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    37.5X37.5 Price and Stock

    LeaderTech 52-CBSA-3.75X3.75X0.5

    RF SHIELD 3.75" X 3.75" T/H
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    LeaderTech 53A-CBSA-3.75X3.75X0.5

    RF SHIELD 3.75" X 3.75" T/H
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    LeaderTech 54-CBSA-3.75X3.75X0.5

    RF SHIELD 3.75" X 3.75" T/H
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    LeaderTech 56-CBSA-3.75X3.75X0.5

    RF SHIELD 3.75" X 3.75" T/H
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    DigiKey 56-CBSA-3.75X3.75X0.5 Bulk 20
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    LeaderTech 42-CBSA-3.75X3.75X0.4

    RF SHIELD 3.75" X 3.75" T/H
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    Find more 37.5X37.5 price and stock on Findchips.com

    37.5X37.5 Datasheets Context Search

    Catalog Datasheet MFG & Type PDF Document Tags

    Motorola multimeter

    Abstract: multimeter probes MPC8260 digital multimeter diagram digital multimeter circuit
    Text: Application Note AN2271/D Rev. 0, 3/2002 MPC8260 PowerQUICC II Thermal Resistor Guide The MPC8260 PowerQUICC II™ is a highly integrated device with an advanced communication processor CPM , on board SRAM, DMA and a G2 core. The package for the MPC8260 is a 480 ball, 37.5x37.5mm TBGA (tape ball grid array) that provides excellent


    Original     		PDF AN2271/D MPC8260 Motorola multimeter multimeter probes digital multimeter diagram digital multimeter circuit

    CU1100

    Abstract: BGA 15X15 CMBA054949 T725
    Text: Model : CMBA054949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA054949 Series 1.Material : CU1100 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :


    Original     		PDF CMBA054949 CMBA054949 CU1100 UL94-V0) 15x15 CU1100 BGA 15X15 T725

    PRBG0784DA-A

    Abstract: No abstract text available
    Text: JEITA Package Code P-HBGA784-37.5x37.5-1.27 RENESAS Code PRBG0784DA-A Previous Code 784F7D D MASS[Typ.] 13.0g A A ZD A1 b S AB e Reference Symbol C 3 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 y S Index mark ZE AH AG AF AE AD


    Original     		PDF P-HBGA784-37 PRBG0784DA-A 784F7D PRBG0784DA-A

    PRBG0564DA-A

    Abstract: No abstract text available
    Text: JEITA Package Code P-BGA564-37.5x37.5-1.27 RENESAS Code PRBG0564DA-A D MASS[Typ.] 6.2g A A D1 ZD A1 b S AB e y S Index mark S ZE AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A E1 E e B Previous Code 564F7X-B Reference Symbol 1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28


    Original     		PDF P-BGA564-37 PRBG0564DA-A 564F7X-B PRBG0564DA-A

    CMBA023737

    Abstract: MBH37 MBH37.5002 37.5x37.5
    Text: MBH3750021 Series = CMBA023737 MBH37.50021= 1373263 Model : CMBA023737 Series For 37.5x37.5 Chip set BGA Heat Sink Specification CMBA023737 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm


    Original     		PDF MBH3750021 CMBA023737 MBH37 CMBA023737 UL94-V0) 15x15 MBH37.5002 37.5x37.5

    BGA 15X15

    Abstract: CMBA024949 T725
    Text: Model : CMBA024949 Series For North Bridge Chip set BGA Heat Sink Specification CMBA024949 Series 1.Material : Al 6063 2.Dimension : Foot print : 37.5x37.5mm Height : 12,15,18,21,23,28,33 mm Base thickness : 2.6mm 3.Finish: 4. Accessory : Push Pin : Thermal pad :


    Original     		PDF CMBA024949 CMBA024949 UL94-V0) 15x15 BGA 15X15 T725

    PRBG1296FA-A

    Abstract: No abstract text available
    Text: RENESAS Code PRBG1296FA-A Previous Code 1296F7K D 1 b ZD A1 S AB AT AR AP AN AM AL AK AJ AH AG AF AE AD AC AB AA Y W V U T R P N M L K J H G F E D C B A C y S 3 Index mark e e 3C B A E1 E A D1 MASS[Typ.] 13.0g S ZE JEITA Package Code P-HBGA1296-37.5x37.5-1.00


