qfn 44 PACKAGE footprint
Abstract: qfn 76 PACKAGE footprint ML6652CM qfn 48 PACKAGE footprint QFN 36 footprint qfn 64 pcb layout ML6652CH ML6652 LPCC44 eco solder paste
Text: AN-002 - ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE AN-002 ML6652 TQFP-LPCC DUAL FOOTPRINT TECHNIQUE Introduction In November 2003, the ML6652CM/EM package version of the ML6652 10/100 Mb/s Ethernet Media Converter was introduced. The ML6652CM/EM is the QFN/LPCC44 package version of the ML6652. The
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AN-002
ML6652
AN-002
ML6652CM/EM
QFN/LPCC44
ML6652.
ML6652CH/EH
qfn 44 PACKAGE footprint
qfn 76 PACKAGE footprint
ML6652CM
qfn 48 PACKAGE footprint
QFN 36 footprint
qfn 64 pcb layout
ML6652CH
LPCC44
eco solder paste
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sd3-75
Abstract: FDC37C67X FDC37C93X cross PD6 GP20 GP25 SA10 SMSC Corporation cross reference
Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and
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FDC37C67x/FDC37C93x
FDC37C67x
FDC37C93x.
FDC37C67x
FDC37C93x
FDC37C67x.
sd3-75
cross PD6
GP20
GP25
SA10
SMSC Corporation cross reference
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SERIRQ
Abstract: cross PD6
Text: APPLICATION NOTE 6.13 FDC37C67x/FDC37C93x Dual Footprint By Nizar Azzam This document describes a dual footprint layout for the FDC37C67x and the FDC37C93x. The FDC37C67x is a 100 pin QFP/TQFP package and the FDC37C93x is a 160 pin QFP package. Refer to FDC37C67x and FDC37C93x data sheets for more information.
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FDC37C67x/FDC37C93x
FDC37C67x
FDC37C93x.
FDC37C93x
FDC37C67x.
SERIRQ
cross PD6
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A301D
Abstract: A211D 4bc 82
Text: $GYDQFHLQIRUPDWLRQ $6&.3 $6&.3 9.ðSLSHOLQHEXUVWV\QFKURQRXV65$0 HDWXUHV • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint • Byte write enables • Clock enable for operation hold
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SLSHOLQHEXUVWV\QFKURQRXV65
100-pin
AS7C3512K16P-5TQC
AS7C3512K18P-3
AS7C3512K18P-4TQC
AS7C3512K18P-5TQC
AS7C3512K16P-3
AS7C3512K16P-4BC
A301D
A211D
4bc 82
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seven segment 10-pa5
Abstract: 1480B 4480B
Text: Data Sheet LANCAM B Family APPLICATION BENEFITS DISTINCTIVE CHARACTERISTICS • New low-cost LANCAM family in a space-saving TQFP package • • Fast speed allows processing of both DA and SA within 450 ns, equivalent to 138 ports of 10 Base-T or 13 ports of 100 Base-T Ethernet
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Untitled
Abstract: No abstract text available
Text: $GYDQFHLQIRUPDWLRQ $6&.= $6&.= 9.ðV\QFKURQRXVEXUVW65$0ZLWK17' HDWXUHV • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint • Byte write enables • Clock enable for operation hold
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\QFKURQRXVEXUVW65
0ZLWK17'
100-pin
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seven segment 10-pa5
Abstract: seven segment data sheet 10-pa5 10-pa5 1480B 4480B
Text: Data Sheet Draft LANCAM B Family APPLICATION BENEFITS DISTINCTIVE CHARACTERISTICS • New low-cost LANCAM family in a space-saving TQFP package • • Fast speed allows processing of both DA and SA within 450 ns, equivalent to 138 ports of 10 Base-T or 13 ports of 100 Base-T Ethernet
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XC95144XL-10TQG100C
Abstract: XC95144XL-10TQ100I XC95144XL-10CSG144C XC95144XL-10TQ144I XC95144XL-5-TQ100 XC95144XL-10TQG144C xc95144xl XC95144XL-10TQG100I XC95144XL-7TQ100C TQFP 100 PACKAGE footprint
Text: XC95144XL High Performance CPLD R DS056 v2.0 April 3, 2007 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 178 MHz 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins)
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XC95144XL
DS056
100-pin
144-pin
144-CSP
220oC.
