Untitled
Abstract: No abstract text available
Text: WE128K32-XXX HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • Access Times of 120, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm 1.075" square, Hermetic Ceramic HIP (Package 400) ■ ■ ■ ■ ■ ■ ■
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Original
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WE128K32-XXX
128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
01H5X
02H5X
03H5X
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PDF
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WE128K32-XG1TX
Abstract: WE128K32-XG1UX WE128K32-XH1X WE128K32-XXX WE128K32-XG2TX
Text: WE128K32-XXX 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • ■ ■ ■ ■ ■ ■ ■ Low Power CMOS Automatic Page Write Operation Page Write Cycle Time: 10ms Max Data Polling for End of Write Detection Hardware and Software Data Protection TTL Compatible Inputs and Outputs
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Original
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WE128K32-XXX
128Kx32
WE128K32-XG2TX1
WE128K32-XG1UX
WE128K32-XG1TX
WE128K32-XH1X
300ns
66-pin,
02HMX1
200ns
WE128K32-XXX
WE128K32-XG2TX
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PDF
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TDB 0156
Abstract: a/TDB 0156
Text: WME128K8-XXXE WHITE ELECTRONIC DESIGNS CORPORATION 128Kx8 CMOS MONOLITHIC EEPROM ADVANCED* FEATURES FIG. 1 • Access Times of 150, 200, 250, 300ns ■ JEDEC Approved Packages • 32 pin, Hermetic Ceramic, 0.600" DIP Package 300 • 32 lead, Hermetic Ce.ramic, 0.400" SOJ (Package 101)
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Original
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WME128K8-XXXE
128Kx8
300ns
128Kx8.
MIL-STD-883
TDB 0156
a/TDB 0156
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PDF
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WE128K32-XG2TX
Abstract: 128K32 WE128K32-XH1X WE128K32-XXX we128k32xxx
Text: White Electronic Designs WE128K32-XXX 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES Access Times of 120*, 140, 150, 200, 250, 300ns Page Write Cycle Time: 10ms Max Packaging: Data Polling for End of Write Detection • 66-pin, PGA Type, 27.3mm 1.075" square,
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Original
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WE128K32-XXX
128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
WE128K32-XG2TX
WE128K32-XH1X
Dat66
128K32
WE128K32-XXX
we128k32xxx
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PDF
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WE128K32-XXX
Abstract: WE128K32N-XH1X WE128K32-XH1X we128k32xxx
Text: WE128K32-XXX White Electronic Designs 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES Access Times of 125, 140, 150, 200, 250, 300ns Page Write Cycle Time: 10ms Max Packaging: Data Polling for End of Write Detection • 66-pin, PGA Type, 27.3mm 1.075" square,
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Original
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WE128K32-XXX
128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
WE128K32-XG2TX
WE128K32-XH1X
04H6X
WE128K32-XXX
WE128K32N-XH1X
we128k32xxx
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PDF
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Untitled
Abstract: No abstract text available
Text: WE128K32-XXX HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • Access Times of 120, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic HIP Package 400 ■ ■ ■ ■ ■ ■ ■ ■
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Original
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WE128K32-XXX
128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
01H5X
02H5X
03H5X
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PDF
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04HMX
Abstract: No abstract text available
Text: WE128K32-XXX White Electronic Designs 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES Access Times of 120*, 125, 140, 150, 200, 250, 300ns Packaging: • 66-pin, PGA Type, 27.3mm 1.075" square, Hermetic Ceramic HIP (Package 400) • 68 lead, 22.4mm sq. CQFP (G2T), 4.57mm
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Original
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128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
WE128K32-XXX
01H5X
02H5X
03H5X
04HMX
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PDF
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WE128K32-XG1UX
Abstract: WE128K32-XH1X WE128K32-XXX
Text: WE128K32-XXX HI-RELIABILITY PRODUCT 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • ■ ■ ■ ■ ■ ■ ■ Access Times of 120*, 140, 150, 200, 250, 300ns ■ Packaging: • 66-pin, PGA Type, 27.3mm 1.075" square, Hermetic Ceramic HIP (Package 400)
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Original
