Untitled
Abstract: No abstract text available
Text: PRELIMINARY CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tsu = 2.5 ns — fMAX= 153.8 MHz • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional V cc and Vs s pins for lowest
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PAL22VP10G)
300-M
PAL22
10DMB
L22VP10G
10LMB
28-Pin
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22V10G-7
Abstract: No abstract text available
Text: m f CYPRESS Features — f[HAX = 1 6 6 MHz External • Reduced ground bounce and under shoot • PLCC and LCC packages w ith addi tional Vc c and V ss pins for lowest ground bounce • Up to 22 inputs and 10 outputs for more logic power Synchronous PRESET, asynchronous
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PAL22V10G
PAL22VP10G
PAL22VP10G
10LMB
22V10G-7
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22V10G
Abstract: No abstract text available
Text: PRELIMINARY r0 CYPRESS • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpo = 4 ns — ts = 2.5 ns — fMAX = 166 M Hz External • Reduced ground bounce and under shoot • PLCC and LCC packages with addi tional V cc and Vs s pins for lowest
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PAL22V10G
PAL22VP10G
L22V10G
L22VP10G
300-M
28-Pin
24-Lead
--10PC
22V10G
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Untitled
Abstract: No abstract text available
Text: L22V10G PAL22VP10G PRELIMINARY ” I CYPRESS SEMICONDUCTOR • Ultra high speed supports today’s and tomorrow’s fastest microprocessors — tpD = 5 ns — tgu = 2.5 ns — fMAX = 153.8 MHz • Reduced ground bounce and under shoot • PLCC and LCC packages with addi
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PAL22V10G
PAL22VP10G
PAL22VP10G)
L22V10G
PAL22VP10G
h00-M
28-Pin
300-M
24-Lead
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