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    KM416S8030BN

    Abstract: KM416S8030B
    Text: shrink-TSOP KM416S8030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 2M x 16Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 Aug. 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.1 Aug. 1999 shrink-TSOP


    Original     		KM416S8030BN 128Mb 16Bit A10/AP KM416S8030BN KM416S8030B PDF

    Untitled

    Abstract: No abstract text available
    Text: shrink-TSOP KM44S32030AN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 8M x 4Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.1 April 1999 Samsung Electronics reserves the right to change products or specification without notice. REV. 0.1 Apr. 1999 shrink-TSOP


    Original     		KM44S32030AN 128Mb KM44S32030AT, 54-sTSOP PDF

    Untitled

    Abstract: No abstract text available
    Text: shrink-TSOP KM48S16030BN Preliminary CMOS SDRAM 128Mb SDRAM Shrink TSOP 4M x 8Bit x 4 Banks Synchronous DRAM LVTTL Revision 0.0 July 1999 Samsung Electronics reserves the right to change products or specification without notice. Rev. 0.0 July 1999 shrink-TSOP


    Original     		KM48S16030BN 128Mb A10/AP PDF

    TSOP 86 Package

    Abstract: A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin
    Text: 1999 DRAM Design Guidelines Options Package Width Data Rate Voltage I/O 16Mb 64Mb 128Mb 256Mb Clock MHz 1 54 TSOP x4 SDR 3.3V LVTTL na 16Mx4 32Mx4 64Mx4 PC100/133 2 54 TSOP x8 SDR 3.3V LVTTL na 8Mx8 16Mx8 32Mx8 PC100/133 3 54 TSOP x16 SDR 3.3V LVTTL na 4Mx16 8Mx16 16Mx16


    Original     		128Mb 256Mb 16Mx4 32Mx4 64Mx4 PC100/133 16Mx8 32Mx8 4Mx16 TSOP 86 Package A11E 128MB PC266 TSOP 54 Package 4mx32 TSOP 400 86 TSOP 54 PIN tsop 66 TSOP 66 Package ddr 240 pin PDF

    54-pin

    Abstract: TSOP 54 Package TSOP 54 II
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01) 54-pin plastic TSOP (II) (FPT-54P-M01)


    Original     		FPT-54P-M01 54-pin FPT-54-M01) FPT-54P-M01) F54001S-2C-1 TSOP 54 Package TSOP 54 II PDF

    TSOP 54 Package

    Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)


    Original     		FPT-54P-M01 500mil 54-pin FPT-54P-M01) F54001S-2C-1 TSOP 54 Package TSOP 54 PIN TSOP II 54 Package PDF

    54-PIN

    Abstract: No abstract text available
    Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02) 54-pin plastic TSOP (II) (FPT-54P-M02)


    Original     		FPT-54P-M02 54-pin FPT-54P-M02) F54003S-1C-1 PDF

    TSOP 86 Package

    Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
    Text: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)


    Original     		400MIL22 54-pin 66-pin 86-pin SSD-A-H6023-4 TSOP 86 Package TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package PDF

    TSOP II 54

    Abstract: TSOP II 54 Package 54PIN 54P3G-C
    Text: 54P3G-C Plastic 54pin 400mil TSOP II (LOC) EIAJ Package Code TSOP II 54-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 54 E Recommended Mount Pad Symbol 1 A 27 D e L c L1 HE ME l2 28 y b A2 Detail F A A1 A2 b c D E e HE L L1 y A1 ME I2


    Original     		54P3G-C 54pin 400mil 54-P-400-0 TSOP II 54 TSOP II 54 Package 54P3G-C PDF

    TSOP 86 Package

    Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
    Text: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)


    Original     		400MIL22 54-pin 400mil) 66-pin 86-pin TSOP 86 Package TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray PDF

    MT48LC4M32B2P

    Abstract: TP 472
    Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)


    Original     		128Mb: MT48LC4M32B2 PC100-compliant 4096-cycle 09005aef80872800 MT48LC4M32B2P TP 472 PDF

    MT48LC4M32B2P

    Abstract: marking 6a2 smd 6A 1176
    Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)


    Original     		128Mb: MT48LC4M32B2 PC100-compliant 4096-cycle 09005aef80872800 MT48LC4M32B2P marking 6a2 smd 6A 1176 PDF

    MT48LC4M32B2P

    Abstract: x32SDR
    Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)


    Original     		128Mb: MT48LC4M32B2 PC100-compliant 4096-cycle 09005aef80872800 MT48LC4M32B2P x32SDR PDF

    MT48LC4M32B2P

    Abstract: No abstract text available
    Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)


    Original     		128Mb: MT48LC4M32B2 PC100-compliant 4096-cycle 09005aef80872800 MT48LC4M32B2P PDF

    MT48LC16M8A2BB

    Abstract: No abstract text available
    Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free


    Original     		128Mb: MT48LC32M4A2 MT48LC16M8A2 MT48LC8M16A2 PC100- PC133-compliant 4096-cycle 09005aef8091e66d x4x8x16 MT48LC16M8A2BB PDF

