Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    DSA00208162.pdf

    • Xilinx
    • R Chapter 4: PCB Design Considerations Package Specifications This section contains specifications for the following Virtex-II packages: · · "FG256 Fine-Pitch BGA Package (1.00 mm Pitch)
    • Original

    DSA00208162.pdf preview Download Datasheet

    User Tagged Keywords

    BF957 BG728 BGA Package CS144 FF1152 FG256 FG676 led flip-chip UG002

    Newly Added Datasheets | Privacy Policy | Digital Services Act | Contact Us | About Us

    Copyright © 2024.

    Supplyframe Tracking Pixel