Please enter a valid full or partial manufacturer part number with a minimum of 3 letters or numbers

    0.35MM PITCH BGA Search Results

    0.35MM PITCH BGA Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    10127597-004LF Amphenol Communications Solutions HPCE Mezzanine kit 8LP 35mm Height Visit Amphenol Communications Solutions
    FLBC70354001 Amphenol Communications Solutions FLB Dome, NEMA ANSI C136.41, 76mm, 35mm Height, Black Visit Amphenol Communications Solutions
    FLBC70351001 Amphenol Communications Solutions FLB Dome, NEMA ANSI C136.41, 76mm, 35mm Height, Grey Visit Amphenol Communications Solutions
    FLBC70352001 Amphenol Communications Solutions FLB Dome, NEMA ANSI C136.41, 76mm, 35mm Height, Clear Visit Amphenol Communications Solutions
    FLBC70355001 Amphenol Communications Solutions FLB Dome, NEMA ANSI C136.41, 76mm, 35mm Height, White Visit Amphenol Communications Solutions

    0.35MM PITCH BGA Datasheets Context Search

    Catalog Datasheet MFG & Type Document Tags PDF

    0.35mm BGA

    Abstract: BGA 0.35mm pitch 17X17 SF-BGA208D-B-01 SN63 0.35mm pitch BGA
    Text: 15.00mm [0.591"] 1.13mm [0.044"] 0.80mm pitch typ. 1.13mm [0.044"] Top View 15.00mm [0.591"] 0.35mm [0.014"] dia. Side View 2 0.33mm [0.013"] 5.64mm [0.222"] 8.70mm [0.342"] 1 0.80mm pitch typ. 3 Bottom View Patent # 6,351,392 1 Substrate: 0.0985"±0.006" FR4/G10 or


    Original     		FR4/G10 17X17X4 127mm SF-BGA208D-B-01 0.35mm BGA BGA 0.35mm pitch 17X17 SN63 0.35mm pitch BGA PDF

    0.35mm BGA

    Abstract: FR4 1.6mm substrate 0.35mm pitch BGA SF-BGA48C-B-03 FR4 substrate 1.6mm BGA 0.35mm pitch bga 6x8
    Text: Compatible BGA Footprint 16mm [0.630"] 13.5mm [0.531"] 13.2mm [0.520"] 7.29mm [0.287"] 11mm [0.433"] 10.72mm [0.422"] 10.85mm [0.427"] 0.75mm 0.35mm [0.014"] 7.4mm [0.291"] Top View 9.8mm [0.386"] D 0.8 mm x4 0.38mm [0.015"] 9.75mm [0.384"] End View 0.75mm pitch typ.


    Original     		FR4/G10 SF-BGA48C-B-03 SF-BGA048C-B-03 0.35mm BGA FR4 1.6mm substrate 0.35mm pitch BGA FR4 substrate 1.6mm BGA 0.35mm pitch bga 6x8 PDF

    1mm pitch BGA socket

    Abstract: thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO
    Text: Tel: 800 404-0204 www.ironwoodelectronics.com GHz Socket Specifications Mechanical Specifications Individual contact force: BGA Package Typical 1.27mm pitch BGAi Typical 1.0mm pitch BGAii Typical 0.8mm pitch BGAiii Depth of penetration (mm) 0.1 0.1 0.1 Force per ball (grams)


    Original     		MIL-STD202, 1mm pitch BGA socket thermal shock standard papst 3412 25M1 Muffin Thermal Resistance Calculation TO PDF

    0.65mm pitch BGA

    Abstract: 0.35mm pitch BGA BGA Solder Ball 0.35mm .65mm bga land pattern BGA 0.35mm pitch bga socket bpw 50 0.35mm BGA 202 ball bga
    Text: Ball / Land Grid Array Sockets EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Screw Lock Type E-tec is now the leading BGA socket manufacturer. Sockets range from 5 x 5 upwards and some of the existing patterns are shown on the following


