Text: Intel Pentium® III Processor – Low-Power Module Thermal Design Guide Application Note January 2000 Order Number: 273300-001 Information in this document is provided in connection with Intel products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    82443BX Northbridge

    Abstract: heat sensor with fan cooling working t-pli 210 UDQF FUJIKURA fan Sanyo Denki dc fan denso pressure sensor miniature mass air flow sensor Thermacore pentium 4 heat sensor
    Text: Intel Pentium® II Processor – Low-Power Module Thermal Design Guide Application Note February 2000 Order Number: 273216-003 Information in this document is provided in connection with Intel® products. No license, express or implied, by estoppel or otherwise, to any intellectual


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    IXAN0029

    Abstract: D8203-3 ixan00 AB-9801 D-68623 IXFX55N50 PLUS247 SIL-PAD to-247 MOSFET IGBT THEORY AND APPLICATIONS 300Kpa
    Text: IXAN0029 AB-9801 New Packages for Pressure Mounting APPLICATION BRIEF AB-9801 Prepared by Ralph E. Locher Introduction The use of pressure to mount discrete power semiconductor packages to heat sinks has been rapidly growing for many reasons. When properly executed, it has proven to be a cost effective technique and


    Original     		PDF IXAN0029 AB-9801 800-S® 900-S® PLUS247TM D-68623; IXAN0029 D8203-3 ixan00 AB-9801 D-68623 IXFX55N50 PLUS247 SIL-PAD to-247 MOSFET IGBT THEORY AND APPLICATIONS 300Kpa

    TO274

    Abstract: aluminium pop rivet TO220 washer rectangular to220 mica WARTH austerlitz heat sink to220 powersi Redpoint an1012
    Text: Application Note AN-1012 Mounting Considerations For International Rectifier’s Power Semiconductor Packages by Pamela Dugdale and Arthur Woodworth, International Rectifier Introduction The physical source of the contact resistance is a result of the fact that surfaces are never perfectly


    Original     		PDF AN-1012 TO274 aluminium pop rivet TO220 washer rectangular to220 mica WARTH austerlitz heat sink to220 powersi Redpoint an1012

    deltabond 152

    Abstract: ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2
    Text: Thermal Design Considerations—EL75XX Application Note March 20, 1998 AN1096 Author: Vijay Soman Typical Applications Power Requirement Elantec's EL7560/EL7561/EL7556 series of voltage regulators are highly integrated, simple to use and the most effective switching mode designs to power microprocessors


    Original     		PDF Considerations--EL75XX AN1096 EL7560/EL7561/EL7556 EL7560/EL7561 EL7556 Solutions--1994 deltabond 152 ABLESTIK 84-1LMIT deltabond Wakefield Thermal Solutions TYPE 120 84-1LMIT heatsink catalogue intel 8052 laptop mother board Pentium "Voltage Regulator Module" POWERSOP2

    Wakefield Thermal Solutions TYPE 120

    Abstract: Thermagon deltabond 152 ABLESTIK 84-1LMIT deltabond intel 8052 84-1LMIT EL75XX EL7556C EL7560C
    Text: Application Note EL75XX Thermal Design Considerations Thermal Design Considerations EL75XX by Vijay Soman 1 0 Introduction The typical power applications requirement for microprocessors is either a VRM Voltage Regulator Module or a direct mother board solution


    Original     		PDF EL75XX EL75XX 28-pin 28ccessfully Wakefield Thermal Solutions TYPE 120 Thermagon deltabond 152 ABLESTIK 84-1LMIT deltabond intel 8052 84-1LMIT EL7556C EL7560C

    Thermagon T-MATE2905

    Abstract: mmx black anodized aluminum plate LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master shinetsu 855GME AF-S-10H-07B THIRD generation chassis fanless motherboard
    Text: R Intel 82854 Graphics Memory Controller Hub GMCH for Fanless Set Top Box Applications Thermal Design Guide March 2005 Revision 1.0 Reference Number: D14844-001 Legal Statements INFORMATION IN THIS DOCUMENT IS PROVIDED IN CONNECTION WITH INTEL® PRODUCTS. NO


    Original     		PDF D14844-001 335C866801A 51-SA AF-S-10H-07B ECB-002272 ECB-00228 ECB-00229 Thermagon T-MATE2905 mmx black anodized aluminum plate LAYOUT GUIDELINES DDR Intel motherboard 82854 cooler master shinetsu 855GME AF-S-10H-07B THIRD generation chassis fanless motherboard

    balun 75-ohm to 120-ohm

    Abstract: 500w power amplifier pcb diagram 10 watt amplifier chassis schematic diagram pcb 10 watt power amplifier chassis schematic diagram 135CT050-3D3 1320011 JEDEC-22-A101 T-PLI 200 thermagon equivalent diode for 8724 Thermagon tpli 215
    Text: Application Note ACA0861 - A, B, C, D 750/860 MHz CATV Line Amplifiers Rev 2 Figure 1. A basic cascade circuit topology, shown in Figure 2, is used for each amplifier. This circuit approach meets the demanding performance requirements of low distortion and low noise figure.


