DSA0056824.pdf
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Philips Semiconductors
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PDF: 1999 Jul 16
Philips Semiconductors
Package outline
CDIP18: ceramic dual in-line package; 18 leads; glass seal
SOT133-1
8.25 max
seating plane
23.6 max
book, full pagewidth
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Original
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Part pricing, stock, data attributes from Findchips.com