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Catalog Datasheet	MFG & Type	PDF	Document Tags
SAE AMS-QQ-N-290 Abstract: AMS-QQ-N-290 FR406 IPC4101A/26 ASTM b16 ASTM B194 C17200 IS410 ASTM-B16-00 C36000 Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.	Original	PDF	FR406 IS410 IPC4101A/26 C36000 ASTM-B16-00. MIL-G-45204 SAE-AMS-QQ-N-290. C36000 SAE AMS-QQ-N-290 AMS-QQ-N-290 ASTM b16 ASTM B194 C17200 ASTM-B16-00
ht 13003 Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196 Text: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature	Original	PDF	com/products/18012 com/products/18003 com/products/18013 350000-HT com/products/18005 com/products/18013RC 35W000 com/products/18007 com/products/18014 35W000-11-RC ht 13003 LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196
IPC4101A/26 Abstract: C17200 IS410 Text: Series 354000 RoHS/WEEE-Compliant DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature	Original	PDF	IS410 IPC4101A/26 C36000 ASTM-B16-00 MIL-G-45204 SAE-AMS-QQ-N-290 18009RC C17200
UNSC36000 Abstract: No abstract text available Text: Series 354000 DIP-to-SOIC Adapters RoHS/WEEE-Compliant FEATURES • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts SPECIFICATIONS • Socket Body: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature	Original	PDF	FR406 IS410 IPC4101A/26 C36000 ASTM-B16-00 MIL-G-45204 SAE-AMS-QQ-N-290 UNSC36000 X-354000-X1-RC 18009RC
Untitled Abstract: No abstract text available Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.	Original	PDF	FR406 IS410 IPC4101A/26 C36000 ASTM-B16-85. MIL-G-45204 QQ-N-290.
ASTM-B16-00 Abstract: ASTMB16-00 IS410 brass IPC4101A/26 ASTM b16 C17200 FR406 IS410 94V0 REV.B Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.	Original	PDF	FR406 IS410 IPC4101A/26 C36000 ASTM-B16-00. MIL-G-45204 SAE-AMS-QQ-N-290. C36000 ASTM-B16-00 ASTMB16-00 IS410 brass ASTM b16 C17200 94V0 REV.B
18009RC Abstract: No abstract text available Text: Series 354000 RoHS/WEEE-Compliant DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature	Original	PDF	IS410 IPC4101A/26 C36000 ASTM-B16-00 MIL-G-45204 SAE-AMS-QQ-N-290 ASTM-B16-00 18009RC