    Original     		PDF

    General Micro-electronics

    Abstract: SMT pitch roadmap ansys darveaux ansys CP-01019-1 Electronic Arrays FR4 thermal expansion constant vs temperature neural network BGA cte amkor flip
    Text: Building Reliability Into Full-Array BGAs Yuan Li, Ph.D., Anil Pannikkat, Ph.D., Larry Anderson, Tarun Verma, Bruce Euzent Altera Corporation 101 Innovation Drive, San Jose, CA 95134 Electronic Arrays, NEC, IMP and Altera Corp. He joined Altera in 1992 and is currently Director


    Original     		PDF

    "0.4mm" bga "ball collapse" height

    Abstract: BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 TMS320
    Text: TMS320 DSP Number 89 DESIGNER’S NOTEBOOK TMS320C6x Manufacturing with the BGA Package Contributed by David Bell April 14, 1998 Design Problem How do I solder the TMS320C6x to a board? Solution The TMS320C6x DSP has been manufactured in the BGA package due to its smaller


    Original     		TMS320 TMS320C6x TMS320C6201 AN1231. "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse BGA Package 0.35mm pitch BGA Solder Ball collapse BGA Solder Ball 0.35mm 0.4mm pitch BGA routing tms320 solder reflow TMS320 bga AN1231 PDF

    BGA Package 0.35mm pitch

    Abstract: E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide
    Text: Ball / Land Grid Array Sockets Twist Lock Type E-tec is now the leading BGA socket manufacturer. EP patents 0829188, 0897655 US patents 6190181, 6249440 Patented in other countries. Twist lock sockets are available for any chip size and grid pattern. The SMT socket is simply placed


    Original     		CH-1072 BGA Package 0.35mm pitch E-tec Interconnect .65mm bga land pattern 1072 Diode, SMD 3M Touch Systems bpw 50 TEC Driver 8 pin ic base socket round pin type lead qualitek BGA reflow guide PDF

    "0.4mm" bga "ball collapse" height

    Abstract: TMS320C6x BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch
    Text: TMS320C6x Manufacturing with the BGA Package APPLICATION REPORT: SPRA429 David Bell Digital Signal Processing Solutions March 1998 IMPORTANT NOTICE Texas Instruments TI reserves the right to make changes to its products or to discontinue any semiconductor product or service without notice, and advises its customers to obtain the latest version of


    Original     		TMS320C6x SPRA429 AN1231. TMS320C6201 "0.4mm" bga "ball collapse" height BGA Solder Ball 0.35mm collapse SPRA429 BGA Package 0.35mm pitch 0.35mm BGA BGA Solder Ball 0.35mm 0.4mm pitch BGA routing BGA Solder Ball collapse BGA 0.35mm pitch PDF

    BGA Solder Ball 0.35mm collapse

    Abstract: BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm AN-5026 FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543
    Text: Fairchild Semiconductor Application Note January 2001 Revised February 2001 Using BGA Packages Introduction Demanding space and weight requirements of personal computing and portable electronic equipment has led to many innovations in IC packaging. Combining the right


    Original     		AN-5026 BGA Solder Ball 0.35mm collapse BGA Solder Ball collapse BGA Package 0.35mm pitch BGA 0.56mm FSTD16211 FSTD32211 BGA Solder Ball 0.35mm 0.35mm BGA fanout AN500543 PDF

    0.35mm BGA

    Abstract: BGA 0.35mm pitch SF-BGA107C-B-62F 0.35mm pitch BGA
    Text: Top View RoHS Compliant 8mm [0.315"] 1.1mm [0.043"] 0.8mm [0.031"] 0.8mm typ. 11mm [0.433"] 8.8mm [0.346"] Detail A 0.89mm [0.035"] 2.83mm [0.112"] 6.4mm [0.252"] Side View Detail A 2 2.48mm [0.098"] 1 3 0.35mm ± 0.05mm [0.014" ± 0.002"] 1 CONTACT DATA Accepts 0.20mm - 0.33mm Diameter pins


