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    XQVR1000 Search Results

    XQVR1000 Datasheets (4)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    XQVR1000 Xilinx 2.5V Radiation Hardened FPGA Original PDF
    XQVR1000-4CG560M Xilinx Qpro Virtex 2.5V Radiation Hardened FPGAs Original PDF
    XQVR1000-4CG560Q Xilinx QPro Virtex 2.5V radiation hardened FPGA. SMD number 5962R9957401QXC. Original PDF
    XQVR1000-4CG560V Xilinx Qpro Virtex 2.5V Radiation Hardened FPGAs Original PDF

    XQVR1000 Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    VQFP44 package

    Abstract: isp Cable Version 3.0 VQ44 XQR18V04 XQVR1000 XQVR300 XQVR600 fpga radiation XQR2V1000 XQR18V04VQ44N
    Text: QPro XQR18V04 Radiation Hardened 4Mbit QML ISP Configuration Flash PROM R DS082 v1.4 December 15, 2003 5 Features • Description Operating Temperature Range: –55° C to +100° C MeV/cm2/mg • Latch-Up Immune to LET >120 • Guaranteed TID of 30 kRad(Si) per spec 1019.5


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    XQR18V04 DS082 CascadV04CC44M XQR18V04CC44V XQR18V04VQ44N XQ18V04. VQFP44 package isp Cable Version 3.0 VQ44 XQVR1000 XQVR300 XQVR600 fpga radiation XQR2V1000 XQR18V04VQ44N PDF

    qfn 3x3 tray dimension

    Abstract: XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.5 November 6, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, qfn 3x3 tray dimension XCDAISY BFG95 XC5VLX330T-1FF1738I pcb footprint FS48, and FSG48 WS609 jedec so8 Wire bond gap XC3S400AN-4FG400I FFG676 XC4VLX25 cmos 668 fcbga PDF

    XQR18V04

    Abstract: XQVR1000 XQVR300 XQVR600 SelectMAP Out-14 CC-44 XQR2V1000
    Text: R < B L QPro XQR18V04 Radiation-Tolerant 4-Mbit QML ISP Configuration Flash PROM DS082 v1.6 March 15, 2007 Product Specification Features • Operating temperature range: –55°C to +100°C • IEEE STD 1149.1 Boundary-Scan (JTAG) support • Program/erase temperature range: 0°C to +85°C


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    XQR18V04 DS082 XQ18V04. UG112, XQVR1000 XQVR300 XQVR600 SelectMAP Out-14 CC-44 XQR2V1000 PDF

    fpga radiation

    Abstract: XAPP185 HW-130 XQR1704L XQR4013XL XQR4036XL XQ1701LCC44B 1704L XQR4000XL XQR4
    Text: QPRO Series Configuration PROMs XQ including Radiation-Hardened Series (XQR) R DS062 (v2.0) June 1, 2000 2 Advance Product Specification Features Description • Configuration one-time programmable (OTP) read-only memory designed to store configuration bitstreams of


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    DS062 XQ1701L XQ1704L XQR1701L XQR1704L 1019line 44-pin MIL-PRF-38535 XQR1704LCC44M fpga radiation XAPP185 HW-130 XQR4013XL XQR4036XL XQ1701LCC44B 1704L XQR4000XL XQR4 PDF

    XAPP185

    Abstract: XQR4000XL rad hard PROM Single Event Latchup FPGA X318
    Text: XQR1700L QPRO Series Radiation Hardened Serial Configuration PROMs R DS062 v1.0 April 20, 2000 8* Advance Product Specification Features Description • The XQR1701L and XQR1704L are Xilinx 3.3v series high density, radiation hardened serial configuration PROMs


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    XQR1700L DS062 XQR4000XL/Virtex exce30 200mV 1701L 44-Pin MIL-PRF-38535 1704L 1701L XAPP185 XQR4000XL rad hard PROM Single Event Latchup FPGA X318 PDF

    MIL-PRF-3853

    Abstract: XQ4028EX QPro Family guidance radar data sheet Introduction to Radar XQV100 ISO-9000 XC4025E XQ4000
    Text: QPRO High-Reliability QML Certified and Radiation Hardened Products for Aerospace and Defense Applications R January 21, 2000 v2.0 7* The High-Reliability Programmable Logic Leader Xilinx is the leading supplier of High-Reliability programmable logic devices to the aerospace and defense markets.


