block diagram 8 bit booth multiplier
Abstract: 4kx4 ram ProASIC3 AC323 32 bit adder brent kung adder A500K hamming code FPGA sense amplifier bitline memory device
Text: Application Note AC323 Dynamic Power Reduction in Flash FPGAs Introduction Due to the dramatic increase in portable and battery-operated applications, lower power consumption has become a necessity in order to prolong battery life. Power consumption is an important part of the
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AC323
block diagram 8 bit booth multiplier
4kx4 ram
ProASIC3
AC323
32 bit adder
brent kung adder
A500K
hamming code FPGA
sense amplifier bitline memory device
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4kx4 ram
Abstract: AC323 A500K wallace tree multiplier
Text: Application Note AC323 Dynamic Power Reduction in Flash FPGAs Introduction Due to the dramatic increase in portable and battery-operated applications, lower power consumption has become a necessity in order to prolong battery life. Power consumption is an important part of the
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AC323
4kx4 ram
AC323
A500K
wallace tree multiplier
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sje 607
Abstract: SUNYO hamming code FPGA IGLOO2 COOLRUNNER-II examples 8-bit brentkung adder
Text: Power-Aware FPGA Design by Hichem Belhadj, Vishal Aggrawal, Ajay Pradhan, and Amal Zerrouki February 2009 Abstract . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
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QPSK using xilinx
Abstract: cable tv using internet block Diagram ofdm modem chip encoder OFDM BY XILINX satellite modem FPGA PQ208 pb sram 256x16* STATIC RAM "Western Digital" pci standards Tv set top BOX Diagram
Text: Spartan-II FPGAs in Set-Top Boxes - Customer Tutorial April 2000 File Number Here Agenda Introduction Market Overview Spartan-II Set-Top Box Solutions Programmable ASSP Summary Xilinx at Work in Hot New Technologies ® www.xilinx.com Overview Xilinx - The Industry Leader in FPGAs/CPLDs
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256x16* STATIC RAM
Abstract: AZ 280 memory 4Kx4 rom DS234
Text: Single-Port Block Memory v5.0 DS234 v0.1 November 1, 2002 Product Specification Features • Fully synchronous drop-in module for Virtex , Virtex-II, Virtex-II Pro™, Spartan™-II, Spartan-IIE, and Spartan-3 FPGAs • Supports all three Virtex-II write mode options:
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DS234
xcv800
xcv1000
xcv50E
xcv100E
xcv200E
xcv300R
xcv400E
xcv600E
xcv1000E
256x16* STATIC RAM
AZ 280 memory
4Kx4 rom
DS234
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8kx1 RAM
Abstract: 8kx1
Text: Application Note Axcelerator Family Memory Blocks I n tro du ct i on blocks in each device depends on the number of core tiles. For example, in an AX125 device with a single core tile, the number of available memory blocks is 4, while the AX500, with four core tiles, has 16 memory blocks. Note that the
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AX125)
AX2000)
128x36,
256x18,
512x9,
8kx1 RAM
8kx1
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8kx1 RAM
Abstract: AX125 AX2000 AC164
Text: Application Note AC164 Axcelerator Family Memory Blocks I n tro du ct i on blocks in each device depends on the number of core tiles. For example, in an AX125 device with a single core tile, the number of available memory blocks is 4, while the AX500, with four core tiles, has 16 memory blocks. Note that the
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AC164
AX125
AX500,
AX250
AX125)
AX2000)
8kx1 RAM
AX2000
AC164
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256x16* STATIC RAM
Abstract: 32Kx1 false RAMB16 XC2S100 XC2S15 XC2S150 XC2S200 XC2S30 XC2S50
Text: Single-Port Block Memory Core v6.2 DS234 April 28, 2005 Features • Fully synchronous drop-in module for Virtex , Virtex-II, Virtex-II Pro, Virtex-4, Spartan™-II, Spartan-IIE, Spartan-3, and Spartan-3E FPGAs • Supports all three Virtex-II write mode options:
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DS234
256x16* STATIC RAM
32Kx1
false
RAMB16
XC2S100
XC2S15
XC2S150
XC2S200
XC2S30
XC2S50
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Untitled
Abstract: No abstract text available
Text: Dual-Port Block Memory v5.0 DS235 v0.1 November 1, 2002 Product Specification Features • Drop-in module for Virtex , Virtex-E, Virtex-II, Virtex-II Pro™, Spartan™-II, Spartan-IIE, and Spartan-3 FPGAs • Supports all three Virtex-II write mode options:
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DS235
xcv50E
xcv100E
xcv200E
xcv300R
xcv400E
xcv600E
xcv1000E
xcv1600E
xcv2000E
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K4505
Abstract: 1601l 4Kx4 SRAM MK48T87B Z30A SRAM 2kx8 sram IMS1630 256KX1 MK41S80
Text: ALPHANUMERICAL INDEX unless otherwise specified all Static RAMs listed are produced in CMOS technology Part Nuraöer Organization 4Kx1 IMS1203 ( 4Kx1 IMS1203M , 1Kx4 IMS1223 1Kx4 IMS1223M ' 16Kx1 IMS1400M 16Kx1 IMS1403 ' IMS1403M/LM f 16Kx1 IM S1420M A 4Kx4
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IMS1203
IMS1203M
IMS1223
IMS1223M
16Kx1
IMS1400M
IMS1403
IMS1403M/LM
K4505
1601l
4Kx4 SRAM
MK48T87B
Z30A
SRAM
2kx8 sram
IMS1630
256KX1
MK41S80
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4kx1 static ram
Abstract: MS1203 IMS1203A-25M IMS1203M IMS1203M-25 IMS1203M-2S IMS1203M-35 IMS1203M-45 1203M
Text: IM S 1 2 0 3 M CMOS High Performance 4K x 1 Static RAM MIL-STD-883C DESCRIPTION FEATURES The INMOS IMS1203M is a high speed CMOS 4Kx1 static RAM processed in full compliance to MIL-STD883C. The IMS1203M provides performance enhance ments with the additional CMOS benefits of lower power
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IMS1203M
MIL-STD-883C
18-Pin,
300-mil
IMS1203M
MIL-STD-883C.