    MT48LC4M32B2P

    Abstract: No abstract text available
    Text: 128Mb: x32 SDRAM Features SDR SDRAM MT48LC4M32B2 – 1 Meg x 32 x 4 Banks Features Options Marking • Configuration – 4 Meg x 32 1 Meg x 32 x 4 banks • Package – OCPL1 – 86-pin TSOP II (400 mil) – 86-pin TSOP II (400 mil) Pb-free – 90-ball VFBGA (8mm x 13mm)


    Original     		128Mb: MT48LC4M32B2 86-pin 90-ball PC100-compliant 09005aef80872800 MT48LC4M32B2P PDF

    MT48LC16M8A2BB

    Abstract: No abstract text available
    Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free


    Original     		128Mb: MT48LC32M4A2 MT48LC16M8A2 MT48LC8M16A2 54-pin 60-ball 54-ball MT48LC16M8A2BB PDF

    Untitled

    Abstract: No abstract text available
    Text: HYM7V73AC1601BTNGC 16MX72, 16Mx4 based, PC133 DESCRIPTION The Hynix HYM7V73AC1601B N-Series are 16Mx72bits ECC Synchronous DRAM Modules. The modules are composed of eighteen 16Mx4bits CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, three 18bits driver ICs


    OCR Scan     		HYM7V73AC1601BTNGC 16MX72, 16Mx4 PC133 HYM7V73AC1601B 16Mx72bits 16Mx4bits 400mil 54pin 18bits PDF

    Untitled

    Abstract: No abstract text available
    Text: HYM7V651601BTFG 16Mx64, 8Mx8 based, PC100 DESCRIPTION The Hynix HYM7V651601B F-Series are 16Mx64bits Synchronous DRAM Modules. The modules are composed of sixteen 8Mx8bit CMOS Synchronous DRAMs in 400mil 54pin TSOP-il package, one 2Kbit EEPROM in 8pin TSSOP


    OCR Scan     		HYM7V651601BTFG 16Mx64, PC100 HYM7V651601B 16Mx64bits 400mil 54pin 168pin 128Mbytes PDF

    Untitled

    Abstract: No abstract text available
    Text: HYM7V631601BTFG 16Mx64, 8Mx8 based, PC133 DESCRIPTION The Hynix HYM7V631601B F-Series are 16Mx64bits Synchronous DRAM Modules. The modules are composed of sixteen 8Mx8bit CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kbit EEPROM in 8pln TSSOP


    OCR Scan     		HYM7V631601BTFG 16Mx64, PC133 HYM7V631601B 16Mx64bits 400mil 54pin 168pm 128Mbytes PDF

    Untitled

    Abstract: No abstract text available
    Text: HYM7V75AC1601BTNG 1SMx72, 16Mx4 based, PC100 DESCRIPTION The Hynix HYM7V75AS1601B N-Series are 16Mx72bits ECC Synchronous DRAM Modules. The modules are composed of eighteen 16Mx4bit CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, two 18bits driver ICs in


    OCR Scan     		HYM7V75AC1601BTNG 1SMx72, 16Mx4 PC100 HYM7V75AS1601B 16Mx72bits 16Mx4bit 400mil 54pin 18bits PDF

    Untitled

    Abstract: No abstract text available
    Text: HYM7V63401BTRG 4Mx64, 4Mx16 based, PC133 DESCRIPTION The Hynix HYM7V63401B R-Series are 4Mx64bits Synchronous DRAM Modules. The modules are composed of four 4Mx16bit CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kbit EEPROM in 8pin TSSOP package


    OCR Scan     		HYM7V63401BTRG 4Mx64, 4Mx16 PC133 HYM7V63401B 4Mx64bits 4Mx16bit 400mil 54pin 168pin PDF

    HYM7V73A1601B

    Abstract: HYM7V73A1601
    Text: HYM7V73 A1601BTFG 16Mx72, 8Mx8 based, PC133 DESCRIPTION The Hynix HYM7V73A1601B F-Series are 16Mx72bits ECC Synchronous DRAM Modules. The modules are composed of eighteen 8Mx8bits CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, one 2Kblt EEPROM in 8pin


    OCR Scan     		HYM7V73 A1601BTFG 16Mx72, PC133 HYM7V73A1601B 16Mx72bits 400mil 54pin 168pin HYM7V73A1601 PDF

    Untitled

    Abstract: No abstract text available
    Text: HYM7V73AC801BTHGC 8Mx72, 8Mx8 based, PC133 DESCRIPTION The Hynix HYM7V73AC801B H-Series are 8Mx72bits ECC Synchronous DRAM Modules. The modules are composed of nine 8Mx8bits CMOS Synchronous DRAMs in 400mil 54pin TSOP-II package, two 18bits driver ICs in 56pln TSSOP


    OCR Scan     		HYM7V73AC801BTHGC 8Mx72, PC133 HYM7V73AC801B 8Mx72bits 400mil 54pin 18bits 56pln 24pin PDF