54-pin
Abstract: TSOP 54 Package TSOP 54 II
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01) 54-pin plastic TSOP (II) (FPT-54P-M01)
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Original
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FPT-54P-M01
54-pin
FPT-54-M01)
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 II
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PDF
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TSOP 54 Package
Abstract: TSOP 54 PIN 54-PIN TSOP II 54 Package
Text: THIN SMALL OUTLINE L-LEADED PACKAGE 54 PIN PLASTIC FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80mm Package width 500mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M01) * : Resin protrusion. (Each side : 0.15 (.006) Max) 54-pin plastic TSOP (II)
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Original
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FPT-54P-M01
500mil
54-pin
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 PIN
TSOP II 54 Package
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PDF
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54-PIN
Abstract: No abstract text available
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02) 54-pin plastic TSOP (II) (FPT-54P-M02)
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Original
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FPT-54P-M02
54-pin
FPT-54P-M02)
F54003S-1C-1
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PDF
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MT48LC16M8A2BB
Abstract: No abstract text available
Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free
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Original
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128Mb:
MT48LC32M4A2
MT48LC16M8A2
MT48LC8M16A2
54-pin
60-ball
54-ball
MT48LC16M8A2BB
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PDF
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MT48LC16M8A2BB
Abstract: No abstract text available
Text: 128Mb: x4, x8, x16 SDRAM Features SDR SDRAM MT48LC32M4A2 – 8 Meg x 4 x 4 Banks MT48LC16M8A2 – 4 Meg x 8 x 4 Banks MT48LC8M16A2 – 2 Meg x 16 x 4 Banks Features Options • Plastic package – OCPL2 – 54-pin TSOP II 400 mil – 54-pin TSOP II (400 mil) Pb-free
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Original
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128Mb:
MT48LC32M4A2
MT48LC16M8A2
MT48LC8M16A2
PC100-
PC133-compliant
4096-cycle
09005aef8091e66d
x4x8x16
MT48LC16M8A2BB
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PDF
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TSOP II 54
Abstract: TSOP II 54 Package 54PIN 54P3G-C
Text: 54P3G-C Plastic 54pin 400mil TSOP II (LOC) EIAJ Package Code TSOP II 54-P-400-0.80 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 F 54 E Recommended Mount Pad Symbol 1 A 27 D e L c L1 HE ME l2 28 y b A2 Detail F A A1 A2 b c D E e HE L L1 y A1 ME I2
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Original
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54P3G-C
54pin
400mil
54-P-400-0
TSOP II 54
TSOP II 54 Package
54P3G-C
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PDF
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TSOP 54 Package
Abstract: TSOP 54 Package used in where TSOP 54 PIN TSOP II 54 Package TSOP 54 II 54-PIN
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M01 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 500 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54-M01)
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Original
|
FPT-54P-M01
54-pin
FPT-54-M01)
FPT-54P-M01)
F54001S-2C-1
TSOP 54 Package
TSOP 54 Package used in where
TSOP 54 PIN
TSOP II 54 Package
TSOP 54 II
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PDF
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TSOP 54 Package
Abstract: TSOP 54 Package used in where 54-PIN TSOP 54 PIN
Text: THIN SMALL OUTLINE L-LEADED PACKAGE FUJITSU SEMICONDUCTOR DATA SHEET 54 PIN PLASTIC To Top / Package Lineup / Package Index FPT-54P-M02 54-pin plastic TSOP II Lead pitch 0.80 mm Package width 400 mil Lead shape Gullwing Sealing method Plastic mold (FPT-54P-M02)
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Original
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FPT-54P-M02
54-pin
FPT-54P-M02)
F54003S-1C-1
TSOP 54 Package
TSOP 54 Package used in where
TSOP 54 PIN
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PDF
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TSOP 86 Package
Abstract: TSOP 54 tray TSOP package tray TSOP 54 Package TSOP 54 PIN TSOP 66 Package JEDEC tray standard tsop TSOP II 54 Package tsop 66 tsop package
Text: TRAY CONTAINER UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. A' 11.8 14.00 12.00 TSOP 2 400MIL22 135.9 9¥12=108 A 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 7.62 (6.35) 21.80 16.50 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)