1203S-25M
IMS1203A-25M
4kx1 static ram
MS1203
IMS1203A-25M
IMS1203M-25
IMS1203M-2S
IMS1203M-35
IMS1203M-45
1203M
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A1t smd
Abstract: IMS1203M sei smd resistors IMS1203A-25M IMS1203M-2S IMS1203M-35 IMS1203M-45 IMS1203S-25M IMS1203S-35M ceramic pin grid array package lead finish gold
Text: IMS1203M CMOS High Performance 4K x 1 Static RAM MIL-STD-883C ÏTüTIOS* D ESCR IPTIO N FE A TU R ES The IN M O S IM S 1203M is a high speed C M O S 4Kx1 static RAM processed in full compliance to MIL-STD883C . The IM S1203M provides performance enhance
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IMS1203M
MIL-STD-883C
18-Pin,
300-mii
MIL-STD-883C
IMS1203M
254mm
A1t smd
sei smd resistors
IMS1203A-25M
IMS1203M-2S
IMS1203M-35
IMS1203M-45
IMS1203S-25M
IMS1203S-35M
ceramic pin grid array package lead finish gold
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Untitled
Abstract: No abstract text available
Text: Emm semi FEA TU R E S • Single +5V Power Supply ■ 4Kx1 Organization ■ Replaces 41024x1 Static RAMs ■ Completely Static—No Clocks or Refresh ■ 18 Pin Package ■ Access/Cycle Times As Low As 400 nsec max ■ 250 mw Typical Operating Power ■ Separate Data In and Data Out
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41024x1
Number4801
40961-bit
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Untitled
Abstract: No abstract text available
Text: STATIC CMOS RAMs, COMMERCIAL AND INDUSTRIAL TEMPERATURE RANGE DESCRIPTION PART TAA ns PACKAGES/PINS SIZE NUMBER P J S PP 22 P93U422 35 24 256x4 1K P4C422 22 10/12/15/25/35 24 256x4 1K P4C147 18 10/12/15/20/25 4Kx1 w/Separate I/O 4K P4C148 18 10/12/15/20/25
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P93U422
256x4
P4C422
P4C147
P4C148
P4C149
P4C150
P4C168
P4C169
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Z80A CPU
Abstract: Z80A-CTC z80a-PIO 2316E 4027 ram Z80A Z80A-CPU z80 pio Z80 RAM 1024x1 static ram
Text: MOS INTEGRATED CIRCUITS continued POWER TEMP. RANGE (°C) RAM 1024x1 bit static 2 5 - 0.25 2.2 2.2 33 - 0-70 D IP K, M M 2316E •ROM 2Kx8 bit 2 5 - 0.45 2.2 2.2 40 - 0-70 DIP R, U M 2704 PROM 512x8 bit 5 5 12 0.45 2.2 2.2 - - 0-70 D IP J M 2708 PROM 1Kx8 bit
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1024x1
2316E
512x8
4096x1
Z80/Z80A
Z80A CPU
Z80A-CTC
z80a-PIO
2316E
4027 ram
Z80A
Z80A-CPU
z80 pio
Z80 RAM
1024x1 static ram
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synchronous sram
Abstract: 4Kx1 DRAM SRAM 6T SRAM DRAM 64kx16 edi8832
Text: ^EDI_ Electronic DMlgrw Inc. ^ by Part Number _ _ _ Part No. Tvoe Density Ora EDH816H64C EDI2018QC EDI20181C EDI20182C EDI20183C EDI20184C EDI20185C EDI2040C EDI2041C EDI2042C SRAM Module Synchronous SRAM, Latched I/O, 1CLK Synchronous SRAM, Registered I/O, 1CLK
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EDH816H64C
EDI2018QC
EDI20181C
EDI20182C
EDI20183C
EDI20184C
EDI20185C
EDI2040C
EDI2041C
EDI2042C
synchronous sram
4Kx1 DRAM
SRAM 6T
SRAM
DRAM 64kx16
edi8832
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dram zip 256kx16
Abstract: I8833C
Text: Electronic Design* Inc. Table of Contents Page Letter from the Table o f Contents . 2
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Untitled
Abstract: No abstract text available
Text: IMS1203 CMOS High Performance 4K x 1 Static RAM irnos DESCRIPTION FEATURES INMOS' Very High Speed CMOS Advanced Process -1 .6 Micron Design Rules 4K x 1 Bit Organization 25, 35, and 45 nsec Access Times 25, 35, and 45 nsec Chip Enable Access Times Fully TTL Compatible