    Original     		254mm/0 203mm 254mm0 FR4/G10 SF-BGA107C-B-62F 0.35mm BGA BGA 0.35mm pitch 0.35mm pitch BGA PDF

    BGA Solder Ball collapse

    Abstract: BGA Solder Ball 0.35mm collapse 1mm pitch BGA socket 0.35mm BGA fanout BGA Package 0.35mm pitch land pattern for tvSOP 1mm pitch BGA micro pitch BGA AN-5026 BGA 0.56mm
    Text: Fairchild Semiconductor Application Note January 2001 Revised September 2001 Using BGA Packages Introduction TABLE 1. BGA Space Savings Compared to Surface Mount Packages Demanding space and weight requirements of personal computing and portable electronic equipment has led to


    Original     		PDF

    fw82443bx

    Abstract: FW82443LX FW82371EB FW82439HX fw82371mb FW82439TX FW82371EB SL37M SL394 FW82443EX FW82740
    Text: Product Change Notification PCN#: 789, Revision 1 Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.


    Original     		FW82443LXSL2KK) FW82371EB SL37M) fw82443bx FW82443LX FW82439HX fw82371mb FW82439TX FW82371EB SL37M SL394 FW82443EX FW82740 PDF

    SOT886

    Abstract: BGA Package 0.35mm pitch SOT891 wcsp sot886-1 SOT-902 sot665
    Text: NXP MicroPak and MicroPak II packages for single-, dual-, and triplegate logic functions World’s smallest leadless logic packages MicroPak and MicroPak II packages are the world’s smallest packages for single-, dual-, and triple-gate logic. They are 65% - 74% smaller than their PicoGate equivalents and offer a larger


    Original     		PDF

    BGA reflow guide

    Abstract: sn63pb37 solder SPHERES 1mm pitch BGA socket TL-VACUUMPEN-01 sn63pb37 solder wire ultra fine pitch BGA sn63pb37 0.4mm 20mm light dependent resistors 23M1 fine BGA thermal profile
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz BGA Socket User Manual Selecting BGA socket: You need to have the IC package drawing ready to select the right BGA socket. Go to


    Original     		PDF

    BGA reflow guide

    Abstract: C6000 TMS320C6000 TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA
    Text: Application Report SPRA429B TMS320C6000 BGA Manufacturing Considerations David Bell C6000 Applications Team Abstract When designing with a high-density BGA package, it is important to be aware of different techniques that aid in the quality of the manufacture. It is important to match the copper land


    Original     		SPRA429B TMS320C6000 C6000 BGA reflow guide TMS320C6202 0.35mm BGA fanout 0.65mm pitch BGA PDF

    sn63pb37 solder wire

    Abstract: BGA reflow guide BGA PROFILING size 0204 100C TL-TORQUEDRIVER-09 sn63pb37 solder wire shelf life TL-TORQUEDRIVER-01
    Text: GHz BGA Socket User Manual Tel: 800 404-0204 www.ironwoodelectronics.com GHZ BGA SOCKET USER MANUAL Table of Contents Selecting a BGA socket Socket Mechanics PCB Requirements Backing Plate BGA Socket Assembly MLF (QFN) Socket Assembly: Torque Driver Vacuum Pen


    Original     		PDF

    BGA Package 0.35mm pitch

    Abstract: dfn footprint AND8317 "0.35 mm pitch" bga rework 100 6x Lead Free reflow soldering profile BGA BGA Solder Ball 0.35mm 0.35mm BGA "0.35mm pitch"
    Text: AND8317 Board Mounting Considerations for ULLGA Packages Prepared by: Phillip Celaya ON Semiconductor http://onsemi.com Introduction Printed Circuit Board PCB Design Ultra Leadframe Land Grid Array (ULLGA) packages are often the package of choice for optimizing device electrical


