Untitled
Abstract: No abstract text available
Text: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; A B D SOT1190-1 ball A1 index area E A A2 A1 detail X e1 e C C A B C Æv Æw b 1/2 e y y1 C M L K J e H G e2 F 1/2 e E D C B A ball A1 index area 1 2 3 4 5 6 7 8 9 10 11 12
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LFBGA144:
OT1190-1
sot1190-1
MO-205
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e y1 C ∅v M C A B b y ∅w M C N M L K e J H e2 G F E D C B A ball A1 index area
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LFBGA144:
OT644-1
MO-205
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Untitled
Abstract: No abstract text available
Text: PC board footprint Philips Semiconductors Footprint information for reflow soldering of LFBGA144 package SOT644-1 Hx P P Hy see detail X Generic footprint pattern Refer to the package outline drawing for actual layout solder land solder paste deposit solder land plus solder paste
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LFBGA144
OT644-1
OT644-1
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sot512
Abstract: LFBGA-144
Text: PDF: 1999 Jun 09 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 10 x 10 x 1.05 mm SOT512-1 D ball A1 index area A2 A E A1 detail X A b e ∅w M ZD y v A M ZE L K J H e G F E D C B A
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LFBGA144:
OT512-1
sot512
LFBGA-144
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Untitled
Abstract: No abstract text available
Text: P-LFBGA144-1313-0.80 Unit in millimeters typ., unless otherwise specified. Semiconductor Please consult OKI for soldering, assembly and storage recommendations. Specification are subject to change without notice. The drawings do not substitute or replace a product’s datasheet or the Package Information Databook.
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P-LFBGA144-1313-0
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Untitled
Abstract: No abstract text available
Text: P-LFBGA144-1111-0.80 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.3 TYP. 1/Aug.25,1999
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P-LFBGA144-1111-0
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Untitled
Abstract: No abstract text available
Text: Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; A B D SOT1190-2 ball A1 index area A E A2 A1 detail X e1 e ∅v ∅w b 1/2 e C C A B C y y1 C M L K J e H G e2 F 1/2 e E D C B A ball A1 index area 1 2 3 4 5 6 7 8
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LFBGA144:
OT1190-2
sot1190-2
MO-205
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LQFP64 reel size
Abstract: STA2058 STA5620 LFBGA144 teseo teseo 2 data output LQFP64 STA2058EX timer2 A2F4
Text: STA2058 TESEO GPS platform high-sensitivity baseband Data Brief Features • Single chip baseband with embedded Flash ■ Complete embedded memory system: – Flash 256 KB +16 Kbytes – RAM 64 Kbytes LQFP64 LFBGA144 ■ 66 MHz ARM7TDMI 32 bit processor
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STA2058
LQFP64
LFBGA144
STA2058
25x25mm)
LQFP64 reel size
STA5620
LFBGA144
teseo
teseo 2 data output
LQFP64
STA2058EX
timer2
A2F4
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Untitled
Abstract: No abstract text available
Text: P-LFBGA144-1111-0.80 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.30 TYP. 1/Aug. 25, 1999
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P-LFBGA144-1111-0
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LFBGA144
Abstract: MO-205 sot644
Text: PDF: 2000 Oct 17 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.90 mm SOT644-1 B D A ball A1 index area A E A2 A1 detail X C e1 v M B b e y y1 C ∅w M v M A N M L e K J
