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    208-LEAD SQFP Search Results

    208-LEAD SQFP Result Highlights (5)

    Part ECAD Model Manufacturer Description Download Buy
    DE6B3KJ151KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ471KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6E3KJ152MN4A Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ101KA4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd
    DE6B3KJ331KB4BE01J Murata Manufacturing Co Ltd Safety Standard Certified Lead Type Disc Ceramic Capacitors for Automotive Visit Murata Manufacturing Co Ltd

    208-LEAD SQFP Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    SQFP208

    Abstract: sot316
    Text: PDF: 1999 Apr 16 Philips Semiconductors Package outline SQFP208: plastic shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm SOT316-1 c y X A 156 157 105 104 ZE e E HE A A2 A1 (A 3) wM θ Lp bp L pin 1 index 208 detail X 53 52 1


    Original     		PDF SQFP208: OT316-1 OT316-1 SQFP208 sot316

    8086 microprocessor pin description

    Abstract: KU80486SX KU80486SXSA KU80486SXSA33 D1846 242202 chip 8-pin t24 SL ENHANCED INTELSX2 sb80486sx general cross references
    Text: A EMBEDDED Intel486 SX PROCESSOR • 32-Bit RISC Technology Core ■ Boundary Scan JTAG ■ 8-Kbyte Write-Through Cache ■ 3.3-Volt Processor — 208-Lead Shrink Quad Flat Pack (SQFP) ■ 5-Volt Processor Burst Bus Cycles — 196-Lead Plastic Quad Flat Pack


    Original     		PDF Intel486TM 32-Bit 208-Lead 196-Lead 16-bit 64-Bit 8086 microprocessor pin description KU80486SX KU80486SXSA KU80486SXSA33 D1846 242202 chip 8-pin t24 SL ENHANCED INTELSX2 sb80486sx general cross references

    MS-029

    Abstract: No abstract text available
    Text: Package outline SQFP208: plastic shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT316-1 c y X A 156 157 105 104 ZE e E HE A A2 A1 (A 3) wM θ Lp bp L pin 1 index 208 detail X 53 52 1 ZD wM bp e v M A


    Original     		PDF SQFP208: OT316-1 MS-029 MS-029

    ku80486sx

    Abstract: KU80486SXSA33 8086 microprocessor pin description processor cross reference embedded application in medical field in 240486 embedded processor intel 8086 273021 T20 96 diode
    Text: EMBEDDED Intel486 SX PROCESSOR • 32-Bit RISC Technology Core ■ Data Bus Parity Generation and Checking ■ 8-Kbyte Write-Through Cache ■ Boundary Scan JTAG ■ Four Internal Write Buffers ■ 3.3-Volt Processor — 208-Lead Shrink Quad Flat Pack (SQFP)


    Original     		PDF Intel486TM 32-Bit 208-Lead 16-bit 196-Lead 64-Bit ku80486sx KU80486SXSA33 8086 microprocessor pin description processor cross reference embedded application in medical field in 240486 embedded processor intel 8086 273021 T20 96 diode

    MS-029

    Abstract: SQFP208
    Text: PDF: 2000 Jan 26 Philips Semiconductors Package outline SQFP208: plastic shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT316-1 c y X A 156 157 105 104 ZE e E HE A A2 A1 (A 3) wM θ Lp bp L pin 1 index


    Original     		PDF SQFP208: OT316-1 MS-029 MS-029 SQFP208

    SQFP208

    Abstract: MS-029
    Text: PDF: 2003 Mar 28 Philips Semiconductors Package outline SQFP208: plastic shrink quad flat package; 208 leads lead length 1.3 mm ; body 28 x 28 x 3.4 mm; high stand-off height SOT316-1 c y X A 156 157 105 104 ZE e E HE A A2 A1 (A 3) wM θ Lp bp L pin 1 index


    Original     		PDF SQFP208: OT316-1 MS-029 SQFP208 MS-029

    SB82558B

    Abstract: AS87C196EN SB82371SB sb82437vx INTEL SB82558B S82557 SB82371FB SB82442FX SB82558 SB82437FX66
    Text: Product Change Notification Please respond to your distributor if you have any issues with the timeline or content of this change. No response from customers will be deemed as acceptance of the change and the change will be implemented pursuant to the key milestones set forth in this attached PCN.


