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    Amphenol PCD VG95234U132A55PN

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    Amphenol PCD VG95234U132A69PN

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    Amphenol PCD VG95234U132A69SN

    RECEPTACLE CRIMP 61 CONTACTS
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    DigiKey VG95234U132A69SN Bag 10
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    Amphenol PCD VG95234U132A10PN

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    DigiKey VG95234U132A10PN Bag 10
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    Amphenol PCD VG95234U132A55SN

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    DigiKey VG95234U132A55SN Bag 10
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    U132A Datasheets (1)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    U132A National Semiconductor 132 Pin Ceramic Pin Grid Array Original PDF

    U132A Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    4bc7

    Abstract: No abstract text available
    Text: Product Specification Pitch C ard E dg e C onnector SM T ᯘ፸፷፿ᙚ ‫ٮ‬፸፷፿ᙚຠ ፾ ‫ ۉ‬፿፸ᎀᩰ ᯙ፸ OOፅፅፙጩ ጻጻጩ ጰ ጪ ጾ ፘጮ ጩ ጶ ፘጴ ፂ ጲ ጺ ‫ ้ ؛‬ታ ٍ ጺ ጬ ፆ ፙ ፹፾፧፹፾፧ ᎑ ᎜ ᎓፧ ᙜ ፷ ፻፧᎙ Ꭼ Ꮍ ፧ ᎖ ፧


    Original     		PDF

    U132A

    Abstract: No abstract text available
    Text: 132 Pin Ceramic Pin Grid Array NS Package Number U132A All dimensions are in inches millimeters LIFE SUPPORT POLICY NATIONAL’S PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROVAL OF THE PRESIDENT OF NATIONAL


    Original     		U132A U132A PDF

    transistor BC 458

    Abstract: transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE
    Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		MS011795 transistor BC 458 transistor BC 945 ac 1084 transistor bc 577 Transistor BC 585 MS-015-AB TRANSISTOR A42 bd 743 transistor uA109 CA 358 AE PDF

    FCBGA-1299

    Abstract: transistor c1394 Transistor C1390 U112D nvidia chip transistor C1740 CXD9872AK TRANSISTOR C1741 c1740 transistor C1399 transistor
    Text: 5 4 3 2 1 Schematics Page Index Title / Revision / Change Date D C B Page 01 02 03 04 05 06 07 08 09 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 Rev. Title of Schematics Page Schematics Page Index Block Diagram Merom(HOST BUS) 1/3


    Original     		75ohm 120ohm C1400, C1399, C1401, C1402, C1403, C1404 PC214 MS90-1-01 FCBGA-1299 transistor c1394 Transistor C1390 U112D nvidia chip transistor C1740 CXD9872AK TRANSISTOR C1741 c1740 transistor C1399 transistor PDF

    iso 1043-1

    Abstract: DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 iso 1043-1 polypropylene j1344 sae j1344 W28B D1972 DIN6120 d24j TA11A PDF

    CERAMIC PIN GRID ARRAY 120 pins

    Abstract: 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A
    Text: Ceramic Pin Grid Array CPGA 44 Pin Ceramic Pin Grid Array, Cavity Up NS Package Number U44A 2000 National Semiconductor Corporation MS101111 www.national.com Ceramic Pin Grid Array (CPGA) August 1999 Ceramic Pin Grid Array (CPGA) 65 Pin Ceramic Pin Grid Array


    Original     		MS101111 UA65A CERAMIC PIN GRID ARRAY 120 pins 144 CERAMIC PIN GRID ARRAY CPGA CPGA U121A CERAMIC PIN GRID ARRAY CPGA U120C U68B Array UA65A U44A PDF

    iso 1043-1

    Abstract: DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray
    Text: Packing Considerations Methods, Materials and Recycling Transport Media All NSC commercial devices are prepared, inspected and packed to insure proper physical support and protection during handling, transportation and shipment. Assembled devices are packed in one or more of the following container


    Original     		MS011809-4 MS011809-1 MS011809-5 MS011809-2 MS011809-6 MS011809-3 MS011809-7 MS011809 iso 1043-1 DIN 6120 sae j1344 j1344 w28c iso 1043-1 polypropylene bga Shipping Trays MEC34 BGA OUTLINE DRAWING TSOP package tray PDF

    transistor BC 458

    Abstract: transistor a42 MO-003 transistor Bc 540 ua109a CERAMIC PIN GRID ARRAY CPGA lead frame transistor bc 577 W144A UA65A CERAMIC QUAD FLATPACK CQFP
    Text: Hermetic Dimensional/Thermal Data The following table identifies all of the hermetic package configurations and pin counts per package type offered by National Semiconductor. In addition, the table provides dimensional and thermal data for each of the ceramic and


    Original     		PDF

    aeg diode Si 61 L

    Abstract: aeg diodes D6 SGS Transistors BC23B SILICONIX U315 MZ306 BY126 bcv59 ac128 2N3680
    Text: Semiconductor Data Book Semiconductor Data Book Characteristics of approx. 10 000 Transistors, FETs, UJTs, Diodes, Rectifiers, Optical Semiconductors, Triacs and SCRs, Compiled by A. M. Ball Head of Physics, Teign School Newnes Technical Books Newnes Technical Books


    OCR Scan     		11tA0A12 A025A A0290 U0U55 A0291 A0292 A0305 A0306 A0A56 A0A59 aeg diode Si 61 L aeg diodes D6 SGS Transistors BC23B SILICONIX U315 MZ306 BY126 bcv59 ac128 2N3680 PDF