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LFBGA144:
OT644-1
GA144:
MO-205
LFBGA144
MO-205
sot644
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Untitled
Abstract: No abstract text available
Text: STA2058 TESEO GPS platform high-sensitivity baseband Data Brief Features • Single chip baseband with embedded Flash ■ Complete embedded memory system: – Flash 256 KB +16 Kbytes – RAM 64 Kbytes LQFP64 LFBGA144 ■ 66 MHz ARM7TDMI 32 bit processor
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STA2058
LQFP64
LFBGA144
STA2058
25x25mm)
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LFBGA144
Abstract: MO-205
Text: PDF: 2003 Feb 18 Philips Semiconductors Package outline LFBGA144: plastic low profile fine-pitch ball grid array package; 144 balls; body 12 x 12 x 0.9 mm A B D SOT644-1 ball A1 index area A E A2 A1 detail X C e1 e ∅v M C A B b y1 C y ∅w M C N M L K e
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LFBGA144:
OT644-1
OT64grid
MO-205
LFBGA144
MO-205
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Untitled
Abstract: No abstract text available
Text: P-LFBGA144-1313-0.80 Mirror finish Package material Ball material Pin treatment Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb Solder plating( 5 m) 0.40 TYP. 1/Jun.23,1998
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P-LFBGA144-1313-0
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Untitled
Abstract: No abstract text available
Text: P-LFBGA144-1111-0.80 5 パッケージ材質 ボール材質 パッケージ質量 g 版数/改版日 エポキシ樹脂 Sn/Pb 0.30 TYP. 1 版/99.8.25
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P-LFBGA144-1111-0
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Untitled
Abstract: No abstract text available
Text: P-LFBGA144-1313-0.80 Mirror finish 5 Package material Ball material Package weight g Rev. No./Last Revised Epoxy resin Sn/Pb 0.40 TYP. 1/Jun. 23, 1998
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P-LFBGA144-1313-0
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AT91SAM3U4
Abstract: at91sam3 1N1308 MAR 735 REGULATOR IC 7912 pin identify AT91SAM3U4E SAM3u1 AT91SAM3U 3961 G.E 0x20180
Text: Features • Core • • • • • • – ARM Cortex®-M3 revision 2.0 running at up to 96 MHz – Memory Protection Unit MPU – Thumb®-2 instruction set Memories – From 64 to 256 Kbytes embedded Flash, 128-bit wide access, memory accelerator,
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128-bit
6430F
21-Feb-12
AT91SAM3U4
at91sam3
1N1308
MAR 735
REGULATOR IC 7912 pin identify
AT91SAM3U4E
SAM3u1
AT91SAM3U
3961 G.E
0x20180
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STM32W108
Abstract: stm32f103 DAC STM8L151 PROGRAMMER FOR STM32F103 stm32f107 stm32f103 spi stm32f105 STM32 PWM output developer kit ST10F273 programmer schematic STM32-PRIMER2
Text: 62 7x 10 M32 M8 R7 R9 * E T P F,C F ROM no character EPROM OTP FastROM Flash Version code ST6 ST7 ST10 STM32 STM8 STR7 STR9 Family STM32 Y F E G K L D H J S C N AR R M V W Z 16 pins 20 pins 24 pins 28 pins 32 pins 34 pins 38 pins 40 pins 42 pins 44 pins
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STM32
10x10)
14x14)
32-bit
SGMICRO0909
STM32W108
stm32f103 DAC
STM8L151
PROGRAMMER FOR STM32F103
stm32f107
stm32f103 spi
stm32f105
STM32 PWM output developer kit
ST10F273 programmer schematic
STM32-PRIMER2
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STM32F103xC
Abstract: STM32F103xC ADC1 CF 4093 N STM32F103xC boot STM32F103Rx STM32F103xE STM32F103xx STM32F103VC g717 stm32f103ve
Text: STM32F103xC STM32F103xD STM32F103xE High-density performance line ARM-based 32-bit MCU with 256 to 512KB Flash, USB, CAN, 11 timers, 3 ADCs, 13 communication interfaces Features FBGA • Core: ARM 32-bit Cortex -M3 CPU – 72 MHz maximum frequency, 1.25 DMIPS/MHz Dhrystone 2.1
