TS0300W3
Abstract: MARKING CODE KIT 10DB DC-18GHZ MIL-R-55342 08-E0412
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: DESCRIPTION: ASSEMBLY DWG: 1.0 TS0300W3 KIT CHIP ATTENUATOR KIT 0 THRU 10DB IN 1DB INCREMENTS, 5 PIECES EACH. N/A SPECIFICATIONS 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ
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TS0300W3
DC-18GHZ
MIL-R-55342.
MIL-STD-202,
MIL-STD-130;
751W266.
08-E0412
MARKING CODE KIT
10DB
DC-18GHZ
MIL-R-55342
08-E0412
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D2E2
Abstract: Signal Integrity TS03001D007
Text: Metral 4000 Technical Sheet No. TS03001D007 V1.1 Metral 4000 Signal integrity performance Metral 4000 Technical sheet TS03001D007 V1.1 Document History Version 1.0 1.1 Date 15-07-02 07-05-03 Modifications Original Document Correction labels crosstalk tables
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TS03001D007
D2E2
Signal Integrity
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MIL-STD-454 requirement 9
Abstract: TS0300 DC-18GHZ
Text: TITLE: SPECIFICATION CONTROL DRAWING PART IDENTIFIER: TS0300 KIT DESCRIPTION: CHIP ATTENUATOR KIT ASSEMBLY DWG: N/A 1.0 SPECIFICATIONS: 1.1 ELECTRICAL: 1.1.1 IMPEDANCE: 50 OHMS NOMINAL. 1.1.2 FREQUENCY RANGE: DC-18GHZ 1.1.3 ATTENUATION VALUES AVAILABLE: 0-10DB IN 1DB INCREMENTS.
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TS0300
DC-18GHZ
0-10DB
MIL-STD-454,
MIL-STD-202,
MIL-STD-130;
755W002,
08-E0364
MIL-STD-454 requirement 9
DC-18GHZ
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TS0300W3
Abstract: No abstract text available
Text: TS0300W3 VSWR 2.5 2.4 2.3 2.2 2.1 2 1.9 1.8 1.7 1.6 1.5 1.4 1.3 1.2 1.1 1 0.05 VSWR 1 25C 2.05 4.05 Frequency (GHz) 6.05 8 Attenuation 5 DB(|S(2,1)|) 25C 4 3 2 1 -1 -2 -3 -4 -5 0.05 2.05 4.05 Frequency (GHz) 6.05 8 S(1,1) 25C Swp Max 8GHz 2. 6 0. 0.8 1.0
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TS0300W3
05GHz
TS0300W3
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tva0300n07
Abstract: mmic amplifier marking code N10 MTVA0300N05 PST-02-A-1 TVA0300N07W3 electronic passive components catalog SC-1016 MTVA0300 SMT2010TALN 42TVA
Text: EMC TECHNOLOGY Custom Engineered Solutions 8851 SW Old Kansas Ave. 772 286-9300 ISO 9001 & 14001 Certified M I C R OWAV E C O M P O N E N T S www.emct.com Resistive Products, Smart Loads , High Reliability Stuart, FL 34997 (800) 544-5594 Thermopads®, Equalizers,
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d8693
Abstract: RYT Circulators amf-3d-008019.1 miteq amf-3f x-band waveguide isolators ps223 TS0303W3 JSD00114 H-BEND
Text: AST Lagerliste 2010 solange r u n f u a Verk icht! Vorrat re Hohlleiter- und Koaxialbauteile, vom Diplexer bis zu Leistungsverstärker, passive Bauteile wie z.B. Leistungswiderständen oder Dämpfungsglieder, und Kabel bis zu 65 GHz werden mit weit über 50% Preisnachlass angeboten.
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AM-1598-11166
AM-1607-10231
AM-1013-0
D-86932
d8693
RYT Circulators
amf-3d-008019.1
miteq
amf-3f
x-band waveguide isolators
ps223
TS0303W3
JSD00114
H-BEND
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TS0300
Abstract: H20E TS0500 84-1LMI MIL-F-14256 TS050
Text: Application Note 005 Chip Device Mounting Instructions Page 1 of 4 Application Note #005 Chip Device Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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ECF564A
Abstract: H20E TS0300W3 TS0300 TS0500W3 diode wb1 84-1LMI MIL-F-14256 Ablestik 84-1LMI paste resistor thick film
Text: Application Note 006 Wrapped Chip Device Mounting Instructions Page 1 of 4 Application Note #006 Wrapped Chip Device Mounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back metallization and platinum gold input/output
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TS-2203
Abstract: No abstract text available
Text: 3M Compact Header .100″ x .075″ Right Angle 502 Series Low profile Consumes less vertical space Economy in system layouts Uses standard 2.54 [.1 ] × 2.54 [.1 ] pc board hole pattern • Retro-fit without print changes • Mates with 501 Series wiremount socket
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TS-0300-&
E68080
Interc217B-E
TS-2203
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TS-2203
Abstract: No abstract text available
Text: 3M Compact Header .100″ x .075″ Right Angle 502 Series • • • • Low profile Consumes less vertical space Economy in system layouts Uses standard 2.54 [.1 ] × 2.54 [.1 ] pc board hole pattern • Retro-fit without print changes • Mates with 501 Series wiremount socket
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TS-0300-B
RIA-2217B-b
TS-2203
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Ablestik 84-1LMI
Abstract: gold melting furnace 84-1LMI epoxy adhesive
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold w rap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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4160P
Abstract: 4161p
Text: NEW PRODUCTS HIGH POWER LOADS The performance of many of our standard, high power loads has been significantly improved. The 5307 and 5657 are now specified for operation through 2 GHz with 1.25:1 VSWR. The 5309 is now specified for operation through 4 GHz with 1.35:1 VSWR. The power
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4161P
4162P
4160P.