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Original
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400MIL22
54-pin
66-pin
86-pin
SSD-A-H6023-4
TSOP 86 Package
TSOP 54 tray
TSOP package tray
TSOP 54 Package
TSOP 54 PIN
TSOP 66 Package
JEDEC tray standard tsop
TSOP II 54 Package
tsop 66
tsop package
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PDF
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TSOP 86 Package
Abstract: TSOP 54 tray TSOP 54 Package TSOP 66 Package TSOP II 54 Package TSOP 62 Package JEDEC tray standard tsop TSOP package tray
Text: UNIT : mm HEAT PROOF PRE 7 112.0 NEC 135° MAX. 14.00 12.00 TSOP 2 400MIL22 135.9 9x12=108 A A' 11.8 24.70 21.70 21.8 271.7 315.0 (322.6) SECTION A – A' 5.62 (6.35) 7.62 21.8 16.5 Applied Package Quantity (pcs) Material 54-pin • Plastic TSOP(II)(400mil)
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Original
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400MIL22
54-pin
400mil)
66-pin
86-pin
TSOP 86 Package
TSOP 54 tray
TSOP 54 Package
TSOP 66 Package
TSOP II 54 Package
TSOP 62 Package
JEDEC tray standard tsop
TSOP package tray
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PDF
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Untitled
Abstract: No abstract text available
Text: 512MB, 1GB Unbuffered SODIMM DDR SDRAM DDR SDRAM Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb F-die 66 TSOP-II & 54 sTSOP-II with Lead-Free and Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
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Original
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512MB,
200pin
512Mb
64Mx8
sTSOPII-300mil
K4H510838F-6*
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PDF
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M470L6524FL0
Abstract: M470L2923F60
Text: 512MB, 1GB Unbuffered SODIMM DDR SDRAM DDR SDRAM Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb F-die 66 TSOP-II & 54 sTSOP-II with Lead-Free and Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
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Original
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512MB,
200pin
512Mb
64Mx8
sTSOPII-300mil
K4H510838F-6*
M470L6524FL0
M470L2923F60
|
PDF
|
K4H511638D
Abstract: M470L3324DU0
Text: 256MB, 512MB, 1GB Unbuffered SODIMM Preliminary DDR SDRAM DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die 66 TSOP-II & 54 sTSOP-II with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS,
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Original
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256MB,
512MB,
184pin
512Mb
64Mx8
sTSOPII-300mil
K4H510838D-V*
K4H511638D
M470L3324DU0
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PDF
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DDR400
Abstract: K4H511638B M470L3324BT
Text: 256MB, 512MB, 1GB Unbuffered SODIMM DDR SDRAM DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb B-die 66 TSOP-II & 54 sTSOP-II INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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Original
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256MB,
512MB,
184pin
512Mb
64Mx8
sTSOPII-300mil
K4H510838B
DDR400
K4H511638B
M470L3324BT
|
PDF
|
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Untitled
Abstract: No abstract text available
Text: 256MB, 512MB, 1GB Unbuffered SODIMM DDR SDRAM DDR SDRAM Unbuffered Module 184pin Unbuffered Module based on 512Mb D-die 66 TSOP-II & 54 sTSOP-II with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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Original
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256MB,
512MB,
184pin
512Mb
64Mx8
sTSOPII-300mil
K4H510838D-V*
|
PDF
|
K4H511638D
Abstract: M470L3324DU0 k4h510838
Text: 256MB, 512MB, 1GB Unbuffered SODIMM DDR SDRAM DDR SDRAM Unbuffered SODIMM 200pin Unbuffered SODIMM based on 512Mb D-die 66 TSOP-II & 54 sTSOP-II with Pb-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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Original
|
256MB,
512MB,
200pin
512Mb
64Mx8
sTSOPII-300mil
K4H510838D-V*
K4H511638D
M470L3324DU0
k4h510838
|
PDF
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K4S561632J
Abstract: K4S56163 K4S561632J-UI/P60 K4S561632J-UI samsung cmos dram 4m x 4 k4s5616
Text: Industrial Synchronous DRAM K4S561632J 256Mb J-die SDRAM Specification 54 TSOP-II with Pb-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
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Original
|
K4S561632J
256Mb
A10/AP
K4S561632J
K4S56163
K4S561632J-UI/P60
K4S561632J-UI
samsung cmos dram 4m x 4
k4s5616
|
PDF
|
samsung capacitance year code
Abstract: No abstract text available
Text: Industrial Synchronous DRAM K4S561632J 256Mb J-die SDRAM Specification 54 TSOP-II with Pb-Free RoHS compliant Industrial Temp. -40 to 85°C INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE.
