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    SOT133 Search Results

    SOT133 Datasheets (14)

    Part ECAD Model Manufacturer Description Curated Datasheet Type PDF
    SOT1330-1 NXP Semiconductors Plastic small outline package; 14 leads Original PDF
    SOT1331-1 NXP Semiconductors Plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad Original PDF
    SOT1332-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 267 balls Original PDF
    SOT1332-1 NXP Semiconductors Footprint for reflow soldering SOT1332-1 Original PDF
    SOT1333-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 9 terminals; body 2 x 2.5 x 0.5 mm Original PDF
    SOT1333-1 NXP Semiconductors Footprint information for reflow soldering of DFN2520-9 package Original PDF
    SOT1334-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 14 terminals; body 2 x 4 x 0.5 mm Original PDF
    SOT1334-1 NXP Semiconductors Footprint for reflow soldering SOT1334-1 Original PDF
    SOT1335-1 NXP Semiconductors Plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm Original PDF
    SOT1336-1 NXP Semiconductors Plastic thin fine-pitch ball grid array package; 64 balls Original PDF
    SOT1337-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 10 terminals; body 1.3 x 1.6 x 0.5 mm Original PDF
    SOT1337-1 NXP Semiconductors Footprint for reflow soldering SOT1337-1 Original PDF
    SOT1338-1 NXP Semiconductors Plastic extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm Original PDF
    SOT1339-1 NXP Semiconductors Plastic low profile fine-pitch ball grid array package; 217 balls Original PDF

    SOT133 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of DFN2520-9 package SOT1333-1 D1 9x C (8x) Ay solder land occupied area P1 DIMENSIONS in mm P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21


    Original     		PDF DFN2520-9 OT1333-1 sot1333-1

    Untitled

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of LFBGA267 package SOT1332-1 Hx ball A1 index area P P Hy see detail X solder land solder paste deposit 0.65 solder land plus solder paste 0.525 0.40 occupied area solder resist detail X


    Original     		PDF LFBGA267 OT1332-1 sot1332-1

    DFN4020-14

    Abstract: No abstract text available
    Text: Package outline DFN4020-14: plastic extremely thin small outline package; no leads; 14 terminals; body 2 x 4 x 0.5 mm SOT1334-1 X D B A A E A1 c detail X terminal 1 index area e1 terminal 1 index area e 1 C 3 b 6 C A B C v w 8 y1 C y L k 14 9 1 2 Dimensions mm are the original dimensions


    Original     		PDF DFN4020-14: OT1334-1 MO-252 sot1334-1 DFN4020-14

    Untitled

    Abstract: No abstract text available
    Text: Package outline HTSSOP38: plastic thermal enhanced thin shrink small outline package; 38 leads; body with 4.4 mm; lead pitch 0.5 mm; exposed die pad SOT1331-1 E A D X c y exposed die pad side HE Z v A A3 A Dh 38 20 Eh A2 pin 1 index A1 θ Lp 1 L 19 detail X


    Original     		PDF HTSSOP38: OT1331-1 sot1331-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline XQFN10: plastic extremely thin small outline package; no leads; 10 terminals; body 1.3 x 1.6 x 0.5 mm B D SOT1337-1 A A terminal 1 index area A1 A3 E detail X e1 C v w b 3 5 C A B C y1 C y L 2 6 1 7 e k terminal 1 index area 10 8 X L1 L2 1


    Original     		PDF XQFN10: OT1337-1 MO-288 sot1337-1

    sot133bh3

    Abstract: No abstract text available
    Text: Philips Semiconductors Package outlines SOT133BH3 18-pin ceramic dual in-line F package


    Original     		PDF OT133BH3 18-pin sot133bh3

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA217: plastic low profile fine-pitch ball grid array package; 217 balls A B D SOT1339-1 ball A1 index area A A2 E A1 detail X e1 C b e U T R P N M L K J H G F E D C B A ball A1 index area C A B C Øv Øw e e2 1 2 3 4 5 6 7 8 9 11 13 15 17


    Original     		PDF LFBGA217: OT1339-1 sot1339-1 JEDEC08 MO-205

    Untitled

    Abstract: No abstract text available
    Text: Package outline SO14: plastic small outline package; 14 leads; body width 3.9 mm; body thickness 1.47 mm D SOT1330-1 A E A4 X c HE y v A D2 Z D1 8 14 E1 E2 A2 A A3 pin 1 index θ A1 7 1 Lp L e detail X w bp 14x (12x) 5 mm scale Dimensions (mm are the original mm dimensions)


