VW-1 H
Abstract: electromagnets wh series
Text: H OOK-U P WIRE Automotive Wire Teflon Wire 300V Solid Wire 300V Stranded Wire 600V Stranded Wire Speaker Wire Black/Red Bonded Speaker Wire Magnet Wire NEw! Features: • Broad Line – Over 500 Types • Packaged in a variety of lengths, gauges and colors
|
Original
|
PDF
|
J1128
EL24-01
VW-1 H
electromagnets
wh series
|
Untitled
Abstract: No abstract text available
Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.
|
Original
|
PDF
|
40mil
55/60nm
45/40nm
28/22nm
|
copper wire datasheet
Abstract: copper wire 1mm Amkor Technology ATP3 ATP1 au wire copper bond wire copper bond wire amkor
Text: solution copper wire bonding technology Copper Cu Wire Bonding Copper (Cu) wire has long been used as a method of connecting a silicon die to the package terminals. With the recent increase in gold (Au) wire cost, Cu wire is an attractive way to manage overall package cost.
|
Original
|
PDF
|
|
precap
Abstract: No abstract text available
Text: Manufacturing Flow KIT FORMATION KIT INSPECTION DIE & COMPONENT ATTACH - WITH EPOXY CURE EPOXY CUSTOMER SOURCE INSPECTION IF APPLICABLE VACUUM BAKE HERMETIC SEAL MARK WIRE BOND QUAL/DESTRUCT WIRE PULL TEMPERATURE CYCLE WIRE BOND CONSTANT ACCELERATION WIRE BOND
|
Original
|
PDF
|
|
E024A
Abstract: E018A E240D E240B E960B E040A WIRES bonding E025A E1200A
Text: Excelics Semiconductor, Inc. Recommended Wire Bonding For Excelics FETs E018A E024A Drain Bonding Wire Grounded Source Bonding Wires Gate Bonding Wire E025A E030C Drain Bonding Wire Drain Bonding Wires Grounded Source Grounded Source Bonding Wires Bonding Wires
|
Original
|
PDF
|
E018A
E024A
E025A
E030C
E040A
E060A
E240D,
E480C,
E720A,
E960B
E024A
E018A
E240D
E240B
E040A
WIRES
bonding
E025A
E1200A
|
Untitled
Abstract: No abstract text available
Text: Product Specification 108-2059 02Mar11 Rev B Vertical Screwless Wire Connector 1. SCOPE 1.1. Content This specification covers performance, tests and quality requirements for the Tyco Electronics Vertical Screwless Wire Connector designed to terminate 16 and 18 AWG solid wire, and 18 AWG bonded wire
|
Original
|
PDF
|
02Mar11
28Mar02.
17Feb11.
|
5724 ALPHA
Abstract: No abstract text available
Text: FIT Wire Management Alpha Wire | www.alphawire.com | 1-800-52 ALPHA Specifications subject to change. For complete specifications and availability, visit www.alphawire.com. 481 FIT® Wire Management Better wire management means better harnesses B ringing order to wire
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:
|
Original
|
PDF
|
MVB4080X104ZGH5C3
MVL4080X104MGH5Câ
|
MVB4080X104ZGH5R3
Abstract: MVL3030 MVL3030X103 MVB3030X103M2 MVL3080X104MGH5R MVB2741X104MG MVL2020X102M2H5R MVL2020X103MEH5R EIA-469 Presidio Components
Text: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile High Capacitance Multi-Layer
|
Original
|
PDF
|
MVL4080X104MGH5N
MVB4080X104ZGH5R3
MVB4080X104ZGH5R3
MVL3030
MVL3030X103
MVB3030X103M2
MVL3080X104MGH5R
MVB2741X104MG
MVL2020X102M2H5R
MVL2020X103MEH5R
EIA-469
Presidio Components
|
MVB3030X103M2
Abstract: No abstract text available
Text: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:
|
Original
|
PDF
|
MVB4080X104ZGH5C3
MVL4080X104MGH5Câ
MVB3030X103M2
|
MVL3030X103M2H5R
Abstract: MVL3030 MVB4080X104MG
Text: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:
|
Original
|
PDF
|
MVL4080X104MGH5N
MVB4080X104ZGH5R3
MVL3030X103M2H5R
MVL3030
MVB4080X104MG
|
MVL2741X104MGH5C
Abstract: No abstract text available
Text: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:
|
Original
|
PDF
|
MVB4080X104ZGH5C3
MVL4080X104MGH5Câ
MVL2741X104MGH5C
|
Presidio Components Vb
Abstract: MVL4080X303M2H5R-
Text: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:
|
Original
|
PDF
|
MVL4080X104MGH5Nâ
MVB4080X104ZGH5R3
Presidio Components Vb
MVL4080X303M2H5R-
|
Presidio Components VL
Abstract: MVL3030X103M2H5R MVB4080X104ZGH5R3 MVB4080X104MG
Text: WIRE BONDABLE VERTICAL ELECTRODE CAPACITORS PRESIDIO ADVANTAGE VL SERIES • Wire Bondable Bypass Capacitors for MMIC’s • Wire Bondable Integrated Broadband Bypass Capacitors for MMIC’s up to Millimeter Frequencies • Low Profile Multi-Layer VL: VB:
|
Original
|
PDF
|
MVL4080X104MGH5N
MVB4080X104ZGH5R3
858-578-Rhode
Presidio Components VL
MVL3030X103M2H5R
MVB4080X104ZGH5R3
MVB4080X104MG
|
|
|
MXP400X
Abstract: 7400 family bonder 150-degree
Text: Application Note - MXP400x Wire bond InGaAs/InP PIN Photo Diode Family OPTO-ELECTRONIC PRODUCTS W W W. Microsemi .COM Guideline for wire bond to MXP400x bare die. Recommend Wedge Bond used. Wedge detail informations: * 45 degee wire feed angle. * .0015 in. hole size.