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WE128K32-XXX
128Kx32
300ns
66-pin,
WE128K32-XG2TX
WE128K32-XG1UX
WE128K32-XH1X
WE128K32-XG4X
02HNX
200ns
WE128K32-XXX
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PDF
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Untitled
Abstract: No abstract text available
Text: WE128K32-XXX 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES Access Times of 125, 140, 150, 200, 250, 300ns Packaging: Data Polling for End of Write Detection Hardware and Software Data Protection • 66-pin, PGA Type, 27.3mm 1.075" square, Hermetic
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Original
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WE128K32-XXX
128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
WE128K32-XG2TX
WE128K32-XH1X
01H4X,
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PDF
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Untitled
Abstract: No abstract text available
Text: White Electronic Designs WE128K32-XXX 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES Data Polling for End of Write Detection Hardware and Software Data Protection TTL Compatible Inputs and Outputs 5 Volt Power Supply Built-in Decoupling Caps and Multiple Ground
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Original
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128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
WE128K32-XXX
G2-94585
03H5X
04H5X
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PDF
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WE128K32-XXX
Abstract: WE128K32-XG1TX WE128K32-XG1UX WE128K32-XG2UX WE128K32-XH1X
Text: White Electronic Designs WE128K32-XXX 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • ■ ■ ■ ■ ■ ■ ■ Low Power CMOS Automatic Page Write Operation Page Write Cycle Time: 10ms Max Data Polling for End of Write Detection Hardware and Software Data Protection
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Original
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WE128K32-XXX
128Kx32
WE128K32-XG2UX
WE128K32-XG1UX
WE128K32-XG1TX1
WE128K32-XH1X
300ns
66-pin,
02HMX
200ns
WE128K32-XXX
WE128K32-XG1TX
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PDF
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Untitled
Abstract: No abstract text available
Text: WE128K32-XXX 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES Access Times of 125, 140, 150, 200, 250, 300ns Packaging: Data Polling for End of Write Detection Hardware and Software Data Protection • 66-pin, PGA Type, 27.3mm 1.075" square, Hermetic
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Original
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WE128K32-XXX
128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
WE128K32-XG2TX
WE128K32-XH1X
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PDF
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Untitled
Abstract: No abstract text available
Text: WME128K8-XXXE W h it e E l e c t r o n ic D e sig n s C o r p o r a t io n 128Kx8 CMOS MONOLITHIC EEPROM ADVANCED* FEATURES FIG. 1 • Access Tim es of 150, 200, 250, 300ns PIN CONFIGURATION ■ JEDEC Approved Packages 32 DIP 32 CSOJ • 32 pin, Hermetic Ceramic, 0.600" DIP Package 300
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OCR Scan
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WME128K8-XXXE
128Kx8
300ns
128Kx8.
|
PDF
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Untitled
Abstract: No abstract text available
Text: VZÀ M/HITE /M ICRO ELECTRO N ICS 128Kx32 EEPROM MODULE WE128K32-XXX • Automatic Page W rite Operation ■ Page W rite Cycle Tim e: lO m SM ax FEATU RES ■ Data Polling for End of W rite Detection ■ A ccess Tim es of 150nS, 200nS, 250nS and 300nS ■ Hardware and Software Data Protection
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OCR Scan
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128Kx32
WE128K32-XXX
150nS,
200nS,
250nS
300nS
66-pin,
128Kx32;
256Kx16
512Kx8
|
PDF
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Untitled
Abstract: No abstract text available
Text: a WE128K32-XXX WHITE /M ICRO ELECTRO N ICS 128Kx32 EEPROM MODULE, S M D 5962-94585 FEATURES • A c c ess T im e s of 140, 150, 200, 250, 3 00ns ■ ■ Packaging: ■ A u to m a tic Page W r it e O p e ra tio n • 66-pin, PGA Typ e, 1.075 inch sq uare, H e rm e tic C eram ic
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OCR Scan
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WE128K32-XXX
128Kx32
66-pin,
300ns
250ns
200ns
140ns
02HIMX
|
PDF
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Untitled
Abstract: No abstract text available
Text: WE128K32-XXX •Il Hi-R£LiASIÜTY PRODUCT 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES ■ A ccess Times of 120,1 4 0 ,1 5 0 , 200, 250, 300ns Low Power CMOS ■ Packaging: Automatic Page Write Operation • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic
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OCR Scan
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WE128K32-XXX
128Kx32
300ns
66-pin,
140ns
05HMX
120ns
06HMX*
01HNX
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PDF
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Untitled
Abstract: No abstract text available
Text: WE128K32-XXX W HITE M I C R O E L E C T R O N I C S m 128Kx32 EEPROM MODULE, SM D 5962-94585 FEATURES A cc e ss Tim es of 140, 150, 200, 250, 300ns • Page W r it e C ycle Tim e: ■ Packaging: ■ D ata Po llin g for End of W r it e D etection • 66-pin, P G A Type, 1.075 inch square, H erm etic Ceram ic
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OCR Scan
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WE128K32-XXX
128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
250ns
200ns
|
PDF
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Untitled
Abstract: No abstract text available
Text: WE128K32-XXX M/HITE /MICROELECTRONICS g 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • A c c e s s T im e s o f 1 4 0 ,1 5 0 , 20 0 , 2 50, 3 0 0 n s ■ Lo w P o w e r C M O S ■ P a c k a g in g : ■ A u to m a tic P a g e W rite O p e ra tio n • 6 6 -p in , P G A T y p e , 1 .0 7 5 inch s q u a re , H e rm e tic C e ra m ic
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OCR Scan
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WE128K32-XXX
128Kx32
|
PDF
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Untitled
Abstract: No abstract text available
Text: WE128K32-XXX M/HITE /M ICROELECTRONICS G 2 128Kx32 EEPROM MODULE, SMD 5962-94585 FEATURES • Access Tim es of 140,150, 200, 250, 300ns ■ Low Power CMOS ■ Packaging: ■ A utom atic Page W rite Operation ■ Page W rite Cycle Time: 10ms M ax • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic
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OCR Scan
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WE128K32-XXX
128Kx32
300ns
66-pin,
02HMX
200ns
03HMX
150ns
04HMX
140ns
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PDF
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L04 SMD eeprom
Abstract: 5555 is 6 pin smd ic
Text: WE128K32-XXX UVHITE / M IC R O E L E C T R O N IC S m 128Kx32 EEPROM MODULE, SMD NUMBER 5962-94585 pending FEATURES • Access Times of 150nS, 200nS, 250nS and 300nS ■ Low Power CM OS ■ Packaging: ■ Automatic Page W rite Operation • 66-pin, PGA Type, 1.075 inch square. Hermetic Ceramic
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OCR Scan
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WE128K32-XXX
128Kx32
150nS,
200nS,
250nS
300nS
66-pin,
128Kx32;
256Kx1
L04 SMD eeprom
5555 is 6 pin smd ic
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PDF
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05HMX
Abstract: No abstract text available
Text: WE128K32-XXX M/HITE /MICROELECTRONICS 128Kx32 EEPROM MODULE, SMD NUMBER 5962-94585 pending FEATURES • Access Times o f 140,150, 200, 250, 300ns ■ Low Power CMOS ■ Packaging: ■ Autom atic Page W rite Operation • 66-pin, PGA Type, 1.075 inch square, Hermetic Ceramic
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OCR Scan
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WE128K32-XXX
128Kx32
300ns
66-pin,
128Kx32;
256Kx16
512Kx8
01HXX
02HXX
05HMX
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PDF
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Untitled
Abstract: No abstract text available
Text: WME128K8-XXXE W hite El e c t r o n ic D esigns C o r p o r a t i o n 128Kx8 CMOS MONOLITHIC EEPROM ADVANCED* FEATURES FIG. 1 • Access Tim es of 150, 200, 250, 300ns PIN C O N FIG U R A TIO N ■ JEDEC Approved Packages 3 2 D IP • 32 pin, Hermetic Ceramic, 0.600" DIP Package 300
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OCR Scan
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WME128K8-XXXE
128Kx8
300ns
128Kx8.
|
PDF
|
Untitled
Abstract: No abstract text available
Text: WE128K32-XXX WHITE /M ICROELECTRONICS □ 128Kx32 EEPROM MODULE, SMD NUMBER 5962-94585 pending FEATURES • A ccess T im e s of 1 50nS, 2 0 0 nS , 2 5 0 nS and 300nS ■ Lo w P o w e r C M O S ■ Packaging: ■ A u to m a tic Page W r it e O p e ra tio n
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OCR Scan
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WE128K32-XXX
128Kx32
300nS
66-pin,
150nS
04H5X
01HMX
128Kx
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PDF
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WE128K8-XCX
Abstract: No abstract text available
Text: EEPROM MODULES WE512K8. WE256K8, • ■ WE256K16-XCX. 11-25
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OCR Scan
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WE512K8.
WE256K8,
WE128K8-XCX.
WE128K16-XCX.
WE256K16-XCX.
WE32K32-XXX.
WE128K32-XXX.
WE128K8-XCX
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PDF
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