    Original     		PDF PRBG1296FA-A 1296F7K P-HBGA1296-37 PRBG1296FA-A

    FP4451

    Abstract: Theta JB hysol adhesive JC15-1 698-100AB DCDA37480-M014-001 G38-87 R1004 304-TBGA Aavid Thermalloy cold plate
    Text: Freescale Semiconductor, Inc. Thermal Measurement Report Freescale Semiconductor, Inc. Package Description: DATE: 7/10/1998 Revised 7/31/98 Package: 480 37.5x37.5 mm TBGA 29 x 29 Array Case: 1152-01 Frame: ASAT Drawing Nbr. E04480002-0-50 DCDA37480-M014-001


    Original     		PDF E04480002-0-50 DCDA37480-M014-001) R1004 FP4451 G38-87 21426-ICB 35x35 FP4451 Theta JB hysol adhesive JC15-1 698-100AB DCDA37480-M014-001 R1004 304-TBGA Aavid Thermalloy cold plate

    PRBG1296FB-A

    Abstract: No abstract text available
    Text: JEITA Package Code P-HBGA1296-37.5x37.5-1.00 RENESAS Code PRBG1296FB-A Previous Code 1296F7M D Under development 1 A A ZD b A1 e S AB AT AP AM AK AH AF AD AB Y V T P M K H F D B ZE AR AN AL AJ AG AE AC AA W U R N L J G E C A E1 E e 3C D1 B MASS[Typ.] 16.0g


    Original     		PDF P-HBGA1296-37 PRBG1296FB-A 1296F7M PRBG1296FB-A

    Untitled

    Abstract: No abstract text available
    Text: Version 1.6 2007 Features ƒ ƒ PEX 8548 General Features o 48-lane PCI Express switch - Integrated SerDes o Up to nine configurable ports x1, x2, x4, x8, x16 o 27mmx27mm, 686-ball PBGA package o 37.5mm x 37.5mm, 736-ball PBGA package o Typical Power: 4.9 Watts


    Original     		PDF 48-lane, PEX8548-SIL-PB-P1-1

    broadcom BCM 4360

    Abstract: broadcom BCM 4331 bcm 4330 programming Guide MPC8360ERM broadcom BCM 4335 BCM 4331 Broadcom BCM 4341 BCM 4334 lcd ibm pinout bcm 4339
    Text: MPC8360E PowerQUICC II Pro Integrated Communications Processor Family Reference Manual MPC8360ERM Rev. 2 05/2007 How to Reach Us: Home Page: www.freescale.com email: support@freescale.com USA/Europe or Locations Not Listed: Freescale Semiconductor Technical Information Center, CH370


    Original     		PDF MPC8360E MPC8360ERM CH370 IEEE1588 MPC8358E broadcom BCM 4360 broadcom BCM 4331 bcm 4330 programming Guide broadcom BCM 4335 BCM 4331 Broadcom BCM 4341 BCM 4334 lcd ibm pinout bcm 4339

    digital multimeter diagram

    Abstract: Motorola multimeter 2625 application note of digital multimeter multimeter probes MPC8260 digital multimeter circuit
    Text: Freescale Semiconductor, Inc. Application Note AN2271/D Rev. 0, 3/2002 Freescale Semiconductor, Inc. MPC8260 PowerQUICC II Thermal Resistor Guide The MPC8260 PowerQUICC II™ is a highly integrated device with an advanced communication processor CPM , on board SRAM, DMA and a G2 core. The package for the


    Original     		PDF AN2271/D MPC8260 digital multimeter diagram Motorola multimeter 2625 application note of digital multimeter multimeter probes digital multimeter circuit

    motorola mc 1563

    Abstract: MBX860 MPC8270ZUUPE MPC8270CZUQLD bsdl of 8270 MPC8270ZQ PBGA 256 reflow profile MPC823 user manual SBC8260 MPC8270CZQMIBA
    Text: Freescale Semiconductor, Inc. Technical Data MPC8280EC Rev. 1.0, 2/2004 Freescale Semiconductor, Inc. MPC8280 PowerQUICC II Family Hardware Specifications This document contains detailed information about power considerations, DC/AC electrical characteristics, and AC timing specifications for .13µm HiP7 members of the