|
Original
|
PDF
|
MXP400x
400-15A-32-34
7400 family
bonder
150-degree
|
Untitled
Abstract: No abstract text available
Text: Primary Wire INCLUDING OEM APPLICATIONS General Cable’s Carol ® Brand primary wire is ideal for general purpose wiring for automobiles, boats, trucks, buses, tractors, trailers and other motordriven equipment. Carol Brand single, duplex and bonded parallel/multi-conductor primary wire
|
Original
|
PDF
|
4P163
4P164
13P163C
13P164C
13P143C
13P144C
AUT-0075-1008
|
Untitled
Abstract: No abstract text available
Text: MTT www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Resistance range: 1.1 k to 275 k • Chip size: 0.038" x 0.038" • Case: 0404 • Resistor
|
Original
|
PDF
|
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
|
Untitled
Abstract: No abstract text available
Text: MTR www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Chip size: 0.030" x 0.030" • Case: 0303 • Standard resistance range: 100 to 24 k or 800 to
|
Original
|
PDF
|
2002/95/EC.
2002/95/EC
2011/65/EU.
JS709A
02-Oct-12
|
Untitled
Abstract: No abstract text available
Text: MTT www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Resistance range: 1.1 k to 275 k • Chip size: 0.038" x 0.038" • Resistor material tantalum nitride, self-passivating
|
Original
|
PDF
|
11-Mar-11
|
Untitled
Abstract: No abstract text available
Text: MTR www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Chip size: 0.030" x 0.030" • Standard resistance range: 100 to 24 k or 800 to 240 k
|
Original
|
PDF
|
11-Mar-11
|
bonding
Abstract: VG-50
Text: Application Note for Dual-Gate FETs Bonding Diagram bonding wires are 1-mil diameter Au wires Drain Bonding Wire "Gate 2" Bonding Wires (2 plcs, 1 wire per pad) Source Bonding Wires (2 plcs, 2 wires per pad) Gate Bonding Wire Single Bias Configuration Dual Bias Configuration
|
Original
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: MTR www.vishay.com Vishay Electro-Films Wire Bondable Thin Film Multi-Tap Resistor Arrays FEATURES • Wire bondable • Selectable values by wire bonding • Chip size: 0.030" x 0.030" • Case: 0303 • Standard resistance range: 100 to 24 k or 800 to
|
Original
|
PDF
|
2011/65/EU
2002/95/EC.
2002/95/EC
2011/65/EU.
12-Mar-12
|
Untitled
Abstract: No abstract text available
Text: This push-wire contact clamps the following copper conductors: solid wire PUSH-WIRE connections are suitable for applications where solid wire is used exclusively - for example in lighting, building installations, telecom munications and security. PUSHWIRE is
|
OCR Scan
|
PDF
|
|
Untitled
Abstract: No abstract text available
Text: Catalog 1307612 AMPU-BOND Insulated Terminals Product Facts • Designed to accommodate wire gauges 8 AWG through 4/0 AWG ■ The first large wire terminal to feature vinyl insulation bonded to the terminal sleeve ■ Terminals for wire sizes 8 AWG through 4/0 AWG
|
OCR Scan
|
PDF
|
MIL-T-7928,
|