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IMS1203
300-mil
IMS1203
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MKB6116
Abstract: MKB4501 IMS1630 RAM MK6116 MK48Z18BU IMS1420 MK48Z02BU
Text: SELECTION GUIDE ZEROPOW ERS ORGANISATION DESCRIPTION PART NUMBER ICCma SPEEDns ACTIVE TTL mA@ns STBY CMOS STBY VCC TEMP RANGE PACKAGE -2 K X 8 MK48Z02 120,150,200,250 90 3 1 5V + 10 -5% 0 to + 70°C P DIP 24 -2 K X 8 UL-CERTIFIED MK48Z02BU 120,150,200,250
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32KX8
MK48Z32
MK48Z30A
MK48Z30
MK48Z19BU
MK46Z19
MK48Z09BU
MK48Z02
MK48Z02BU
MK48Z12
MKB6116
MKB4501
IMS1630
RAM MK6116
MK48Z18BU
IMS1420
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IMS1203M
Abstract: IMS1203P-25 IMS1203P-35 IMS1203S-25 IMS1203P-45
Text: IMS1203 CMOS High Performance 4K x 1 Static RAM m o s DESCRIPTION FEATURES INMOS' Very High Speed CMOS Advanced Process - 1.6 Micron Design Rules 4K x 1 Bit Organization 25, 35, and 45 nsec Access Times 25, 35, and 45 nsec Chip Enable Access Times Fully TTL Compatible
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IMS1203
300-mil
IMS1203
IMS1203M
IMS1203P-25
IMS1203P-35
IMS1203S-25
IMS1203P-45
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64kx4 DRAM
Abstract: SRAM 6T PS-136 4Kx1 DRAM EDI8F8512LP MILITARY 4Kx1 SRAM 5962-89598 EDI8833LP 32kx8 bit low power cmos sram edi84256
Text: EDI8833C/LP/P ^E D I Electronic Designs Inc. High Speed 256K Monolithic SRAM 32Kx8 Static RAM CMOS, Monolithic u m m Features The EDI8833C/LP/P is a high speed, high perform ance, low power, 262,144bit C M O S Static R A M orga 32Kx8 bit C M O S Static
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EDI8833C/LP/P
32Kx8
EDI8833C/LP/P
144bit
32Kx8.
MIL-STD-883,
64Kx4
EDI8466CB.
256Kx1
EDI81256C/LP/P.
64kx4 DRAM
SRAM 6T
PS-136
4Kx1 DRAM
EDI8F8512LP MILITARY
4Kx1 SRAM
5962-89598
EDI8833LP
32kx8 bit low power cmos sram
edi84256
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Untitled
Abstract: No abstract text available
Text: IMS1203M CMOS High Performance 4K x 1 Static RAM MIL-STD-883C 17103« FEATURES DESCRIPTION • INMOS'Very High Speed CMOS • Advanced Process -1.6 Micron Design Rules •Specifications guaranteed over full military temperature range -55° C to + 125“ C
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IMS1203M
MIL-STD-883C
18-Pin,
300-mil
IMS1203M
MIL-STD883C.
254mm
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4kx1 static ram
Abstract: MS-1203 S1203
Text: „ I M : •■■■■■Si ■■■■ Mm OS* cmos High Performance 4K x 1 Static RAM MIL-STD-883C FEA TU R E S D E SCR IPTIO N • IN M O S' Very High Speed C M OS • Advanced Process - 1.6 Micron Design Rules • Specifications guaranteed over full military
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18-Pin,
300-mil
MIL-STD-883C
1203M
IL-STD883C
S1203M
a203M
254mm
4kx1 static ram
MS-1203
S1203
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Untitled
Abstract: No abstract text available
Text: IMS1203 CMOS High Performance 4K x 1 Static RAM mos FEATURES • • • • • • • • • • • DESCRIPTION INMOS' Very High Speed CMOS Advanced Process -1 .6 Micron Design Rules 4 K x 1 Bit Organization 25, 35, and 45 nsec Access Times 25, 35, and 45 nsec Chip Enable Access Times
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IMS1203
300-mil
IMS1203
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