    Original     		PDF MPC8280EC MPC8280 MPC8280, MPC8275, MPC8270 MPC8280' MPC9850 MPC9850 MPC9855 MPC9855 motorola mc 1563 MBX860 MPC8270ZUUPE MPC8270CZUQLD bsdl of 8270 MPC8270ZQ PBGA 256 reflow profile MPC823 user manual SBC8260 MPC8270CZQMIBA

    htc hd2 schematic

    Abstract: max1987 rG82855GM FW82801DBM RG82855 asus crb input voltage point lcd inverter board schematic TL494 ASUS sir s4 105a *6jk3
    Text: 5 4 3 2 1 FILE LIST THERMAL A3/A6 BLOCK DIAGRAM D 05 POWER IMVP4 BANIAS 24.5W FAN 35 03 37 38 39 40 41 42 43 44 45 04 PSB C North Bridge DDR A3N 855GM 266 A3L 852GM 266 CPU Celeron/ Banias/ Dothan(400) Celeron/ Banias/ Dothan(400) Celeron/ Banias/ Dothan(400)


    Original     		PDF 855GM 852GM 855GM/GME 852GM/GMV/GME 855GME 852GME 852GMV ATA100 htc hd2 schematic max1987 rG82855GM FW82801DBM RG82855 asus crb input voltage point lcd inverter board schematic TL494 ASUS sir s4 105a *6jk3

    AR5212

    Abstract: ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516
    Text: 7 Schematic Diagrams and PCB Silkscreen 7-1 MAIN BOARD 7-1-1 Schematic Diagrams X05 7-1 This Document can not be used without Samsung’s authorization. 7 Schematic Diagrams and PCB Silkscreen 7-1-1 a Main Board Schematic Sheet 2 of 40(Operation Block Diagram)


    Original     		PDF ISL6225VCC AR5212 ar5312 diode 39b2 AR5112 AR5213 AR5211 st c739 FD507 U508-3 AR533 Ct516

    RG82855GME

    Abstract: Intel RG82855GME SIO-ITE8705 asus ELECTROLYTIC CAPACITOR 330uF 63V CT 9 ITE8705 78L12 LM358ADR2 tl494 KBC-M38857
    Text: 5 4 3 2 1 FILE LIST D 01_BLOCK DIAGRAM CLOCK GEN A6G BLOCK DIAGRAM ICS 950815 POWER IMVP4 Page 23 Page 43,44,45,46,47,48,49,50 CPU THERMAL SENSOR BANIAS 24.5W Page 5 VGA POWER Page 3,4 PSB VRAM *4 Page 15,16 LVDS LCD DDR TERMINATION NORTH BRIDGE Page 17


    Original     		PDF M11-P 855GME ALC650 R5C593 RTL81ness ohm/0603 ohm/0805 RG82855GME Intel RG82855GME SIO-ITE8705 asus ELECTROLYTIC CAPACITOR 330uF 63V CT 9 ITE8705 78L12 LM358ADR2 tl494 KBC-M38857

    max1987

    Abstract: US015 LM393 MDC ICH4 CPAR-A13 LM339 1u235 13LVDS 0603 104P CE34
    Text: A B C D E FILE LIST 1 CARMEL LED BOARD THERMAL CLOCK GEN 05 34 BANIAS FAN Block Diagram 32 03 31 POWER IMVP4 04 35 POWER ON/OFF CKTS 41 33 PSB 2 26 13 LVDS LCD MCHM MONTARA -GM RGB 14 IO BOARD CRT 06 3 DC-DC JACK LAN PHY USB PORT MIC OP AC97 08 12 DDR DDR


    Original     		PDF SI3456DV 2N7002 104P/X7R 100K/? max1987 US015 LM393 MDC ICH4 CPAR-A13 LM339 1u235 13LVDS 0603 104P CE34

    multimeter probes

    Abstract: MPC8260 digital multimeter diagram digital multimeter circuit AN2271
    Text: Freescale Semiconductor Application Note AN2271/D Rev. 0, 3/2002 Freescale Semiconductor, Inc. MPC8260 PowerQUICC II Thermal Resistor Guide The MPC8260 PowerQUICC II™ is a highly integrated device with an advanced communication processor CPM , on board SRAM, DMA and a G2 core. The package for the


    Original     		PDF AN2271/D MPC8260 multimeter probes digital multimeter diagram digital multimeter circuit AN2271

    SKIIP 33 nec 125 t2

    Abstract: skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302
    Text: Discontinued and Superseded Stock Number History. This document contains Discontinued and Superseded Stock Number History. The information is listed in the following format: Stock Number: The original RS Stock Number of the item. Brief Description: The Invoice Description of the item.


