470M
Abstract: No abstract text available
Text: 1. M echanical D im ensions: 2. Sch em atic: C 3.00 Max D 0.150 3. E lectrical Specification : TOP VIEW (SIDE VIEW) Inductance: 47uH±20% 100KHz 0.1V DCR: 268 mOhms Max Isat: 0.34Adc Max (Based on OCL drop by 30%) Irms: 0.75A Max (Based on 40% Temp Rise)
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OCR Scan
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100KHz
34Adc
MIL-STD-202,
UL94V-0
E151556
XF505030SHâ
Dec-16-03
470M
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PDF
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Untitled
Abstract: No abstract text available
Text: 1. M echanical D im ensions: 2. Sch em atic: D 1.5Max 3. E lectrical Specification : INDUCTANCE: 10uH±20% 100KHz 0.1V DCR: 230 mOhms Max SIDE VIEW Isat: 0.57Adc Max, 30% drop in Inductance Irms: 0.78Adc Max, based on 40% temp rise 6.0 4.0 1 BOTTOM VIEW
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OCR Scan
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100KHz
57Adc
78Adc
MIL-STD-202,
UL94V-0
E151556
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PDF
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150M
Abstract: No abstract text available
Text: 2 . Sch em atic: 1. M echanical D im ensions: C 2.0Max 3. E lec trical S p ecificatio n : INDUCTANCE: 15uH±20% 100KH z 0.1V SIDE VIEW DCR: 210 mOhms Max Isat: 0.88Adc Max, 30% drop in Inductance Irm s: 0.97Adc Max, based on 40% te m p rise 6.0 4.0
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OCR Scan
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100KHz
88Adc
97Adc
MIL-STD-202,
UL94V-0
E151556
XF505020SHâ
Nov-18-03
150M
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PDF
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Untitled
Abstract: No abstract text available
Text: 1. M echanical D im ensions: 2. Sch em atic: C 2.0Max D 0.15 3. E lectrical Specification : TOP VIEW INDUCTANCE: 10uH±20% @100KHz 0.1V DCR: 230 mOhms Max Isat: 0.57Adc Max, 30% drop in Inductance Irms: 0.78Adc Max, based on 40% temp rise SIDE VIEW 6.0
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OCR Scan
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100KHz
57Adc
78Adc
MIL-STD-202,
UL94V-0
E151556
XF505020SHâ
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PDF
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rb 503
Abstract: No abstract text available
Text: 1. M e c h a n i c a l D im e n s i o n s : 2 . S ch e m atic: c 2,0Max D 0.1 5 o- 3. E l e c t r i c a l S p e c i f i c a t i o n : INDUCTANCE: 3.5uH±20% @100KHz 0.1V TOP VIEW SIDE VIEW DCR: 503 mOhms Typ Isal: 1.82Adc Max, 30% drop in Inductance Irms: 1,73Adc Max, based on 40% temp rise
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OCR Scan
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100KHz
82Adc
73Adc
MIL-STD-202G,
UL94V-0
E151556
-l-125
rb 503
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PDF
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LF1608
Abstract: XT2012
Text: The flexibility of Surface Mount Technology is greatly expanded by the use of Multilayer Integrated Circuit Technology. The fine material particle size used in the construction of these components yields more layers and higher component densities than were previously possible. The end result is
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OCR Scan
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LF1608
LF2012
LR1608
XF3535
XF2525
XF5050
XT2012
IA3225
IF3225
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PDF
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