    Original     		PDF SB80962JY25 SB80962JY33 SB82371FB SB82371SB SB82380FB SB82380PB SB82558B AS87C196EN SB82371SB sb82437vx INTEL SB82558B S82557 SB82371FB SB82442FX SB82558 SB82437FX66

    CEL-9000

    Abstract: hitachi mold cel cel hitachi A112 TEXAS INSTRUMENTS, Mold Compound EN-4065 SQFP208 en4065
    Text: TEXAS INSTRUMENTS Notification of the Manufacture of 208 Pin PPM Package at the Sherman Assembly/Test Facility September 11, 1996 Abstract Texas Instruments Advanced System Logic Products ASL has qualified the Sherman Assembly/Test Facility to manufacture the 208 pin PPM package. This qualification will allow for


    Original     		PDF PCI1050PPM CEL-9000 hitachi mold cel cel hitachi A112 TEXAS INSTRUMENTS, Mold Compound EN-4065 SQFP208 en4065

    hitachi mold cel

    Abstract: texas instruments assembly year A112 CEL-9000
    Text: TEXAS INSTRUMENTS Notification for the Manufacture of 208 PinPDV Package at the Sherman Assembly/Test Facility September 18, 1996 Abstract Texas Instruments Advanced System Logic Products ASL has qualified the Sherman Assembly/Test Facility to manufacture 208 pin PDV package. This qualification will allow for improved


    Original     		PDF

    QFP 128 lead .5mm

    Abstract: csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M
    Text: ASIC Package ASIC Packages UQFP 0.4mm lead pitch series Body Size mm 7 7 10 10 12 12 14 14 20 20 Lead Counts 64 80 100 120 160/184 Body Thickness (mm) 1.0* / 1.4 1.4 1.4 1.0 / 1.4 2.0 UQFP * *:UNDER DEVELOPMENT VQFP 0.5mm Body Size (mm) Lead Counts lead pitch series


    Original     		PDF 12P2M 13P5M 14P6M 16P8M 14P4M 16P6M 17P9M 18P10M 13P3M 17P7M QFP 128 lead .5mm csp192 144 QFP body size qfp 0.4mm 8P-10P p4m 16 15 ball CSP 648P qfp 0.8mm 12P4M

    sc6038

    Abstract: SC-6038 K 2941 SOT393-1 DBS13P DIP20 DIP28 HDIP18 LQFP100 LQFP48
    Text: PACKAGE INFORMATION Page Index DBS DIP HDIP LQFP PLCC QFP SDIP SIL SO SSOP SQFP Soldering 1816 1818 1822 1823 1827 1830 1836 1839 1841 1849 1851 1852 Philips Semiconductors Package information Package outlines INDEX NAME DESCRIPTION VERSION DBS DIL-bent-SIL


    Original     		PDF OT157-2 DBS13P OT141-6 OT97-1 DIP16 OT38-1 DIP20 OT146-1 DIP28 OT316-1 sc6038 SC-6038 K 2941 SOT393-1 DBS13P DIP20 HDIP18 LQFP100 LQFP48

    S29JL032H70

    Abstract: No abstract text available
    Text: FUJITSU MICROELECTRONICS PRODUCT GUIDE 2009.10 Product Guide [ ASSP•Memory•ASIC ] PG00-00091-3E Technical Documentation of Electronic Devices DATA BOOK PRODUCT GUIDE DVD (GENERAL) DATA SHEET MANUAL FUJITSU SEMICONDUCTOR DATA SHEET Semiconductor Data Book


