WLCSP smt
Abstract: EIA-481-D-2008 Cu OSP and Cu SOP qfn tray pocket size 5 x 6 SUF1577-15 WLCSP stencil design without underfill SAC396 cte table flip chip substrate SAC 2.3 Ag bump composition
Text: AN69061 Design, Manufacturing, and Handling Guidelines for Cypress Wafer-Level Chip Scale Packages WLCSP Author: Wynces Silvoza, Bo Chang Associated Project: No Associated Part Family: All Cypress WLCSP products Software Version: None Associated Application Notes: None
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AN69061
AN69061
WLCSP smt
EIA-481-D-2008
Cu OSP and Cu SOP
qfn tray pocket size 5 x 6
SUF1577-15
WLCSP stencil design
without underfill
SAC396
cte table flip chip substrate
SAC 2.3 Ag bump composition
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SAC1205
Abstract: IPC-A-600G IPC-6012 WLCSP stencil design JESD-B111 AN3846 sac105 IPC 6012 WLCSP smt IPC-6016
Text: Freescale Semiconductor Application Note AN3846 Rev. 2.0, 8/2009 Wafer Level Chip Scale Package WLCSP 1 Purpose The purpose of this Application Note is to outline the basic guidelines to use the Wafer Level Chip Scale Package (WLCSP) to ensure consistent Printed Circuit Board (PCB)
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AN3846
SAC1205
IPC-A-600G
IPC-6012
WLCSP stencil design
JESD-B111
AN3846
sac105
IPC 6012
WLCSP smt
IPC-6016
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SAC387
Abstract: IPC-7525 pcb warpage in ipc standard land pattern for WLCSP "x-ray machine" ROSIN FLUX TYPE ROL0 WLCSP stencil design FDZ191P sac105 IPC-9075
Text: www.fairchildsemi.com AN-6084 Surface Mount Assembly Guideline for WLCSP 1.0x1.5 Introduction The Wafer-Level Chip-Scale Package WLCSP is one of the smallest discrete MOSFET devices available in the market. Fairchild’s offering comes in two ultra-low profile
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AN-6084
SAC387
IPC-7525
pcb warpage in ipc standard
land pattern for WLCSP
"x-ray machine"
ROSIN FLUX TYPE ROL0
WLCSP stencil design
FDZ191P
sac105
IPC-9075
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WLCSP stencil design
Abstract: 7531A IPC-7531A FDZ191P FPF1003 AN-9045 WLCSP SMT IPC-SM-7525A FPF1004 JESD22-B102D
Text: Application Note AN-9045 WLCSP Assembly Guidelines By Dennis Lang INTRODUCTION PAD FINISH Wafer level chip scale packaging WLCSP is actually an old packaging technology, likely the oldest finding significant growth today. The technology is valued today for the same reasons it
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AN-9045
IPC-7531A
JESD22-B102D,
FPF1003,
FPF1004,
FDZ191P,
FDZ193P
WLCSP stencil design
7531A
IPC-7531A
FDZ191P
FPF1003
AN-9045
WLCSP SMT
IPC-SM-7525A
FPF1004
JESD22-B102D
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Untitled
Abstract: No abstract text available
Text: FAX# 408 944-0970 TITLE 6 BALL WLCSP 0.80x1.20mm PACKAGE OUTLINE & RECOMMENDED LAND PATTERN DRAWING # WLCSP080120D-6BL-PL-9 Rev A ECN 052212HC01 Originator S. YEH Change New release UNIT MM Reason New
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WLCSP080120D-6BL-PL-9
052212HC01
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Nihon handa rx303-92skho
Abstract: RX303-92SKHO VMMK-125 0402 land pattern INCOMING INSPECTION solder paste recommended land pattern for 0402 cap WLCSP stencil design VMMK-1225 AV02-1078EN land pattern for WLCSP
Text: VMMK-1225 production assembly process Application Note 5378 Description Package Features Avago Technologies has combined our industry leading EpHEMT technology with a revolutionary wafer level chip scale package design WLCSP . This wafer level chip scale
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VMMK-1225
VMMK-125
AV02-1078EN
Nihon handa rx303-92skho
RX303-92SKHO
0402 land pattern
INCOMING INSPECTION solder paste
recommended land pattern for 0402 cap
WLCSP stencil design
land pattern for WLCSP
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Solder Paste, Indium 5.8
Abstract: SOT996-2 VSSOP8 MICROPAK XX SOT103 WLCSP stencil design J-STD-020D SOT996 sot1049 XQFN10U
Text: AN10343 MicroPak soldering information Rev. 2 — 30 December 2010 Application note Document information Info Content Keywords MicroPak, footprint, Ball Grid Array BGA , Wafer-Level Chip Scale Package (WLCSP) Abstract This application note describes evaluation of recommended solder land