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    MIL-PRF-38585, XC3000 Mil-PRF-3853 XC3000, XC4000 XQ4028EX QPro Family guidance radar data sheet Introduction to Radar XQV100 ISO-9000 XC4025E XQ4000 PDF

    xilinx topside marking

    Abstract: xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.6 September 22, 2010 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, xilinx topside marking xilinx part marking pcb footprint FS48, and FSG48 smd code v36 CF1752 reballing recommended layout CSG324 BGA reflow guide XC2VP7 reflow profile SMD MARKING CODE C1G PDF

    XQR18V04

    Abstract: XQR4000XL CLCC44 CLCC-44 XQVR1000 XQVR300 XQVR600 XQR2V1000
    Text: QPro XQR18V04 Radiation Hardened 4Mbit QML ISP Configuration Flash PROM R DS082 v1.5 October 5, 2004 5 Features • Product Specification Description Operating Temperature Range: –55°C to +100°C MeV/cm2/mg • Latch-Up Immune to LET >120 • Guaranteed TID of 30 kRad(Si) per spec 1019.5


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    XQR18V04 DS082 XQ18V04. XQR4000XL CLCC44 CLCC-44 XQVR1000 XQVR300 XQVR600 XQR2V1000 PDF

    smd transistor L33

    Abstract: smd transistor ab2 L33 SMD w32 smd transistor 143 ah5 SMD SMD l33 Transistor a33 smd diode w32 smd diode w32 smd transistor smd diode E15
    Text: QPro Virtex 2.5V Radiation Hardened FPGAs R DS028 v1.2 November 5, 2001 2 Preliminary Product Specification Features • 0.22 µm 5-layer epitaxial process • QML certified • Radiation hardened FPGAs for space and satellite applications • Guaranteed total ionizing dose to 100K Rad(si)


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    DS028 5962R9957201QYC XQVR300-4CB228Q 5962R9957201QZC 5962R9957301QYC XQVR600-4CB228Q 5962R9957301QZC 5962R9957401QXC smd transistor L33 smd transistor ab2 L33 SMD w32 smd transistor 143 ah5 SMD SMD l33 Transistor a33 smd diode w32 smd diode w32 smd transistor smd diode E15 PDF

    xilinx part marking

    Abstract: xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.2 March 17, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, xilinx part marking xilinx topside marking UG112 qfn 3x3 tray dimension FGG484 HQG160 reballing top marking 957 so8 FF1148 fcBGA PACKAGE thermal resistance PDF

    XQVR600 dc switching

    Abstract: XQV100 XQV1000 XQV300 XQV600 XQVR1000 XQVR300 XQVR600
    Text: 7 QPRO Virtex 2.5V QML High-Reliability FPGAs R DS002 v1.2 February 13, 2001 2 Preliminary Product Specification Features - • Certified to MIL-PRF-38535 (Qualified Manufacturer Listing) • Guaranteed over the full military temperature range (–55°C to +125°C)


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    DS002 MIL-PRF-38535 XQV300 CB228 XQVR600 dc switching XQV100 XQV1000 XQV600 XQVR1000 XQVR300 XQVR600 PDF

    XQ4028EX-4CB228B

    Abstract: XC17256DDD8B XQ4028EX4CB228B XQ4036XL-3HQ240N XC4005E-4PG156B XC3042-100PG84B XQ1701LCC44B 5962-9752301QZC XQ4036XL3HQ240N 5962-985901QYC
    Text: R 0 1 June 15, 2000 v2.1 The HighReliability Programmable Logic Leader QPRO High-Reliability QML Certified and Radiation Hardened Products for Aerospace and Defense Applications Xilinx is the leading supplier of High-Reliability programmable logic devices to the aerospace


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    MIL-PRF-38585, XC3000 Mil-PRF-3853 XC3000, XC4000 XQ4028EX-4CB228B XC17256DDD8B XQ4028EX4CB228B XQ4036XL-3HQ240N XC4005E-4PG156B XC3042-100PG84B XQ1701LCC44B 5962-9752301QZC XQ4036XL3HQ240N 5962-985901QYC PDF

    XAPP186

    Abstract: XAPP216 XAPP-186 SelectMAP SRL16 XAPP137 XAPP138 XAPP151 XQVR1000 XQVR300
    Text: Application Note: FPGAs R XAPP216 v1.0 June 1, 2000 Correcting Single-Event Upsets Through Virtex Partial Configuration Author: Carl Carmichael Co-authors: Michael Caffrey, Anthony Salazar; Los Alamos National Laboratories Summary This application note describes the use of partial reconfiguration in Virtex series FPGAs for