    Original     		PDF PG00-00091-3E ACD-10131 CD-10131 DS04-27211-5E MB3789 S29JL032H70

    s29gl032n90

    Abstract: MB15H121 S29GL064N90 s29gl256p90 S29GL01GP13 S29GL128P90 MB86A20 S29AL008J55 S29AL016J55 s29gl128p11
    Text: covPG00-00071e.fm 1 ページ ２００７年５月１０日 木曜日 午前１１時２９分 For further information please contact: Japan FUJITSU LIMITED Electronic Devices Business Unit Shinjuku Dai-Ichi Seimei Bldg. 7-1, Nishishinjuku 2-chome, Shinjuku-ku,


    Original     		PDF covPG00-00071e PG00-00071-2E s29gl032n90 MB15H121 S29GL064N90 s29gl256p90 S29GL01GP13 S29GL128P90 MB86A20 S29AL008J55 S29AL016J55 s29gl128p11

    Intel reflow soldering profile BGA

    Abstract: all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment
    Text: Board Solder Reflow Process Recommendations 9.1 9 Introduction In reflowed board assemblies, the solder joint quality is affected by several variables such as the component, SMT Surface Mount Technology assembly conditions, solder paste, reflow profile and board design.


    Original     		PDF conductivi49-58. Intel reflow soldering profile BGA all ic data infrared heating gun 82425EX 80c196kb 1988 28F010 80C196KB pcb warpage after reflow Intel reflow soldering profile BGA intel conveyor belt alignment

    CE51484

    Abstract: micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576
    Text: ASIC Technology Brief Ball Grid Array BGA Packages SEPTEMBER 1995 Fujitsu, a world leader in packaging and interconnect technology now offers Ball Grid Array (BGA) packaging options in both our CG/CE46 (0.65 micron) and CG/CE51 (0.5 micron) high performance CMOS ASIC product families.


    Original     		PDF CG/CE46 CG/CE51 S-19176 ASIC-TB-20033-9/95 CE51484 micron 100 ball BGA BGA256 BGA 256 PACKAGE power dissipation CG51114 BGA352 BGA576 CE51364 CG51284 BGA-576

    ejtag dvb

    Abstract: SQFP208 ms-029fa1 DVB smart card rs232 IEEE 1284 Peripheral Interface Controller MPEG-TS stream S-108 SAA7219HS smart card tda8004 ssi 202
    Text: INTEGRATED CIRCUITS DATA SHEET SAA7219 MPEG2 Transport RISC processor Preliminary specification File under Integrated Circuits, IC02 1999 Sep 20 Philips Semiconductors Preliminary specification MPEG2 Transport RISC processor SAA7219 CONTENTS 1 FEATURES 1.1


    Original     		PDF SAA7219 SAA7219 545004/01/pp20 ejtag dvb SQFP208 ms-029fa1 DVB smart card rs232 IEEE 1284 Peripheral Interface Controller MPEG-TS stream S-108 SAA7219HS smart card tda8004 ssi 202

    TDA50

    Abstract: TDA5056 quad video processor
    Text: INTEGRATED CIRCUITS DATA SHEET SAA7219 MPEG2 Transport RISC processor Product specification Supersedes data of 1999 Sep 20 File under Integrated Circuits, IC02 2000 Jun 14 Philips Semiconductors Product specification MPEG2 Transport RISC processor SAA7219


    Original     		PDF SAA7219 753504/02/pp20 TDA50 TDA5056 quad video processor

    SQFP208

    Abstract: yc 645 smd pin diagram jtag dvb china CBC 184 transistor PDI 1284 saa7215 SQFP-208 quad video processor
    Text: INTEGRATED CIRCUITS DATA SHEET SAA7219 MPEG2 Transport RISC processor Product specification Supersedes data of 2000 Jun 14 File under Integrated Circuits, IC02 2001 Mar 28 Philips Semiconductors Product specification MPEG2 Transport RISC processor SAA7219