    Original     		PDF ACA0861 ACA0861A ACA0861B ACA0861C ACA0861D balun 75-ohm to 120-ohm 500w power amplifier pcb diagram 10 watt amplifier chassis schematic diagram pcb 10 watt power amplifier chassis schematic diagram 135CT050-3D3 1320011 JEDEC-22-A101 T-PLI 200 thermagon equivalent diode for 8724 Thermagon tpli 215

    T5 LAMP SCHEMATIC

    Abstract: Thermagon thermaflo 21D0 design ideas BL-2000 C2511B acrylic Led light schematic silver band gap Aavid Thermalloy 6063
    Text: APPLICATION NOTE 02 Bright Lights. Bright Ideas. TM THERMAL MANAGEMENT OF LAMINA HIGH BRIGHTNESS LIGHT ENGINES Solid state lighting, in the form of light emitting diodes LEDs , has many advantages over traditional light sources, such as longer life, new form factors, and higher efficiencies. These advantages make LEDs attractive for


    Original     		PDF

    2328B

    Abstract: power led heat sink Wakefield Thermal Solutions TYPE 120 Wakefield Engineering AN2435 DNA 30 E 2200 PA G38-87 JESD51-2 MPC603 MPC7410
    Text: Freescale Semiconductor, Inc. Application Note AN2435/D Rev. 0, 7/2003 Freescale Semiconductor, Inc. Thermal Solutions for PowerPC Processors Malcolm Ward CPD Applications The products described in this document are PowerPC™ microprocessors. An often-asked


    Original     		PDF AN2435/D 2328B power led heat sink Wakefield Thermal Solutions TYPE 120 Wakefield Engineering AN2435 DNA 30 E 2200 PA G38-87 JESD51-2 MPC603 MPC7410

    2328B

    Abstract: AN2435 Thermagon Wakefield Engineering G38-87 JESD51-2 MPC603 MPC7410 MPC7450 MPC755
    Text: Freescale Semiconductor, Inc. Application Note AN2435/D Rev. 0, 7/2003 Malcolm Ward CPD Applications The products described in this document are PowerPC microprocessors. An often-asked question while designing a board using a PowerPC processor is whether or not a heat sink is


    Original     		PDF AN2435/D 2328B AN2435 Thermagon Wakefield Engineering G38-87 JESD51-2 MPC603 MPC7410 MPC7450 MPC755

    teac fd 235hf

    Abstract: teac fd-235hf A34124-16 ATI Rage 128 floppy drive scsi TEAC FD-235HF FD-235HF QS5000 ROADM maxtherm grease NORTHBRIDGE FUNCTION IN DESKTOP MOTHERBOARD
    Text: System Considerations for Dual AMD AthlonTM MP Processors in Tower and 1U Form Factors 25325B August 2002 Outline • Introduction • AMD AthlonTM MP processor power roadmap • Thermal test methodology • Tower chassis form factor – Chassis vendors and models


    Original     		PDF 25325B AMD-760TMMP PC2100 64-Bit AMD-760 teac fd 235hf teac fd-235hf A34124-16 ATI Rage 128 floppy drive scsi TEAC FD-235HF FD-235HF QS5000 ROADM maxtherm grease NORTHBRIDGE FUNCTION IN DESKTOP MOTHERBOARD

    T-PLI 200 thermagon

    Abstract: T-PLI 205 Tpli
    Text: APPLICATION NOTE - ACA0860 ACA0860 Thermal Mounting Supplement Rev 0 Introduction The PCB layout for the ACA0860 family of amplifiers must consider both the electrical requirements of the parts proper line impedance, bypassing, etc. and the thermal requirements. The


    OCR Scan     		PDF ACA0860 ACA0860 T-PLI 200 thermagon T-PLI 205 Tpli

    T-PLI 200 thermagon

    Abstract: Thermagon T-PLI 205 t-pli 210 Thermagon TPLI 270 Tpli
    Text: APPLICATION NOTE - ACA0B60 ACA0860 Thermal Mounting Supplement RevO Introduction The PCB layout for the ACA0860 family of amplifiers must consider both the electrical requirements of the parts proper line impedance, bypassing, etc. and the thermal requirements. The


    OCR Scan     		PDF ACA0B60 ACA0860 ACA0860 T-PLI 200 thermagon Thermagon T-PLI 205 t-pli 210 Thermagon TPLI 270 Tpli

    EG7655

    Abstract: 2328B Signal Path Designer Thermagon thermal grease
    Text: 1.8 System Design Information This section provides electrical and thermal design recommendations for successful application of the 604e. 1.8.1 PLL Configuration The 604e PLL is configured by the PLL_CFG[0-3] signals. For a given SYSCLK bus frequency, the PLL


    OCR Scan     		PDF PPC604 PlD9v-604e EG7655 2328B Signal Path Designer Thermagon thermal grease

    Thermagon

    Abstract: wakefield engineering 67
    Text: 1.8 System Design Information This section provides electrical and thermal design recommendations for successful application of the 603e. 1.8.1 PLL Con figuration The 603e PLL is configured by the PLL_CFG[0-3] signals. For a given SYSCLK bus frequency, the PLL


    OCR Scan     		PDF PID6-603e Thermagon wakefield engineering 67