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    XAPP216 XAPP138 XQVR300 XQVR600 XQVR1000 32-bit) XAPP186 XAPP216 XAPP-186 SelectMAP SRL16 XAPP137 XAPP151 XQVR1000 XQVR300 PDF

    interfacing cpld xc9572 with keyboard

    Abstract: VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100
    Text: The Programmable Logic Data Book 2000 R R , XC2064, NeoCAD PRISM, XILINX Block Letters , XC-DS501, NeoROUTE, XC3090, FPGA Architect, XC4005, FPGA Foundry, XC5210, Timing Wizard, NeoCAD, TRACE, NeoCAD EPIC, XACT are registered trademarks of Xilinx, Inc. , all XC-prefix product designations, AllianceCore, Alliance Series, BITA, CLC, Configurable Logic Cell, CoolRunner, Dual Block, EZTag, Fast CLK, FastCONNECT,


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    XC2064, XC-DS501, XC3090, XC4005, XC5210, interfacing cpld xc9572 with keyboard VERIFY 93K template 34992 XC95288XL evaluation board schematic XCR3032C XcxxX xilinx logicore core dds XC2S15-VQ100 creative labs model 3400 FXS-100 PDF

    smd transistor ab2

    Abstract: smd transistor L33 L33 SMD SMD l33 Transistor XQVR600-4CB228V XQVR300-4CB228B SMD L33 w32 smd transistor a33 smd diode DIODE SMD b14
    Text: 17 QPro Virtex 2.5V Radiation-Hardened FPGAs DS028 v2.1 November 5, 2010 Product Specification Features • Supported by FPGA Foundation and Alliance Development Systems • 0.22 µm 5-layer epitaxial process • QML certified • Radiation-hardened FPGAs for space and satellite


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    DS028 smd transistor ab2 smd transistor L33 L33 SMD SMD l33 Transistor XQVR600-4CB228V XQVR300-4CB228B SMD L33 w32 smd transistor a33 smd diode DIODE SMD b14 PDF

    w32 smd diode

    Abstract: smd transistor ab2 XQVR300-4CB228B xqvr600-4cb228b CB228 CG560 XQVR1000 XQVR300 XQVR600 smd diode a6 cross
    Text: QPro Virtex 2.5V Radiation-Hardened FPGAs R DS028 v2.0 January 4, 2010 2 Product Specification Features • Supported by FPGA Foundation and Alliance Development Systems • 0.22 µm 5-layer epitaxial process • QML certified • Radiation-hardened FPGAs for space and satellite


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    DS028 w32 smd diode smd transistor ab2 XQVR300-4CB228B xqvr600-4cb228b CB228 CG560 XQVR1000 XQVR300 XQVR600 smd diode a6 cross PDF

    aj25 diode

    Abstract: Ak17 AK28 DIODE ag31 diode ae31 ah30 diode aj29 diode CG560 XQVR1000 XQVR300
    Text: QPRO Virtex™ 2.5V Radiation Hardened FPGAs R DS028 v1.0 April 25, 2000 3 Advance Product Specification Features • 0.22 mm 5-layer epitaxial process • QML certified • Radiation hardened FPGAs for space and satellite applications • - Abundant registers/latches with clock enable, and


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    DS028 XQVR300 XQVR600 CB228 XQVR1000 CG560 XQVR1000 CG560 XQVR500 aj25 diode Ak17 AK28 DIODE ag31 diode ae31 ah30 diode aj29 diode XQVR300 PDF

    QPro XQR17V16 Radiation Hardened 16Mbit QML Configuration PROM

    Abstract: DS126 XQR17V16CC44V XQR17V16CC44M fpga radiation QPro Family XQ17V16 xilinx series 7 seu XQR17V16VQ44R QProXQR17V16
    Text: QPro XQR17V16 Radiation Hardened 16Mbit QML Configuration PROM R DS126 v1.0 December 18, 2003 8 Features • Latch-Up Immune to LET >120 MeV/cm2/mg • Guaranteed TID of 50 kRad(Si) per spec 1019.5 • Fabricated on Epitaxial Substrate • 16Mbit storage capacity


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    XQR17V16 16Mbit DS126 XQR17V16 44-pin XQR17V16CC44M XQR17V16CC44V QPro XQR17V16 Radiation Hardened 16Mbit QML Configuration PROM DS126 XQR17V16CC44V XQR17V16CC44M fpga radiation QPro Family XQ17V16 xilinx series 7 seu XQR17V16VQ44R QProXQR17V16 PDF