    Original     		PDF SAA7219 SAA7219 753504/03/pp20 SQFP208 yc 645 smd pin diagram jtag dvb china CBC 184 transistor PDI 1284 saa7215 SQFP-208 quad video processor

    MIL-STD-81705

    Abstract: tsop Shipping Trays JEDEC TRAY PLCC L-273 PGA JEDEC tray TQFP Shipping Trays transport media and packing JEDEC TRAY mQFP intel tray mechanical drawings LD 273
    Text: CHAPTER 10 TRANSPORT MEDIA AND PACKING TRANSPORT MEDIA Tubes Plastic shipping and handling tubes are manufactured from polyvinyl chloride PVC with an antistatic surfactant treatment Standard tubes for most package types are translucent and allow visual inspection of units within the tube Carbon-impregnated black conductive tubes


    Original     		PDF

    all ic data

    Abstract: Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208
    Text: 2 9 Board Solder Reflow Process Recommendations 1/16/97 5:29 PM CH09WIP.DOC INTEL CONFIDENTIAL until publication date 2 CHAPTER 9 BOARD SOLDER REFLOW PROCESS RECOMMENDATIONS 9.1. INTRODUCTION In reflowed board assemblies, the solder joint quality is affected by several variables such as


    Original     		PDF CH09WIP all ic data Intel reflow soldering profile BGA infrared heating gun 82425EX intel 80486 DX4 hot air bga land pattern for TSOP TSOP infrared 80c196kb 1988 land pattern QFP 208

    486 SX

    Abstract: 272769
    Text: * EMBEDDED lntel486TM SX PROCESSOR • 32-Bit RISC Technology Core ■ Boundary Scan JTAG ■ 8-Kbyte Write-Through Cache ■ 3.3-Volt Processor — 208-Lead Shrink Quad Flat Pack (SQFP) ■ Four Internal Write Buffers ■ Burst Bus Cycles ■ Dynamic Bus Sizing for 8- and 16-bit


    OCR Scan     		PDF lntel486TM 32-Bit 208-Lead 16-bit 196-Lead Intel486â 272sistance, 486 SX 272769

    242202

    Abstract: a1768 a80486dx2 VME 5v 3.3v timing sequence 241618 Intel overdrive
    Text: intei EMBEDDED ln te lD X 2 T M Integrated Floating-Point Unit Speed-Multiplying Technology PROCESSOR Data Bus Parity Generation and Checking 32-Bit RISC Technology Core Boundary Scan JTAG 8-Kbyte Write-Through Cache 3.3V Processor, 50 MHz, 25 MHz CLK — 208-Lead Shrink Quad Flat Pack


    OCR Scan     		PDF 32-Bit 16-bit 208-Lead 168-Pin BOFFtA20M# 242202 a1768 a80486dx2 VME 5v 3.3v timing sequence 241618 Intel overdrive

    XCS3201FN

    Abstract: ATT92020 80386SL MC68HC11A1FU
    Text: Pomona Innovative Solutions For IC Test Anc Development Expressly designed to facilitate testing of your surface-mounted devices, Pomona IC Test Clips and Pomona Solder-On Adapters are engineered in form and function to provide a convenient interface to logic analyzers for fast and reliable


    OCR Scan     		PDF

    SC472

    Abstract: CG21103 CG21403 CG21153 mbcg CG21303 CG21753 Mbcg21153 CG21203 QFP-208 fujitsu
    Text: January 1990 Edition 1.1 FUJITSU PRODUCT PROFILE CG21 Series 0.8-micron CMOS Gate Arrays DESCRIPTION The CG21 series of 0.8 n m CMOS gate arrays are currently available in five device types with from 3 0K to 100K gates. Three more CG21 arrays, ranging from 10Kto 20Kgates, are now underdevelopm ent. These arrays achievethe u ltrafast speed of 0.37 ps per


    OCR Scan     		PDF 10Kto 20Kgates, SC472 CG21103 CG21403 CG21153 mbcg CG21303 CG21753 Mbcg21153 CG21203 QFP-208 fujitsu