5962L0053605VYC
Abstract: 5962-9069204QXA ATMEL 302 24C16 UT9Q512E-20YCC MOH0268D UT54ACS164245SEIUCCR Z085810 5962-9762101Q2A UT28F256QLET-45UCC 5962R0250401KXA
Text: NOT MEASUREMENT SENSITIVE MIL-HDBK-103AJ 19 SEPTEMBER 2011 SUPERSEDING MIL-HDBK-103AH 28 MARCH 2011 DEPARTMENT OF DEFENSE HANDBOOK LIST OF STANDARD MICROCIRCUIT DRAWINGS This handbook is for guidance only. Do not cite this document as a requirement. AMSC N/A
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MIL-HDBK-103AJ
MIL-HDBK-103AH
MIL-HDBK-103AJ
5962L0053605VYC
5962-9069204QXA
ATMEL 302 24C16
UT9Q512E-20YCC
MOH0268D
UT54ACS164245SEIUCCR
Z085810
5962-9762101Q2A
UT28F256QLET-45UCC
5962R0250401KXA
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Untitled
Abstract: No abstract text available
Text: PRELIMINARY CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tsu = 2.5 ns — fMAX= 153.8 MHz • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional V cc and Vs s pins for lowest
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PAL22VP10G)
300-M
PAL22
10DMB
L22VP10G
10LMB
28-Pin
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22V10G-7
Abstract: No abstract text available
Text: m f CYPRESS Features — f[HAX = 1 6 6 MHz External • Reduced ground bounce and under shoot • PLCC and LCC packages w ith addi tional Vc c and V ss pins for lowest ground bounce • Up to 22 inputs and 10 outputs for more logic power Synchronous PRESET, asynchronous
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PAL22V10G
PAL22VP10G
PAL22VP10G
10LMB
22V10G-7
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22V10A
Abstract: qml-38535 22V10B
Text: REVISIONS LTR DESCRIPTION DATE YR-MO-DA APPROVED Updated document. Added device types 07 thru 10. Added CAGE 18324. Added L package. 94-10-17 M. A. Frye Added device types 11 thru 14. Added device class N option for some devices. Added X package, represents plastic dual-in-line. Editorial changes
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MIL-BUL-103
QML-38535.
QML-38535
MIL-BUL-103.
JUL94
22V10A
22V10B
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22V10G
Abstract: No abstract text available
Text: PRELIMINARY r0 CYPRESS • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 4 ns — ts = 2.5 ns — fMAX = 166 M Hz External • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional V cc and Vs s pins for lowest
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PAL22V10G
PAL22VP10G
L22V10G
L22VP10G
300-M
28-Pin
24-Lead
--10PC
22V10G
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Untitled
Abstract: No abstract text available
Text: 22V10G PAL22VP10G PRELIMINARY ” I CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tgu = 2.5 ns — fMAX = 153.8 MHz • Reduced ground bounce and under shoot • PLCC and LCC packages with addi
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PAL22V10G
PAL22VP10G
PAL22VP10G)
L22V10G
PAL22VP10G
h00-M
28-Pin
300-M
24-Lead
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Untitled
Abstract: No abstract text available
Text: bSE D • ESÔTbbS G D l P M n 221 ■ CYP 22V10G PAL22VP10G PRELIMINARY r CYPRESS SEMICONDUCTOR Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — t|ij > = S ns Universal PAL Device ■—-Registered or combinatorial
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PAL22V10G
PAL22VP10G
PAL22VP10G)
p00-MU)
24-Lead
300-Mil)
28-Pin
DD1QM57
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VX 1818
Abstract: 22V10G-7 TS13-1 PAL22
Text: CYPRESS Features • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 4 ns — tg = 2.5 ns — f[HAX = 166 MH* External • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional Vcc and Vss pins for lowest
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PAL22V10G
PAL22VP10G
PAL22VP10G)
300-Mil)
28-Pin
PAL22VP10G-
28-Lead
24-Lead
VX 1818
22V10G-7
TS13-1
PAL22
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