    Original     		PDF 734TL UWEB-MODEM-34 HCS412/WM TLV320AIC10IPFB 100MB NEON250 GA-60XM7E BLK32X40 BLK32X42 SKIIP 33 nec 125 t2 skiip 613 gb 123 ct RBS 6302 ericsson SKIIP 513 gb 173 ct THERMISTOR ml TDK 150M pioneer PAL 010a Project Report of smoke alarm using IC 555 doc SKiip 83 EC 125 T1 ericsson RBS 6000 series INSTALLATION MANUAL Ericsson Installation guide for RBS 6302

    AC-27621

    Abstract: 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842
    Text: NP276 Series Open Top Ball Grid Array (BGA, 1.27mm Pitch) Specifications Part Number (Details) 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 30m Ω max. at 10mA/20mV max. Contact Resistance: Operating Temperature Range: –55°C to +150°C


    Original     		PDF NP276 10mA/20mV NP276 45x45 NP276-110522 AC-15751 AC-17393 AC-27621 28 pin zif socket 1.27mm pitch AC-22621 AC-28411 bga 576 socket NP276-40037 DD-20 NP276-11904-3 AC-03140 AC-22842

    socket 1155

    Abstract: 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294
    Text: NP352 Series Open Top Fine Ball Grid Array (FBGA, 1.00mm Pitch) Part Number (Details) Specifications NP352 - 560 1,000MΩ min. at 100V DC Insulation Resistance: Dielectric Withstanding Voltage: 100V AC for 1 minute 100m Ω max. at 10mA/20mV max. Contact Resistance:


    Original     		PDF NP352 10mA/20mV NP352-1600-54-* NP352-160018 45x45 NP352-1849-35 NP352-106426 socket 1155 1155 socket NP352-676-103 NP352-76814 45x45 mm bga X2933 35x35 bga 45x45 bga NP352-103 ac294

    BGA676

    Abstract: BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X
    Text: Ironwood Electronics Appendix A AP-A.1 APPENDIX A • BGA Chip Package Specification Tables . . . . . . . .page AP.2 thru AP.16 • LGA Chip Package Specification Table . . . . . . . . . . . . . . . . .page AP.17 • MLF Package Specification Table . . . . . . . . . . . . . . . . . . . . .page AP.18


    Original     		PDF BGA16A1ATTERNS BGA676 BGA665 BGA-1156 156 QFN 12X12 LGA240 BGA-783 BGA441 BGA1024 BGA1521 7286X

    pcb warpage in ipc standard

    Abstract: IPC-9701A SAC405 IPC-9702 BGA PACKAGE thermal resistance Freescale ipc 9702 945 motherboard circuit semiconductor cross reference "IPC 1752" gold SAC387
    Text: Q2, 2010 Flip Chip Plastic Ball Grid Array FC-PBGA Application Note Freescale and the Freescale logo are trademarks of Freescale Semiconductor, Inc., Reg. U.S. Pat. & Tm Off. All other product or service names are the property of their respective owners. 2010 Freescale Semiconductor, Inc.


    Original     		PDF

    fcBGA PACKAGE thermal resistance

    Abstract: FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise
    Text: FCBGA Flip Chip Ball Grid Array "Leading Future PKG Technology" NEC FCBGA Contents 1. What is an FCBGA? . 3 2. Advantages . 4 3. Line up . 5


    Original     		PDF C13902EJ1V0PF00 fcBGA PACKAGE thermal resistance FCBGA 676 BGA package tray QFP PACKAGE thermal resistance FC-BGA 1mm pitch BGA socket PEAK tray drawing nec shipping method reball tray sunrise