    XQV300-4CB228M

    Abstract: XQV300-4PQ240N 5962-9957301NUA xqv100-4cb228m 5962-9957201QZC smd transistor n17 5962-9957201QYC 5962-9957201QZC MS XQV100-4BG256N XQV100
    Text: 7 QPro Virtex 2.5V QML High-Reliability FPGAs R DS002 v1.5 December 5, 2001 2 Preliminary Product Specification Features • 0.22 µm 5-layer metal process • • 100% factory tested • Available to Standard Microcircuit Drawings Certified to MIL-PRF-38535 (Qualified Manufacturer


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    DS002 MIL-PRF-38535 XQV300 XQV600 XQV1000 5962-9957401NUA XQV1000-4BG560N PQ240 XQV300-4CB228M XQV300-4PQ240N 5962-9957301NUA xqv100-4cb228m 5962-9957201QZC smd transistor n17 5962-9957201QYC 5962-9957201QZC MS XQV100-4BG256N XQV100 PDF

    CB228

    Abstract: CF1144 XQV600E 5962-99572 XC1765D CG717 XQ4010E XC4005 CC44 XQV300
    Text: QPRO Logic Cells RAMbus MULTs DLLs Flip-Flops Max I/Os 64 PG84, CB100 XQR4013XL 3.3 10-30K 1368 18K 393632 – – 1536 192 CB228 60 360 80 PG84 XQR4036XL 3.3 22-65K 3078 42K 832528 – – 3168 288 CB228 60 XC3042* 5962-89713 5 3000 480 – 30784 – –


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    CB100 XQR4013XL 10-30K CB228 XQR4036XL 22-65K XC3042* PG132, CB228 CF1144 XQV600E 5962-99572 XC1765D CG717 XQ4010E XC4005 CC44 XQV300 PDF

    XILINX/part marking Hot

    Abstract: SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160
    Text: Device Package User Guide [Guide Subtitle] [optional] UG112 v3.4 June 10, 2009 [optional] R R Xilinx is disclosing this user guide, manual, release note, and/or specification (the "Documentation") to you solely for use in the development of designs to operate with Xilinx hardware devices. You may not reproduce, distribute, republish, download, display, post, or transmit the


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    UG112 UG072, UG075, XAPP427, XILINX/part marking Hot SMT, FPGA FINE PITCH BGA 456 BALL PC84/PCG84 XCDAISY TT 2076 XC2VP7 reflow profile SPARTAN-II xc2s50 pq208 sn63pb37 solder SPHERES qfn 3x3 tray dimension HQG160 PDF

    Untitled

    Abstract: No abstract text available
    Text: QPRO DLLs 10-30K 1368 18K 393632 – – 1536 192 CB228 60 3.3 22-65K 3078 42K 832528 – – 3168 288 CB228 60 XC3042* 5962-89713 5 3000 480 – 30784 – – 480 96 PG84, PG132, CB100 XQR4062XL 3.3 40-130K 5472 74K 1433864 – – 5376 384 CB228 60 XC3064*


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    10-30K CB228 22-65K XC3042* PG132, CB100 XQR4062XL 40-130K PDF

    XQ18V04

    Abstract: XQR18V04 XQVR1000 XQVR300 XQVR600 XQR2V1000
    Text: ARCHIVED DATA SHEET - NO LONGER SUPPORTED R < B L QPro XQR18V04 Radiation-Tolerant 4-Mbit QML ISP Configuration Flash PROM DS082 v1.6 March 15, 2007 Product Specification Features • Operating temperature range: –55°C to +100°C • IEEE STD 1149.1 Boundary-Scan (JTAG) support


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    XQR18V04 DS082 XQ18V04. UG112, XQ18V04 XQVR1000 XQVR300 XQVR600 XQR2V1000 PDF

    XC4010* rad(si)

    Abstract: Boundary Scan Logic xqr4036xl HQ240 fpga radiation XQ4010E ISO-9000 XC4025E XQ4028EX fpga radiation xilinx series 7 seu avionics xqvr600
    Text: For a complete data sheet, go to CD-ROM or Xilinx web site: www.xilinx.com/partinfo/databook.htm QPRO High-Reliability QML Certified and Radiation Hardened Products for Aerospace and Defense Applications R January 21, 2000 v2.0 7* The High-Reliability Programmable


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    MIL-PRF-38585, X3185 XC4010* rad(si) Boundary Scan Logic xqr4036xl HQ240 fpga radiation XQ4010E ISO-9000 XC4025E XQ4028EX fpga radiation xilinx series 7 seu avionics xqvr600 PDF