XC95144XL-10TQG100C
XC95144XL-10TQ100I
XC95144XL-10CSG144C
XC95144XL-10TQ144I
XC95144XL-5-TQ100
XC95144XL-10TQG144C
XC95144XL-10TQG100I
XC95144XL-7TQ100C
TQFP 100 PACKAGE footprint
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xc9572xl pin configuration
Abstract: XC9572XL XC9572XL-10PCG44C XC9572XL-10CS48I XC9572XL-10VQG44C XC9572XL-7TQ100C XC9572XL-10PC44C xc9572xl-10PCG44C pin XC9572XL-7PCG44C XC9572XL-5TQG100C
Text: XC9572XL High Performance CPLD R DS057 v2.0 April 3, 2007 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 178 MHz 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins)
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XC9572XL
DS057
44-pin
48-pin
64-pin
100-pin
220oC.
xc9572xl pin configuration
XC9572XL-10PCG44C
XC9572XL-10CS48I
XC9572XL-10VQG44C
XC9572XL-7TQ100C
XC9572XL-10PC44C
xc9572xl-10PCG44C pin
XC9572XL-7PCG44C
XC9572XL-5TQG100C
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12 ohm register
Abstract: 0 OHM RESISTOR FDC37C669FR FDC37N769
Text: APPLICATION NOTE 7.0 FDC37C669FR and FDC37N769 Dual Layout By Nizar Azzam This application note describes a dual footprint layout for the SMSC FDC37C669FR and the SMSC FDC37N769. This is a TQFP package design since the SMSC FDC37N769 comes in a TQFP package only. There are two parts
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FDC37C669FR
FDC37N769
FDC37N769.
12 ohm register
0 OHM RESISTOR
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FDC37C669FR
Abstract: TQFP 100 PACKAGE footprint TQFP 80 PACKAGE footprint FDC37N769 12 ohm register
Text: APPLICATION NOTE 7.0 FDC37C669FR and FDC37N769 Dual Layout By Nizar Azzam This application note describes a dual footprint layout for the SMSC FDC37C669FR and the SMSC FDC37N769. This is a TQFP package design since the SMSC FDC37N769 comes in a TQFP package only. There are two parts
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FDC37C669FR
FDC37N769
FDC37N769.
TQFP 100 PACKAGE footprint
TQFP 80 PACKAGE footprint
12 ohm register
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Untitled
Abstract: No abstract text available
Text: XC95144XV High-Performance CPLD DS051 v2.5 September 13, 2002 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)
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XC95144XV
DS051
XC9500XV
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XC95144
Abstract: No abstract text available
Text: XC95144XV High-Performance CPLD DS051 v2.8 April 15, 2005 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)
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XC95144XV
DS051
XC9500XV
220oC.
XC95144
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xc95144xl tq144
Abstract: No abstract text available
Text: XC95144XL High Performance CPLD DS056 v1.3 October 13, 2000 5 Features • • • • • • • • • • • 5 ns pin-to-pin logic delays System frequency up to 222 MHz 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins)
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XC95144XL
DS056
54V18
100-pin
144-pin
144-CSP
XC95144XL
TQ100
CS144
xc95144xl tq144
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Untitled
Abstract: No abstract text available
Text: XC95144XV High-Performance CPLD DS051 v2.6 June 18, 2003 1 Features • • • • • • • • 144 macrocells with 3,200 usable gates Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins) - 144-pin CSP (117 user I/O pins)
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XC95144XV
DS051
100-pin
144-pin
54-input
220oC.
