SAE AMS-QQ-N-290
Abstract: AMS-QQ-N-290 FR406 IPC4101A/26 ASTM b16 ASTM B194 C17200 IS410 ASTM-B16-00 C36000
Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.
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Original
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PDF
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FR406
IS410
IPC4101A/26
C36000
ASTM-B16-00.
MIL-G-45204
SAE-AMS-QQ-N-290.
C36000
SAE AMS-QQ-N-290
AMS-QQ-N-290
ASTM b16
ASTM B194
C17200
ASTM-B16-00
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ht 13003
Abstract: LCD 16002 Aromat relay hb2e HT 1200-4 hb2e MOTOROLA 13003 Aromat hb2e HT 1000-4 amp 12011p 87c196
Text: Correct-A-Chip Adapters DIP-to-JEDEC TO Adapter Socket – www.arieselec.com/products/18012.pdf Correct-A-Chip™ with Collet Contacts – www.arieselec.com/products/18003.pdf SOIC-to-JEDEC TO Adapter – www.arieselec.com/products/18013.pdf Series 350000-HT High-Temperature
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Original
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PDF
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com/products/18012
com/products/18003
com/products/18013
350000-HT
com/products/18005
com/products/18013RC
35W000
com/products/18007
com/products/18014
35W000-11-RC
ht 13003
LCD 16002
Aromat relay hb2e
HT 1200-4
hb2e
MOTOROLA 13003
Aromat hb2e
HT 1000-4 amp
12011p
87c196
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IPC4101A/26
Abstract: C17200 IS410
Text: Series 354000 RoHS/WEEE-Compliant DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature
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Original
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PDF
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IS410
IPC4101A/26
C36000
ASTM-B16-00
MIL-G-45204
SAE-AMS-QQ-N-290
18009RC
C17200
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UNSC36000
Abstract: No abstract text available
Text: Series 354000 DIP-to-SOIC Adapters RoHS/WEEE-Compliant FEATURES • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts SPECIFICATIONS • Socket Body: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature
|
Original
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PDF
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FR406
IS410
IPC4101A/26
C36000
ASTM-B16-00
MIL-G-45204
SAE-AMS-QQ-N-290
UNSC36000
X-354000-X1-RC
18009RC
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Untitled
Abstract: No abstract text available
Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.
|
Original
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PDF
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FR406
IS410
IPC4101A/26
C36000
ASTM-B16-85.
MIL-G-45204
QQ-N-290.
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ASTM-B16-00
Abstract: ASTMB16-00 IS410 brass IPC4101A/26 ASTM b16 C17200 FR406 IS410 94V0 REV.B
Text: Series 354000 DIP to SOIC Adapters RoHS/ WEEE Compliant FEATURES: • Convenient, cost-effective means of converting DIP style packaging to SOIC PC board layouts. SPECIFICATIONS: • Socket body is black, UL 94V-0 Glass-filled 4/6 Nylon 170°C continuous use temp.
|
Original
|
PDF
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FR406
IS410
IPC4101A/26
C36000
ASTM-B16-00.
MIL-G-45204
SAE-AMS-QQ-N-290.
C36000
ASTM-B16-00
ASTMB16-00
IS410 brass
ASTM b16
C17200
94V0 REV.B
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18009RC
Abstract: No abstract text available
Text: Series 354000 RoHS/WEEE-Compliant DIP-to-SOIC Adapter FEATURES • Convenient, cost-effective means of converting DIP-to-SOIC PC board layouts GENERAL SPECIFICATIONS • SOCKET BODY: black, UL 94V-0 glass-filled 4/6 Nylon 170°C continuous use temperature
|
Original
|
PDF
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IS410
IPC4101A/26
C36000
ASTM-B16-00
MIL-G-45204
SAE-AMS-QQ-N-290
ASTM-B16-00
18009RC
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