|
Original
|
K4S561632J
256Mb
A10/AP
samsung capacitance year code
|
PDF
|
Untitled
Abstract: No abstract text available
Text: DDR SDRAM 256MB, 512MB, 1GB Unbuffered SODIMM Pb-Free DDR SDRAM SODIMM 200pin Unbuffered SODIMM based on 512Mb B-die with 64 / 72-bit Non ECC / ECC 66 TSOP(II)/54 sTSOP(II) with Pb-Free (RoHS compliant) Revision 1.2 Oct. 2004 Revision 1.2 Oct. 2004 256MB, 512MB, 1GB Unbuffered SODIMM Pb-Free
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Original
|
256MB,
512MB,
200pin
512Mb
72-bit
|
PDF
|
K4S561632J
Abstract: m464s64* samsung K4S560832J
Text: 256MB, 512MB Unbuffered SODIMM SDRAM SDRAM Unbuffered SODIMM 144pin Unbuffered SODIMM based on 256Mb J-die 54 TSOP-II/sTSOP II with Lead-Free and Halogen-Free RoHS compliant INFORMATION IN THIS DOCUMENT IS PROVIDED IN RELATION TO SAMSUNG PRODUCTS, AND IS SUBJECT TO CHANGE WITHOUT NOTICE. NOTHING IN THIS DOCUMENT SHALL BE
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Original
|
256MB,
512MB
144pin
256Mb
32Mx8
K4S560832J
K4S561632J
m464s64* samsung
K4S560832J
|
PDF
|
tsop 54 weight
Abstract: 70-PIN
Text: 70P3S-L Plastic 70pin 400mil TSOP EIAJ Package Code TSOP II 70/68-P-400-0.65 Weight(g) JEDEC Code – Lead Material Alloy 42 e b2 52 54 36 E Recommended Mount Pad Symbol 17 1 19 35 A c L D L1 HE ME 70 I2 F e y b A2 Detail F A1 A A1 A2 b c D E e HE L L1
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Original
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70P3S-L
70pin
400mil
70/68-P-400-0
tsop 54 weight
70-PIN
|
PDF
|
Untitled
Abstract: No abstract text available
Text: GMM27317230ATG LG Semicon Co.,Ltd. Description 16,777,216 WORDS x72BIT SYNCHRONOUS DYNAMIC RAM MODULE Features The GMM27317230ATG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II
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OCR Scan
|
GMM27317230ATG
72bits
7317230A
GMM27317230ATG
|
PDF
|
Untitled
Abstract: No abstract text available
Text: GMM26417233ATG 16,777,216 WORDS x64bit LG Semicon Co.,Ltd. Description The GMM26417233ATG is a 16M x 64bits Synchronous Dynamic RAM MODULE which is assembled 8 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II package and one 2048 bit EEPROM in 8pin
|
OCR Scan
|
GMM26417233ATG
x64bit
GMM26417233ATG
64bits
M26417233AT
|
PDF
|
Untitled
Abstract: No abstract text available
Text: GMM27317233ATG 16,777,216 WORDS x72BIT LG Semicon Co.,Ltd. Description The GMM27317233ATG is a 16M x 72bits Synchronous Dynamic RAM MODULE which is assembled 9 pieces of 16M x 8bits Synchronous DRAMs in 54 pin TSOP II package and one 2048 bit EEPROM in 8pin
|
OCR Scan
|
GMM27317233ATG
x72BIT
GMM27317233ATG
72bits
GMM27317233AT
|
PDF
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