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AN10343
Solder Paste, Indium 5.8
SOT996-2
VSSOP8
MICROPAK XX
SOT103
WLCSP stencil design
J-STD-020D
SOT996
sot1049
XQFN10U
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amkor RDL
Abstract: amkor flip FCCSP JEDEC tray standard amkor Sip
Text: data sheet wafer level packaging CSPnl Features: CSPnl DSBGA / WLCSP / WSCSP / WLP Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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JESD51-7
Abstract: MO-211 photocopy machine MP20049 WLCSP automatic ac 2kv voltage regulator circuit diagram
Text: MP20049 Ultra-Low Noise, High PSRR 150mA Linear Regulator in 0.8x0.8mm WLCSP The Future of Analog IC Technology DESCRIPTION The MP20049 is an ultra-low noise, low-dropout, high PSRR linear regulator. Fixed output voltage options are available between 1.2V to
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MP20049
150mA
MP20049
MP200ALL
MO-211,
JESD51-7
MO-211
photocopy machine
WLCSP
automatic ac 2kv voltage regulator circuit diagram
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IPC-6011
Abstract: IPC-D-279 IPC-6013 ipc 7094 IPC-6012 IPC-2223 IPC 6012 IPC-6016 IPC-2221 IPC-2222
Text: Maxim > App Notes > General Engineering Topics Prototyping and PC-Board Layout Wireless, RF, and Cable Keywords: chip scale package, flip chip, CSP, UCSP, U-CSP, BGA, WLCSP May 01, 2008 APPLICATION NOTE 1891 Wafer-Level Packaging WLP and Its Applications
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1000x
com/an1891
AN1891,
APP1891,
Appnote1891,
IPC-6011
IPC-D-279
IPC-6013
ipc 7094
IPC-6012
IPC-2223
IPC 6012
IPC-6016
IPC-2221
IPC-2222
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RF6650
Abstract: LQM2HPN2R2MG0L material declaration taiyo yuden smps dc-dc circuits Material Declaration MURATA
Text: RF6650 POWER MANAGEMENT IC Package: 8-Bump WLCSP, 3x3 Array, 1.58mm x1.57mm Features VPWR C3 A1 RF6650 AGND High Efficiency >95% Transient Response <25s 650mA Load Current Capability Programmable Output Voltage Bypass FET
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RF6650
650mA
RF6650
DS110620
LQM2HPN2R2MG0L
material declaration taiyo yuden
smps dc-dc circuits
Material Declaration MURATA
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Untitled
Abstract: No abstract text available
Text: 40 µA Micropower Instrumentation Amplifier in WLCSP Package AD8235 CONNECTION DIAGRAM FEATURES RG RG C3 ESD PROTECTION ESD PROTECTION ESD PROTECTION 210k 52.5k NC D2 –VS A1 D1 210k ESD PROTECTION OP AMP B ESD PROTECTION ESD PROTECTION A3 D3 B1 VOUT 08211-001
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AD8235
AD8235
60409-A
11-Ball,
CB-11-1)
AD8235ACBZ-P7
11-Ball
D08211-0-8/09
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Untitled
Abstract: No abstract text available
Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCD016GWZ-3 General Description 2 BRCD016GWZ-3 is a 16Kbit serial EEPROM of I C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features Completely Conforming to the World Standard I2C
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BRCD016GWZ-3
BRCD016GWZ-3
16Kbit
400KHz
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Untitled
Abstract: No abstract text available
Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCD064GWZ-3 General Description BRCD064GWZ-3 is a 64Kbit serial EEPROM of I2C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features 2 Completely Conforming to the World Standard I C
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BRCD064GWZ-3
BRCD064GWZ-3
64Kbit
UCSP35L1
400KHz
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amkor flip
Abstract: wlcsp inspection amkor RDL amkor Sip dS721
Text: data sheet wafer level packaging CSPnl BOR CSPnl Bump on Repassivation BOR (DSBGA / WLCSP / WSCSP / WLP) Wafer Level Packaging Amkor's wafer level packaging service meets the industry's growing demand for full turnkey assembly and test solutions for CSP (Chip Scale Package) products. Through the
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Material Declaration MURATA
Abstract: No abstract text available