    Original     		AND8317 AND8317/D BGA Package 0.35mm pitch dfn footprint AND8317 "0.35 mm pitch" bga rework 100 6x Lead Free reflow soldering profile BGA BGA Solder Ball 0.35mm 0.35mm BGA "0.35mm pitch" PDF

    ADHESIVE GAP PAD

    Abstract: TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
    Text: Tel: 800 404-0204 • (651) 452-8100 Fax: (651) 452-8400 PO Box 21151 • St. Paul, MN 55121 • USA www.ironwoodelectronics.com GHz MLF Socket User Manual Selecting MLF socket: You need to have the IC package drawing ready to select the correct MLF socket. Go to


    Original     		PDF

    size 0204

    Abstract: QFN PCB Layout guide TL-TORQUEDRIVER-05 TL-TORQUEDRIVER-06
    Text: GHz QFN Socket User Manual Tel: 800 404-0204 Fax: (952) 229-8201 www.ironwoodelectronics.com GHz QFN Socket User Manual Selecting QFN socket: You need to have the IC package drawing ready to select the correct QFN socket. Go to www.ironwoodelectronics.com. Select “Products” link, then under “Browse” menu, select


    Original     		PDF

    ttl cmos advantages disadvantages

    Abstract: 74VCXF162835 FMS7857 FSTU16450 FSTU32160 FSTU3257 FSTU3384 FSTU6800 FSTUD16211 PC133 registered reference design
    Text: Interface & Logic Fairchild Server Solutions Superior Performance Solutions: Bus Switches GTLP Interface Low-Voltage Logic DIMM Support Smaller Packaging Solutions: TinyLogic Ball Grid Array BGA Applications: Live Insertion For PCI and PCIx Bus and Backplanes


    Original     		PDF

    FOOTPRINT MO-229 2X3 SOLDERING

    Abstract: Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220
    Text: Freescale Semiconductor Application Note AN1902 Rev. 4.0, 9/2008 Quad Flat Pack No-Lead QFN Micro Dual Flat Pack No-Lead (uDFN) 1.0 Purpose This document provides guidelines for Printed Circuit Board (PCB) design and assembly. Package performance such as: MSL rating, board level


    Original     		AN1902 FOOTPRINT MO-229 2X3 SOLDERING Theta-JC QFP die down QFN 56 7x7 footprint EIA-783 EIA and EIAJ standards 783 QFN 76 9x9 footprint AN1902 QFN 56 7x7 0.5 JESD51-7 MO-220 PDF

    NC7SZ74

    Abstract: 16862 FSTU16211 FSTU162211 FSTU162450 FSTU16345 FSTU16861 FSTU3125 FSTU32160 FSTU32160A
    Text: Fairchild Interface & Logic Notebook Solutions Superior Performance Solutions Low Voltage Logic Switches TinyLogic Optoelectronics Smaller Packaging Solutions MicroPak™ Ball Grid Array BGA Analog Discrete Interface & Logic Applications Docking station bus switch isolation


    Original     		PDF

    Untitled

    Abstract: No abstract text available
    Text: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP2 packages


    Original     		MR4A08B 20-years AEC-Q100 MR4A08B 216-bit EST00356 PDF

    MR4A08B

    Abstract: BGA Solder Ball 0.35mm MR4A08BC MR4A08BM
    Text: MR4A08B FEATURES 2M x 8 MRAM Memory • +3.3 Volt power supply • Fast 35 ns read/write cycle • SRAM compatible timing • Unlimited read & write endurance • Data always non-volatile for >20-years at temperature • RoHS-compliant small footprint BGA and TSOP package


    Original     		MR4A08B 20-years MR4A08B 216-bit 20-years. BGA Solder Ball 0.35mm MR4A08BC MR4A08BM PDF