4181P
4181J
4181P/J
4180P/J
4160P
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Untitled
Abstract: No abstract text available
Text: THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film element on an alumina ceramic substrate with solderable terminals in two sizes. The larger TS03XX Series operates to 12.4 GHz and the
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TS03XX
TS05XX
TS0518
TS0519
TS0520
TS0510
TS0300
TS0500
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Untitled
Abstract: No abstract text available
Text: .100" x .075" Compact Header Right Angle 502XX Series • • • • • • • Low profile Consumes less vertical space Economy in system layouts Uses standard . 1" x . 1" pc board hole pattern No change in current design Retro-fit with no print changes
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502XX
TS-0300-12
QQ-N-290A,
MIL-G-45204,
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Untitled
Abstract: No abstract text available
Text: A pplication N ote 004 Wrapped Chip D evice M ounting Instructions This line of microwave attenuators is designed for surface mount and wraparound grounding applications. The W1 has a platinum gold wraparound ground with full back m etallization and platinum gold input / output terminations.
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84-1LMI epoxy adhesive
Abstract: TS0300W3 TS0500W3
Text: APPLICATION NOTES APPLICATION NOTE 006 - WRAPPED CHIP DEVICE MOUNTING INSTRUCTIONS This line of microwave attenuators is designed for surface mount and wrap-around grounding applications. The W1 has a platinum gold wrap around ground with full back metallization and platinum gold input/output terminations. The WB1 has a platinum gold wrap-around ground and
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Untitled
Abstract: No abstract text available
Text: .100" X .075" Compact Header Right Angle 502 Series • • • • Low profile Consumes less vertical space Economy in system layouts Uses standard .1" x .1" pc board hole pattern • No change in current design • Retro-fit with no print changes • Mates with wiremont socket on page 108
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TS-0300-13
QQ-N-290A,
MIL-G-45204,
MIL-P-81728
502XX-B002
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ECF564A
Abstract: No abstract text available
Text: Technology A pplication Notes Chip Device Mounting Instructions A pplication N o te 003 Chip D evice Mounting Instructions All of the chip products in this catalog use thick film metallization for terminations - either platinum gold, gold, or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used
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ina 124
Abstract: CT2525ALN "beryllium oxide" HR0500 ct2335 SMT3725ALN SC0066M
Text: SES 1 Index Tedmolo^ii L Product Index EM C P art Num ber Description Pow er Level W Substrate M aterial M ax VSWR M ax Frequency (G Hz) Page N um ber TVA Series Thermopads 2 Alum ina 1.30:1 6 GHz 12 M TVAXXXXN XX Thermopads 0.2 A lum ina 1.30:1 18 GHz
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42TVA
R0300
HR0500
TS0300
TS0300W
TS0400
TS0500
TS0500W1
TS0500W
TS0500WB1
ina 124
CT2525ALN
"beryllium oxide"
ct2335
SMT3725ALN
SC0066M
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TS05XXW3
Abstract: TS0500 marking code wb1 TS05XX ts0506 TS0507 EMC TS-050
Text: ATTENUATORS THIN FILM CHIP ATTENUATORS GENERAL INFORMATION GENERAL SPECIFICATIONS: The TS03XX and TS05XX chip attenuators consist of a thin film Impedance: 50 Q element on an alumina ceramic substrate with solderable terminals Operating Temperature: -55°C to +150°C
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TS03XX
TS05XX
TS0300
TS0500
TS03XX,
TS03XXW3,
TS05XX,
TS0500WB1
TS05XXW3
marking code wb1
ts0506
TS0507 EMC
TS-050
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Untitled
Abstract: No abstract text available
Text: APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are commonly used in RF and microwave applications. Some of these chips are offered with
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Untitled
Abstract: No abstract text available
Text: .100" X .075" Compact Header Right Angle 502 Series IMPORTANT NOTICE TO PURCHASER ALL STATEMENTS, TECHNICAL INFORMATION AND RECOMMENDATIONS CONTAINED HEREIN ARE BASED ON TESTS WE BELIEVE TO BE RELIABLE, BUT THE ACCURACY OR COMPLETENESS THEREOF IS NOT GUARANTEED, AND
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502XX-B002
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84-1LM
Abstract: ECF564A
Text: APPLICATION NOTES APPLICATION NOTE 005 - CHIP DEVICE MOUNTING INSTRUCTIONS All of the chip products in this catalog use thick film metallization for terminations — either platinum gold or platinum silver. Each material is used to accommodate the different bonding practices that are com m only used in RF and microwave applications. Some of these chips are offered with
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