UNSC36000
Abstract: No abstract text available
Text: Series 354000 DIP-to-SOIC Adapters RoHS/WEEE-Compliant FEATURES • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts SPECIFICATIONS • Socket Body: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature
|
Original
|
PDF
|
FR406
IS410
IPC4101A/26
C36000
ASTM-B16-00
MIL-G-45204
SAE-AMS-QQ-N-290
UNSC36000
X-354000-X1-RC
18009RC
|
Untitled
Abstract: No abstract text available
Text: CAD DCN GENERATED CONTROLLED DRAWING DOCUMENT PRODUCT DATA DRAWING □MG.NO. 4080-0183 ENG. FILE COPY MATERIAL: BODY: BRASS PER ASTM-B-1B, ALLOY UNSC36000. H02 CONTACT: BERYLLIUM COPPER PER ASTM-B-196. ALLOY Cl7300, COND. TD04 INSULATOR: TEFLON PER ASTM-D-1457
|
OCR Scan
|
PDF
|
UNSC36000.
ASTM-B-196.
Cl7300,
ASTM-D-1457
-7/16-28UNEF-2A
ASTM-B-488.
QQ-N-290.
MIL-STD-10.
|
Untitled
Abstract: No abstract text available
Text: Four Good Reasons to Choose Glenair's Ex Barrier Gland Glenair's Ex Barrier Glands are designed to prevent the migration of volatile vapors and sparks from explosion proof electrical devices used in NEC 505 Class 1 Division 1 Cenelec/IEC79 Zone "0" hazardous environments in which an explosive gas or mixture is present for more than 1000 hrs/year.
|
OCR Scan
|
PDF
|
Cenelec/IEC79
UNS-C36000
Cenelec/EC79
|