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in400x
Abstract: P0640EA70 bd 625 QFN 64 8x8 footprint 32-PIN 44-PIN MUR120 le79555-3vc TQFP044 795552QC
Text: SLIC Subscriber Line Interface Circuit Le79555 Device APPLICATIONS DESCRIPTION • Ideal for high-density, low-power linecard applications The Le79555 device was designed for high-density POTS applications requiring a power saving, small footprint SLIC device. The new SLIC device fulfills today's requirements for
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Le79555
44-pin
in400x
P0640EA70
bd 625
QFN 64 8x8 footprint
32-PIN
44-PIN
MUR120
le79555-3vc
TQFP044
795552QC
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smsc
Abstract: FDC37C669FR FDC37N769
Text: APPLICATION NOTE 7.0 FDC37C669FR and FDC37N769 Dual Layout By Nizar Azzam This application note describes a dual footprint layout for the SMSC FDC37C669FR and the SMSC FDC37N769. This is a TQFP package design since the SMSC FDC37N769 comes in a TQFP package only.
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FDC37C669FR
FDC37N769
FDC37N769.
smsc
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Untitled
Abstract: No abstract text available
Text: XC9572XV High-performance CPLD R DS052 v2.3 May 31, 2002 5 Features • • • • • • • • 72 macrocells with 1,600 usable gates Available in small footprint packages - 44-pin PLCC (34 user I/O pins) - 44-pin VQFP (34 user I/O pins) - 48-pin CSP (38 user I/O pins)
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XC9572XV
DS052
XC9500XV
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Untitled
Abstract: No abstract text available
Text: XC95144XV High-Performance CPLD R DS051 v2.0 January 25, 2001 1 Advance Product Specification Features Power Estimation • 144 macrocells with 3,200 usable gates • Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins)
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XC95144XV
DS051
100-pin
144-pin
54-input
Indivi70
TQ100
TQ144
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a6252
Abstract: CS144 TQ100 TQ144 XC9500XV XC95144XV
Text: XC95144XV High-Performance CPLD R DS051 v2.2 August 27, 2001 1 Advance Product Specification Features Power Estimation • 144 macrocells with 3,200 usable gates • Available in small footprint packages - 100-pin TQFP (81 user I/O pins) - 144-pin TQFP (117 user I/O pins)
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XC95144XV
DS051
100-pin
144-pin
XC9500XV
a6252
CS144
TQ100
TQ144
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Untitled
Abstract: No abstract text available
Text: A Advance information •■ I l AS7C3256K36Z AS7C3256K32Z 3.3V 256Kx32/36 synchronous burst SRAM with NTD Features • • • • • • • • • Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint
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AS7C3256K36Z
AS7C3256K32Z
256Kx32/36
100-pin
synchroC3256K36Z
AS7C3256K32Z-3
AS7C3256K32Z-4TQC
AS7C3256K32Z-5TQC
AS7C3256K36Z-3
AS7C3256K36Z-4TQC
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Untitled
Abstract: No abstract text available
Text: Advance information •■ Il AS7C3256K36Z AS7C3256K32Z II 3.3V 256Kx32/36 synchronous burst SRAM with ZBT1 Features • • • • • • • • • • M ultiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint
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AS7C3256K36Z
AS7C3256K32Z
256Kx32/36
100-pin
3256K
32Z-4B
32Z-5B
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ADA17
Abstract: No abstract text available
Text: Advance information •■ I l AS7C3256K36Z AS7C3256K32Z A 3.3V 2 5 6 K x 32/36 synchronous burst SRAM with ZBT1 Features Multiple packaging options - Economical 100-pin TQFP package - Chip-scale fBGA package for smallest footprint Byte write enables Qock enable for operation hold
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OCR Scan
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AS7C3256K36Z
AS7C3256K32Z
100-pin
00000DID1DDDD
5M-1982.
IPC-SM-782
ADA17
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351N
Abstract: FBGA-F
Text: Advance information •■ I l A S7C3256K36Z A S7C3256K32Z I 3.3V 2 5 6 K x 3 2 /3 6 synchronous burst SRAM with ZB T1 Features • • • • • • • • • M ultiple p ackagin g op tion s - Econom ical 100-pin TQFP package - C hip-scale fBGA package for sm allest footprint
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AS7C3256K36Z
AS7C3256K32Z
256KX32/36
100-pin
AS7C3256K32Z-3
AS7C3256K32Z-4TQC
AS7C3256K32Z-5TQC
AS7C3256K36Z-3
AS7C3256K36Z-4TQC
AS7C3256K36Z-5TQC
351N
FBGA-F
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