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STM32F103xC
STM32F103xD
STM32F103xE
32-bit
512KB
STM32F103xC ADC1
CF 4093 N
STM32F103xC boot
STM32F103Rx
STM32F103xE
STM32F103xx
STM32F103VC
g717
stm32f103ve
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Untitled
Abstract: No abstract text available
Text: BGA, HBGA, LFBGA & TFBGA FOOTPRINT REFLOW SOLDERING Philips Semiconductors F Prow ∅C Pball G Prow Pball MBL179 Reflow soldering(1) FOOTPRINT DIMENSIONS (mm) Prow Pball dia C F G PLACEMENT ACCURACY BGA156 SOT472-1 1.00 1.00 0.50 0.45 15.30 15.30 ±0.10
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MBL179
BGA156
OT472-1
BGA256
OT466-1
OT471-1
BGA292
OT489-1
BGA316
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arm stm32 f103
Abstract: stm32f103z STM32F103VG STM32F103VF STM32F103ZG stm32f103xg stm32 f103 100 pin STM32F103Rx LQFP100 LQFP144
Text: STM32F103xF STM32F103xG XL-density performance line ARM-based 32-bit MCU with 768 KB to 1 MB Flash, USB, CAN, 17 timers, 3 ADCs, 13 communication interfaces Preliminary data Features FBGA • Core: ARM 32-bit Cortex -M3 CPU with MPU – 72 MHz maximum frequency,
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STM32F103xF
STM32F103xG
32-bit
arm stm32 f103
stm32f103z
STM32F103VG
STM32F103VF
STM32F103ZG
stm32f103xg
stm32 f103 100 pin
STM32F103Rx
LQFP100
LQFP144
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Untitled
Abstract: No abstract text available
Text: STR71xFxx STR710RZ ARM7TDMI 32-bit MCU with Flash, USB, CAN, 5 timers, ADC, 10 communication interfaces Features • ■ Core – ARM7TDMI 32-bit RISC CPU – 59 MIPS @ 66 MHz from SRAM – 45 MIPS @ 50 MHz from Flash LQFP64 10 x 10 Memories – Up to 256 Kbytes Flash program memory
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STR71xFxx
STR710RZ
32-bit
LQFP64
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STM32F20xxx reference manual
Abstract: No abstract text available
Text: STM32F205xx STM32F207xx ARM-based 32-bit MCU, 150DMIPs, up to 1 MB Flash/128+4KB RAM, USB OTG HS/FS, Ethernet, 17 TIMs, 3 ADCs, 15 comm. interfaces & camera Datasheet - production data Features &"'! • Core: ARM 32-bit Cortex -M3 CPU 120 MHz max with Adaptive real-time accelerator (ART
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STM32F205xx
STM32F207xx
32-bit
150DMIPs,
Flash/128
DocID15818
STM32F20xxx reference manual
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STM32F103VC
Abstract: STM32F103RC STM32F103xE STM32F10* I2C errata 548-72 STM32F103ZD USART STM32F101RC STM32F101RD stm32f103ve errata
Text: STM32F101xC/D/E and STM32F103xC/D/E Errata sheet STM32F101xC/D/E and STM32F103xC/D/E high-density device limitations Silicon identification This errata sheet applies to the revisions Z and Y of the STMicroelectronics STM32F101xC/D/E access line and STM32F103xC/D/E performance line high-density
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STM32F101xC/D/E
STM32F103xC/D/E
STM32F103xC/D/E
32-bit
STM32F103VC
STM32F103RC
STM32F103xE
STM32F10* I2C errata
548-72
STM32F103ZD
USART
STM32F101RC
STM32F101RD
stm32f103ve errata
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ARM7TDMI System Peripherals
Abstract: program key lock ic 4013 154WA SAM7SE512 at91sam7sexx
Text: Features • Incorporates the ARM7TDMI ARM® Thumb® Processor • • • • • • • • • • • – High-performance 32-bit RISC Architecture – High-density 16-bit Instruction Set – Leader in MIPS/Watt – EmbeddedICE In-circuit Emulation, Debug Communication Channel Support
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32-bit
16-bit
SAM7SE512)
SAM7SE256)
SAM7SE32)
6222H
25-Jan-12
SAM7SE512/256/32
ARM7TDMI System Peripherals
program key lock ic 4013
154WA
SAM7SE512
at91sam7sexx
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