SM4005
Abstract: SM400-5 ILD213 TSSOP14 tssop14 st automotive
Text: STEVAL-IFP004V1 Digital input termination PCLT2 Data Brief Features • Dual input channel ■ Robust with EMC ■ Wide operating range ■ Exposed pad TSSOP14 ■ Flexible current limiter ■ Output driver Description The purpose of this demo board is to evaluate the
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STEVAL-IFP004V1
TSSOP14
SM4005
SM400-5
ILD213
TSSOP14
tssop14 st automotive
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Untitled
Abstract: No abstract text available
Text: TS SO P1 4 SOT402-1 TSSOP14; Reel pack; SMD, 13"; Q1 Standard product orientation; Orderable part number ending, 623 or XP; Ordering code 12NC ending 623 Rev. 1 — 14 May 2013 Packing information 1. Packing method Printed plano box Barcode label Reel Tape
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OT402-1
TSSOP14;
001aak603
OT402-1
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LVX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LVX00FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC05FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC05FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: M74HC126 Quad bus buffer 3-state Datasheet - production data • Balanced propagation delays: tPLH ≅ tPHL • Wide operating voltage range: VCC (opr) = 2 V to 6 V • Pin and function compatible with 74 series 126 SO14 TSSOP14 Features • ESD performance
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M74HC126
TSSOP14
M74HC126
DocID8021
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VCX00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VCX00FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC00FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC00FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX126FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX126FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX04FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX04FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC14FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC14FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC126FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC126FT
TSSOP14
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Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LCX74FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LCX74FT
TSSOP14
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Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC27FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC27FT
TSSOP14
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Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74VHC10FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74VHC10FT
TSSOP14
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M74HC04B1
Abstract: No abstract text available
Text: M74HC04 Hex inverter Datasheet - production data Description The M74HC04 is a high-speed CMOS hex inverter manufactured using silicon gate C2MOS technology. DIP14 SO14 TSSOP14 Features The internal circuit is composed of 3 stages including a buffer output which enables high noise
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M74HC04
M74HC04
DIP14
TSSOP14
DocID001882
M74HC04B1
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TSSOP14
Abstract: SOT402-1
Text: PDF: 2003 Mar 24 Philips Semiconductors Package outline TSSOP14: plastic thin shrink small outline package; 14 leads; body width 4.4 mm SOT402-1 E D A X c y HE v M A Z 8 14 Q A 3 A2 A A1 pin 1 index θ Lp L 1 7 e detail X w M bp 2.5 5 mm scale DIMENSIONS (mm are the original dimensions)
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TSSOP14:
OT402-1
MO-153
TSSOP14
SOT402-1
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TSSOP14
Abstract: TTP-14D
Text: JEITA Package Code P-TSSOP14-4.4x5-0.65 RENESAS Code PTSP0014JA-A *1 Previous Code TTP-14D D MASS[Typ.] 0.05g NOTE 1. DIMENSIONS"*1 Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 8 bp c *2 c1 HE E b1 Reference
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P-TSSOP14-4
PTSP0014JA-A
TTP-14D
TSSOP14
TTP-14D
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TSSOP14
Abstract: TSSOP-14
Text: Thin Shrink Small Outline Package 14pin TSSOP14 パッケージ エンボス方式テーピング寸法 EL テープ形状および寸法 単位 : mm 4.0 ±0.1 8.0 ±0.1 φ1.5 +0.1 –0 1.75 ±0.1 2.0 ±0.1 Y 0.3 ±0.05 X’ X 5.4 ±0.1 φ1.6 ±0.1 16.0 ±0.3
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14pin
TSSOP14
TSSOP14
TSSOP-14
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74HCXXX
Abstract: 74HCxx TSSOP48 CMOS4000 STMicroelectronics package outline dip 74LX1G M013TR M74HCXXXM1R TC74HCTXXXAP SN74ACTXXXPW
Text: Surface mounting packages Standard Logic ICs SO-8 SO-14 SO-16L SO-16 SO-20 SO-24 Cross reference guide TSSOP14 SOT23-8L TSSOP20 TSSOP16 SOT23-5L SOT323-5L Flip-Chip4 TSSOP48 TSSOP24 µFBGA42 Package TFBGA54 TFBGA96 H inch W (tape width mm) P (mm) D (mm)
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SO-14
SO-16L
SO-16
SO-20
SO-24
TSSOP14
OT23-8L
TSSOP20
TSSOP16
OT23-5L
74HCXXX
74HCxx
TSSOP48
CMOS4000
STMicroelectronics package outline dip
74LX1G
M013TR
M74HCXXXM1R
TC74HCTXXXAP
SN74ACTXXXPW
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OF TL084 OPAMP
Abstract: audio Amp. mosfet 1000 watt 3000 Watt BTL Audio Amplifier AUDIO AMPLIFIER 140 WATT MOSFET 24v 5 amp smps TDA2320A replacement DC MOTOR DRIVE WITH LM324 NE555 IGBT DRIVER TSM1001 lm336 sot23
Text: Standard linear portfolio From innovative devices to application specific products Package Flip chip DFN8 Mini SO8 SO8 S014/16 SO20 SO24 batwing SOT23-3/5 TO92 TQFP44/48 TSSOP8 TSSOP14/16 TSSOP28 Tape width mm Qty/reel (min.order qty) Lead-free available
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S014/16
OT23-3/5
TQFP44/48
TSSOP14/16
TSSOP28
Jan-04
SGSTDLINPO/1003
OF TL084 OPAMP
audio Amp. mosfet 1000 watt
3000 Watt BTL Audio Amplifier
AUDIO AMPLIFIER 140 WATT MOSFET
24v 5 amp smps
TDA2320A replacement
DC MOTOR DRIVE WITH LM324
NE555 IGBT DRIVER
TSM1001
lm336 sot23
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TSSOP14
Abstract: No abstract text available
Text: JEITA Package Code P-TSSOP14-4.4x5-0.65 RENESAS Code PTSP0014JA-B *1 Previous Code TTP-14DV D MASS[Typ.] 0.05g NOTE 1. DIMENSIONS"*1 Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 8 HE c *2 E bp Index mark Terminal cross section
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P-TSSOP14-4
PTSP0014JA-B
TTP-14DV
TSSOP14
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TSSOP14
Abstract: No abstract text available
Text: JEITA Package Code P-TSSOP14-4.4x5-0.65 RENESAS Code PTSP0014JA-C *1 Previous Code TTP-14DBV D MASS[Typ.] 0.05g NOTE 1. DIMENSIONS"*1 Nom)"AND"*2" DO NOT INCLUDE MOLD FLASH. 2. DIMENSION"*3"DOES NOT INCLUDE TRIM OFFSET. F 14 8 *2 c HE E bp Terminal cross section
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P-TSSOP14-4
PTSP0014JA-C
TTP-14DBV
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LVX32FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LVX32FT
TSSOP14
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Untitled
Abstract: No abstract text available
Text: Reliability Tests Report Product Name: TC74LVX04FT Package Name: TSSOP14 1. Thermal tests Test Item Heat resistance Reflow Heat resistance (Iron) Temperature cycling - Test Condition Peak : 260 deg.C(a moment) Reflow zone : 230 deg.C 30 to 50 s Preheat : 180 to 190 deg.C , 60 to 120 s
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TC74LVX04FT
TSSOP14
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