Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    TO808 Search Results

    SF Impression Pixel

    TO808 Price and Stock

    Bivar Inc TO-8-080E

    Circuit Board Hardware - PCB Dis-O-Pad TO-8 Round .156 in OD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics TO-8-080E
    • 1 $0.12
    • 10 $0.083
    • 100 $0.063
    • 1000 $0.048
    • 10000 $0.043
    Get Quote

    Bivar Inc TO-8-085

    Circuit Board Hardware - PCB Dis-O-Pad TO-8 Round .156 in OD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics TO-8-085
    • 1 $0.12
    • 10 $0.083
    • 100 $0.063
    • 1000 $0.048
    • 10000 $0.043
    Get Quote
    Bisco Industries TO-8-085 1,000
    • 1 -
    • 10 -
    • 100 -
    • 1000 -
    • 10000 -
    Buy Now

    Bivar Inc TO-8-085XH

    Circuit Board Hardware - PCB Dis-O-Pad TO-8 Round .156 in OD
    Distributors Part Package Stock Lead Time Min Order Qty Price Buy
    Mouser Electronics TO-8-085XH
    • 1 $0.12
    • 10 $0.083
    • 100 $0.063
    • 1000 $0.048
    • 10000 $0.043
    Get Quote

    TO808 Datasheets (5)

    Part ECAD Model Manufacturer Description Curated Type PDF
    TO-8-080E Bivar Component Insulators, Mounts, Spacers, Hardware, Fasteners, Accessories, SPACER WASHAWAY Original PDF
    TO-8-080E Bivar Wash-Away Spacers - Wash-Away Component and General Purpose Spacers Original PDF
    TO-8-085 Bivar Component Insulators, Mounts, Spacers, Hardware, Fasteners, Accessories, SPACER WASHAWAY Original PDF
    TO-8-085 Bivar Wash-Away Spacers - Wash-Away Component and General Purpose Spacers Original PDF
    TO-8-085XH Bivar Component Insulators, Mounts, Spacers, Hardware, Fasteners, Accessories, SPACER WASHAWAY Original PDF

    TO808 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    TEPRO

    Abstract: No abstract text available
    Text: TYPE TEPRO UUTOUW ELECTRa TECHNIK TO-126 STYLE THICK FILM HEAT SINK DEVICE FEATURES: TO-i 26 style package Miniature size Maximum power: size ratio High stability Optimum heat dissipation High temperature molding Noninductive TEPRO TYPE TO 808-825 Copper heat sink molded into TO 825 package


    Original
    PDF O-126 050/o MIL-STD-202 O-808 O-825 TEPRO

    t0808

    Abstract: TO816 TO220 HEATSINK rga resistors T0850
    Text: “TO” Style Thick Film Resistors TO-220 Style Thick Film Heat Sink Device RGA Type TO 820 Temperature coefficient: Less than 10 ohms, 100ppm Above 10 ohms, 50ppm Features : • TO-220 style package • Miniature size • Maximum power : size ratio • High stability


    Original
    PDF O-220 100ppm 50ppm MIL-STD-202 MIL-STD-202 stabil-202 O-850 O-816 O-850 t0808 TO816 TO220 HEATSINK rga resistors T0850

    memory MAP AND ADDRESS to mp 8085

    Abstract: digital clock using 8085 microprocessor 8085 microprocessor new applications AD7574 AD7590 A07V
    Text: n ANALOG L I D EVICES AN-293 APPLICATION NOTE ONE TECHNOLOGY WAY • P.O. BOX 9106 • NORWOOD, MASSACHUSETTS 02062-9106 • 617/329-4700 The AD7574 Analog to Microprocessor Interface by Paul Toomey INTRODUCTION The AD7574 is a low cost 8-bit ADC designed for easy in­


    OCR Scan
    PDF AN-293 AD7574 100kft memory MAP AND ADDRESS to mp 8085 digital clock using 8085 microprocessor 8085 microprocessor new applications AD7590 A07V

    P80A49H

    Abstract: 8035HL F1L 250 V fuse BPK-70 interfacing 8275 crt controller with 8086 i8282 hall marking code A04 Transistor AF 138 DK55 82720 intel
    Text: COMPONENT DATA CATALOG JANUARY 1982 Intel C orporation makes no w arranty fo r the use of its products and assumes no re sponsib ility fo r any e rrors w hich may appear in th is docum ent nor does it make a com m itm ent to update the info rm atio n contained herein.


    OCR Scan
    PDF RMX/80, P80A49H 8035HL F1L 250 V fuse BPK-70 interfacing 8275 crt controller with 8086 i8282 hall marking code A04 Transistor AF 138 DK55 82720 intel

    to808

    Abstract: No abstract text available
    Text: “TO” Style Thick Film Resistors TO-126 Style Thick Film Heat Sink Device RGA Type TO 808-825 Temperature coefficient: Less than 10 ohms, 100ppm Above 10 ohms, 50ppm Features : •TO -126 style package • Miniature size Derating Curve • Maximum p o w e r: size ratio


    OCR Scan
    PDF O-126 100ppm 50ppm T0825 O-808 O-825 MIL-STD-202 O-808 to808

    Untitled

    Abstract: No abstract text available
    Text: E L E C T R O T E C H N IK TO-126 STYLE THICK FILM HEAT SINK DEVICE FEATURES: TO-126 style package Miniature size Maximum power: size ratio High stability Optimum heat dissipation High temperature molding Noninductive TEPRO TYPE TO 808-825 Copper heat sink molded into TO 825 package


    OCR Scan
    PDF O-126 100ppm 50ppm MIL-STD-202 O-808 O-825

    digital clock using 8085 microprocessor

    Abstract: 8085 clock circuit 8085 microprocessor applications of 8085 microprocessor interfacing of RAM and ROM with 8085 memory MAP AND ADDRESS to mp 8085 microprocessors interface 8085 8085 microprocessor applications 8085 microprocessor new applications applications of 8085 microprocessor notes
    Text: n ANALOG L I D EVICES AN-293 APPLICATION NOTE ONE TECHNOLOGY WAY • P.O. BOX 9106 • NORWOOD, MASSACHUSETTS 02062-9106 • 617/329-4700 The AD7574 Analog to Microprocessor Interface by Paul Toomey INTRODUCTION The AD7574 is a low cost 8-bit ADC designed for easy in­


    OCR Scan
    PDF AN-293 AD7574 AD7S74 digital clock using 8085 microprocessor 8085 clock circuit 8085 microprocessor applications of 8085 microprocessor interfacing of RAM and ROM with 8085 memory MAP AND ADDRESS to mp 8085 microprocessors interface 8085 8085 microprocessor applications 8085 microprocessor new applications applications of 8085 microprocessor notes