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DSA00204731.pdf
Manufacturer
Winbond Electronics
Partial File Text
PCN No.: Z200-PCN-PA20070101 Date: Jan.-10-2007. Change Title: Upgrade molding compound for LQFP Family series at Greatek. Change Classification: Major Minor Change item: Design Raw Material
Datasheet Type
Original
ECAD Model
Part Details
Part pricing, stock, data attributes from Findchips.com
DSA00204731.pdf preview
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Z200-PCN-PA20070101
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