DSA0023522.pdf by Texas Instruments

Partial File Text Application Report SZZA031 - December 2001 A Nickel-Palladium-Gold Integrated Circuit Lead Finish and Its Potential for Solder-Joint Embrittlement Donald Abbott, Douglas Romm, Bernhard Lange
Datasheet Type Original
RoHS Unknown
Pb Free Unknown
Lifecycle Unknown
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Cu OSP and Cu SOP DIAMOND TECHNOLOGIES gold embrittlement gold embrittlement palladium IPC-A-610C sn-pb-ag solder paste SZZA031

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