    Original     		PDF OT1330-1 sot1330-1

    hx 002

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of XQFN10 package SOT1337-1 Hx Gx Fx P P 0.05 K 0.02 J D 10x 0.05 0.02 C (6×) Hy Gy Fy P J C1 By Ey Bx1 Bx C2 (3×) Ax Ex occupied area solder resist solder lands solder paste DIMENSIONS in mm


    Original     		PDF XQFN10 OT1337-1 sot1337-1 hx 002

    Untitled

    Abstract: No abstract text available
    Text: Package outline LFBGA267: plastic low profile fine-pitch ball grid array package; 267 balls A B D SOT1332-1 ball A1 index area A A2 A1 detail X E C e1 e Y W V U T R P N M L K J H G F E D C B A ball A1 index area e e2 1/2 e 1 2 3 4 5 6 7 8 9 10 11 13 15 17 19


    Original     		PDF LFBGA267: OT1332-1 sot1332-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HVQFN16: plastic thermal enhanced very thin quad flat package; no leads; 16 terminals; body 3 x 3 x 0.85 mm D B SOT1335-1 A A Terminal 1 index area E A1 detail X e1 e3 C A B C C b1 e L k v w b A6 y1 C y A9 A5 e3 A10 e e2 Eh A1 A13 A16 Terminal 1


    Original     		PDF HVQFN16: OT1335-1 sot1335-1

    SOT133

    Abstract: CDIP-18 philips 23
    Text: PDF: 1999 Jul 16 Philips Semiconductors Package outline CDIP18: ceramic dual in-line package; 18 leads; glass seal SOT133-1 8.25 max seating plane 23.6 max book, full pagewidth 5.08 max 3.4 2.9 0.51 min 1.27 max 2.54 16x 0.51 0.38 0.254 M 0.32 0.23 0 to 15 o


    Original     		PDF CDIP18: OT133-1 MBB936 SOT133 CDIP-18 philips 23

    DFN4020-14

    Abstract: No abstract text available
    Text: Reflow soldering footprint Footprint information for reflow soldering of DFN4020-14 package SOT1334-1 D1 14x C (12x) Ay solder land occupied area DIMENSIONS in mm P1 P1 Ay C D1 0.50 2.30 1.07 0.30 www.nxp.com Dimensions in mm 2010 NXP B.V. 13-05-08 13-05-21


    Original     		PDF DFN4020-14 OT1334-1 sot1334-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline SOT1336-1 TFBGA64: plastic thin fine-pitch ball grid array package; 64 balls A B D ball A1 index area A A2 E A1 detail X e1 C 1/2 e e Øv Øw b C A B C y1 C y H G e F E e2 D C 1/2 e B A 1 ball A1 index area 2 3 4 5 6 7 8 X 5 mm scale Dimensions mm are the original dimensions


    Original     		PDF OT1336-1 TFBGA64: sot1336-1

    Untitled

    Abstract: No abstract text available
    Text: Package outline HXSON6: plastic extremely thin small outline package; no leads; 6 terminals; body 2.0 x 2.0 x 0.5 mm SOT1338-1 X B D A A E terminal 1 index area A1 c detail X e1 e terminal 1 index area C b 1 C A B C v w 3 y y1 C L Eh k 6 4 Dh 1 2 mm scale


    Original     		PDF OT1338-1 sot1338-1

    edge-detection* circuit diagram

    Abstract: HE4000B HEF4753B HEF4753BD HEF4753BP
    Text: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4753B LSI Universal timer module Product specification


    Original     		PDF HE4000B HEF4753B edge-detection* circuit diagram HEF4753B HEF4753BD HEF4753BP

    HE4000B

    Abstract: HEF4737B HEF4737BD HEF4737BP HEF4737V HEF4737VD HEF4737VP co2sa The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC
    Text: INTEGRATED CIRCUITS DATA SHEET For a complete data sheet, please also download: • The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC • The IC04 LOCMOS HE4000B Logic Package Outlines/Information HEF, HEC HEF4737B HEF4737V LSI Quadruple static decade counters


    Original     		PDF HE4000B HEF4737B HEF4737V HEF47 HEF4737B HEF4737BD HEF4737BP HEF4737V HEF4737VD HEF4737VP co2sa The IC04 LOCMOS HE4000B Logic Family Specifications HEF, HEC

    NX3008NBKMB

    Abstract: IP4303CX4 PCMF2DFN1
    Text: Safeguard sensitive ICs - Increase battery life - Save space With NXP key products as recommended in this brochure Interface / Function Description Product type Package NFC antenna protection 18 / 24 V Birectional low capacitance ESD protection diode PESD18VF1BL