Text: RF6650 POWER MANAGEMENT IC Package: 8-Bump WLCSP, 3x3 Array, 1.58mm x1.57mm Features VPWR C3 A1 RF6650 AGND High Efficiency >95% Transient Response <25s 650mA Load Current Capability Programmable Output Voltage Bypass FET
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RF6650
650mA
B440-57-5
DS110620
Material Declaration MURATA
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PDF
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Untitled
Abstract: No abstract text available
Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCG064GWZ-3 General Description BRCG064GWZ-3 is a 64Kbit serial EEPROM of I2C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features 2 Completely Conforming to the World Standard I C
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BRCG064GWZ-3
BRCG064GWZ-3
64Kbit
UCSP35L1
400KHz
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SAC266
Abstract: SAC405 J-STD-012 IPC-6012 BGA Solder Ball compressive force WLCSP stencil design IPC-6012A LATTICE SEMICONDUCTOR Tape and Reel Specification IPC-4101 IPC-7525
Text: Application Note 71 Design and Manufacturing with Summit Microelectronic’s WLCSP Products Introduction Per the IPC/JEDEC J-STD-012 definition, a CSP is a single-die, direct surface mountable package with an area of no more than 1.2 times the original die area.
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J-STD-012
SAC266
SAC405
IPC-6012
BGA Solder Ball compressive force
WLCSP stencil design
IPC-6012A
LATTICE SEMICONDUCTOR Tape and Reel Specification
IPC-4101
IPC-7525
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Untitled
Abstract: No abstract text available
Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCD016GWZ-3 General Description 2 BRCD016GWZ-3 is a 16Kbit serial EEPROM of I C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features Completely Conforming to the World Standard I2C
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BRCD016GWZ-3
BRCD016GWZ-3
16Kbit
400KHz
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Untitled
Abstract: No abstract text available
Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCB032GWZ-3 General Description BRCB032GWZ-3 is a 32Kbit serial EEPROM of I2C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features All Controls Available by 2 Ports of Serial Clock
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BRCB032GWZ-3
BRCB032GWZ-3
32Kbit
UCSP30L1
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Untitled
Abstract: No abstract text available
Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCD064GWZ-3 General Description BRCD064GWZ-3 is a 64Kbit serial EEPROM of I2C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features 2 Completely Conforming to the World Standard I C
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BRCD064GWZ-3
BRCD064GWZ-3
64Kbit
UCSP35L1
400KHz
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PDF
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Untitled
Abstract: No abstract text available
Text: Datasheet Serial EEPROM Series Standard EEPROM WLCSP EEPROM BRCE064GWZ-3 General Description BRCE064GWZ-3 is a 64Kbit serial EEPROM of I2C BUS Interface Method Packages W Typ x D(Typ) x H(Max) Features 2 Completely Conforming to the World Standard I C
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BRCE064GWZ-3
BRCE064GWZ-3
64Kbit
UCSP25L1
400KHz
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PDF
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Untitled
Abstract: No abstract text available
Text: APA2178 100mW Stereo Cap-Free Headphone Driver Features • • • • • • • • • • • • General Description No Output Capacitor Required The APA2178 is a stereo, fixed gain, Cap-Free headphone driver which is available in a WLCSP-16 package.
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APA2178
100mW
APA2178
WLCSP-16
JESD-22,
MIL-STD-883-3015
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Untitled
Abstract: No abstract text available
Text: 2.5 Ω CMOS Low Power Dual 2:1 Mux/Demux USB 1.1 Switch ADG787 FEATURES FUNCTIONAL BLOCK DIAGRAM USB 1.1 signal switching compliant −3 dB bandwidth, 150 MHz Tiny 10-lead LFCSP and MSOP packages, 10-ball WLCSP package Single-supply 1.8 V to 5.5 V operation
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ADG787
10-lead
10-ball
ADG787
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