    Original     		PDF PESD18VF1BL PESD24VF1BL PESD18VF1BSF PESD24VF1BSF DFN1006 DSN0603 DFN2520 DFN4020 NX3008NBKMB IP4303CX4 PCMF2DFN1

    Untitled

    Abstract: No abstract text available
    Text: PN512 Full NFC Forum Compliant Solution Rev. 4.4 — 30 July 2013 111344 Product data sheet COMPANY PUBLIC 1. Introduction This document describes the functionality and electrical specifications of the transceiver IC PN512. The PN512 is a highly integrated transceiver IC for contactless communication at


    Original     		PDF PN512 PN512. PN512 PN5120A0HN1/C2 HVQFN32) PN5120A0HN/C2 HVQFN40) PN5120A0ET/C2 TFBGA64)

    circuit diagram wireless spy camera

    Abstract: PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143
    Text: Discrete Semiconductors Selection Guide 2014 Protection and signal conditioning devices, diodes, bipolar transistors, MOSFETs and thyristors. NXP’s next generation of packaging DFN Discrete Flat No-lead packages – high performance on smallest footprint


    Original     		PDF DFN1006D-2 OD882D) DFN1010D-3 OT1215) DFN2020MD-6 OT1220) DFN1608D-2 OD1608) DSN0603 OD962) circuit diagram wireless spy camera PDTB123Y IP4303CX4 dual cc BAW62 3267 tsop6 PCMF2DFN1 BST60 PUMD4 PDTB123E PDTA143

    pcd3326cp

    Abstract: 3x4 keyboard PCD3321C NT 407 F TRANSISTOR pcd3320cp PCD3327CP pabx systems PCD3321CP keyboard matrix 8 x 18 PCD3320C
    Text: Product specification Philips Semiconductors Pulse dialler circuits with redial PCD332XG family G E N E R A L DESCRIPTIO N The PCD332XC fa m ily comprises seven CMOS pulse d ia lle r circuits w ith redial. Each c irc u it converts 3 x 4 m a trix keyboard entries in to correctly-tim ed line cu rre n t in te rru p tion s. For redial, the last-dialled


    OCR Scan     		PDF PCD332XC 32xTDP-tm-1/fCL PCD3327C pcd3326cp 3x4 keyboard PCD3321C NT 407 F TRANSISTOR pcd3320cp PCD3327CP pabx systems PCD3321CP keyboard matrix 8 x 18 PCD3320C

    TDE8715D

    Abstract: No abstract text available
    Text: Preliminary specification Philips Semiconductors Video Producís 8-bit high-speed analog-to-digital converter Mil. temp. TDE8715D FEATURES APPLICATIONS DESCRIPTION • 8 -b it resolution • Sampling rate up to 50 MHz • High signal-to-noise ratio over a


    OCR Scan     		PDF TDE8715D tde8715d MEA05?

    1990- 2335 optocoupler

    Abstract: philips 3139 147 tv tuner TDA6101Q equivalent TDA3827 tda6100 ofw g 3201 ica v94 display OFW G 3352 BB515 pj 2309 smd diode
    Text: Philips S em iconductors S em ico n d u cto rs fo r Television and V id eo S ystem s Contents PART A page SELECTION GUIDE Functional index 5 Numerical index 17 Maintainance list 27 GENERAL Quality 31 Pro Electron type numbering system for Discrete Semiconductors


    OCR Scan     		PDF BA481 SAA7197 SAA7199B TDA4680 TDA4685 pA733C LCD01 1990- 2335 optocoupler philips 3139 147 tv tuner TDA6101Q equivalent TDA3827 tda6100 ofw g 3201 ica v94 display OFW G 3352 BB515 pj 2309 smd diode

    la 4440 amplifier circuit diagram 300 watt

    Abstract: la 4440 amplifier circuit diagram 300 watt diode LT 7229 2sd323 YM 7137 3D DA 3807 pdf transistor inverter welder 4 schematic 2N5630 THYRISTOR br 403 1N3492
    Text: Alphanumeric Index Power Transistor Selector Guide Power Transistor Cross Reference Power Transistor Data Sheets Thyristor Selector Guide Thyristor Cross Reference Thyristor Data Sheets Leadforms, Hardware, and Mounting Techniques R ectifier and Zener Diode


    OCR Scan     		PDF AN-784A la 4440 amplifier circuit diagram 300 watt la 4440 amplifier circuit diagram 300 watt diode LT 7229 2sd323 YM 7137 3D DA 3807 pdf transistor inverter welder 4 schematic 2N5630 THYRISTOR br 403 1N3492